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TMS320C6204ZWT200

Texas Instruments

TMS320C6204ZWT200 by Texas Instruments

TMS320C6204ZWT200 by Texas Instruments is a 32-bit DSP with 288 terminals, operating at max 200 MHz. It features integrated cache, 8-bit on-chip data RAM, and a low power mode. Ideal for digital signal processing applications requiring high-speed performance in a compact form factor.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 5,485 parts In-Stock

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Digiode

USA . 2,902 parts In-Stock

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2,902

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Distributors (Availability)

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AZTECH Wire

Italy . 571 parts In-Stock

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$16.946

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One Stop Electronics

USA . 837 parts In-Stock

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$17.000

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Microchip USA

USA . 1,243 parts In-Stock

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$24.360

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$24.010

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$23.840

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$23.660

1,243

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$24.010

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$23.660

Parana Technologies

USA . 314 parts In-Stock

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$40.208

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ChromeModa Solutions

Germany . 4,989 parts In-Stock

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$45.177

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$37.045

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IDEA Electronic Components Group

UK . 76 parts In-Stock

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$45.177

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$42.918

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$40.659

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76

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Corohmni

South Africa . 2,934 parts In-Stock

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$77.104

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DigiPath Technology Company

USA . 322 parts In-Stock

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$40.732

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Corphita

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Overview

Experience unparalleled performance and efficiency with the TMS320C6204ZWT200 by Texas Instruments. As a leading manufacturer in the field of Digital Signal Processors, Texas Instruments delivers cutting-edge technology that ensures top-notch quality and reliability. This DSP is perfect for a wide range of applications, offering integrated cache, multiple external interrupts, and low power mode for optimized performance. Unlock new possibilities and elevate your projects with the TMS320C6204ZWT200, providing unmatched value, benefits, and advantages to customers looking for superior processing power.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the DSP, making it suitable for various applications.

Integrated Cache: YES

The integrated cache enhances the processing speed and efficiency of the digital signal processor.

On Chip Data RAM Width: 8

The wide data RAM width allows for efficient data processing and storage within the DSP.

Address Bus Width: 22

A wide address bus width enables the DSP to handle large memory addresses, improving its overall performance.

Bit Size: 32

The 32-bit architecture of the DSP allows for fast and efficient processing of digital signals and data.

No. of Terminals: 288

Having a high number of terminals enables the DSP to connect with multiple external devices for enhanced functionality.

Maximum Clock Frequency: 200 MHz

The high clock frequency allows for quick processing of signals and data, making the DSP suitable for real-time applications.

Technology: CMOS

CMOS technology offers low power consumption and high speed operation, making this DSP energy efficient and reliable.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6204ZWT200 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

22

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

200 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B288

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

4

No. of External Interrupts:

4

No. of Terminals:

288

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA288,19X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Words:

65536

ROM Programmability:

MROM

Maximum Seated Height:

1.4 mm

Maximum Supply Current:

290 mA

Maximum Supply Voltage:

1.57 V

Minimum Supply Voltage:

1.43 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

TMS320C6204ZWT200 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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