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TMS320C6203BZNY300

Texas Instruments

TMS320C6203BZNY300 by Texas Instruments

TMS320C6203BZNY300 by Texas Instruments is a 32-bit DSP with 384 terminals, operating at 300 MHz. It features integrated cache, 524288 RAM words, and boundary scan support. Ideal for digital signal processing applications requiring high-speed data processing and low power consumption.

Median Price

$99.090

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 35 parts In-Stock

1+ parts

$46.760

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35

$46.760

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Chip1Stop

Japan . 40 parts In-Stock

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$96.210

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40

$96.210

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Texas Instruments

USA . 1,360 parts In-Stock

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$99.090

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$96.110

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$74.504

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1,360

$99.090

$96.110

$74.504

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Verical

USA . 35 parts In-Stock

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$99.946

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35

$99.946

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Rochester

USA . 23 parts In-Stock

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$115.300

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$108.380

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$101.460

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23

$115.300

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$101.460

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DigiKey

USA . 83 parts In-Stock

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Digiode

USA . 64 parts In-Stock

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$91.400

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64

$91.400

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DigiKey Marketplace

USA . 83 parts In-Stock

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$107.630

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83

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Vyrian

USA . 2,195 parts In-Stock

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Goldney Electronics S.L.

Spain . 4 parts In-Stock

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Parana Technologies

USA . 1,734 parts In-Stock

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$48.997

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$48.997

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DigiPath Technology Company

USA . 1,181 parts In-Stock

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$53.952

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$49.636

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$53.952

$49.636

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ChromeModa Solutions

Germany . 5,700 parts In-Stock

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$55.053

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$45.143

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5,700

$55.053

$45.143

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IDEA Electronic Components Group

UK . 1,208 parts In-Stock

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$55.053

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$52.300

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$49.548

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$49.548

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Corohmni

South Africa . 1,178 parts In-Stock

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$81.824

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Corphita

USA . 3,336 parts In-Stock

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$86.589

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Microchip USA

USA . 1,186 parts In-Stock

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$162.315

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QUARKTWIN TECHNOLOGY LTD

USA . 29,225 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Overview

Experience the power of cutting-edge technology with the TMS320C6203BZNY300 by Texas Instruments, a top-of-the-line Digital Signal Processor designed to revolutionize your projects. With Texas Instruments' reputation for quality and innovation, this DSP offers unparalleled performance and reliability in a wide range of applications. From audio processing to telecommunications, this product delivers value, benefits, and advantages that will take your projects to the next level. Trust Texas Instruments to provide you with the tools you need to succeed.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the DSP, making it suitable for a variety of environments.

Integrated Cache: YES

The integrated cache allows for faster data access and processing, improving the overall performance of the DSP.

Maximum Supply Voltage: 1.57 V

This higher supply voltage allows for efficient power management while still providing enough power for high-performance tasks.

Address Bus Width: 22

With a wider address bus, the DSP can access a larger range of memory locations, enabling it to handle complex algorithms and data processing.

Bit Size: 32

This 32-bit architecture allows for faster and more precise calculations, making the DSP suitable for demanding signal processing applications.

Maximum Operating Temperature: 90 °C

With a high maximum operating temperature, this DSP can operate reliably in harsh environments without overheating.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the DSP energy-efficient and reliable.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6203BZNY300 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

22

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

300 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B384

JESD-609 Code:

e1

Length:

18 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

4

No. of External Interrupts:

4

No. of Terminals:

384

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA384,22X22,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.5,3.3

Qualification:

Not Qualified

RAM Words:

524288

ROM Programmability:

MROM

Maximum Seated Height:

2.35 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.57 V

Minimum Supply Voltage:

1.43 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

18 mm

Peripheral IC Type:

Trade Compliance

TMS320C6203BZNY300 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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