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TMS320C6201GJLA200

Texas Instruments

TMS320C6201GJLA200 by Texas Instruments

TMS320C6201GJLA200 by Texas Instruments is a 32-bit DSP with integrated cache, operating at max 200 MHz. Ideal for industrial applications, it features 22-bit address bus width and 32-bit external data bus width for efficient processing. With low power mode and boundary scan support, it offers high performance in a compact square package.

Median Price

$148.522

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 128 parts In-Stock

1+ parts

$136.570

100+ parts

$128.380

1k+ parts

$120.180

10k+ parts

-

128

$136.570

$128.380

$120.180

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DigiKey

USA . 128 parts In-Stock

1+ parts

-

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-

1k+ parts

-

10k+ parts

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128

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Verical

USA . 101 parts In-Stock

1+ parts

-

100+ parts

$160.475

1k+ parts

$150.225

10k+ parts

-

101

-

$160.475

$150.225

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,198 parts In-Stock

1+ parts

$150.651

100+ parts

-

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2,198

$150.651

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Vyrian

USA . 5,259 parts In-Stock

1+ parts

-

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5,259

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North Shore Components

USA . 25 parts In-Stock

1+ parts

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25

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Component Sense

UK . 10 parts In-Stock

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 48 parts In-Stock

1+ parts

$18.407

100+ parts

$16.750

1k+ parts

$15.094

10k+ parts

-

48

$18.407

$16.750

$15.094

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Microchip USA

USA . 1,805 parts In-Stock

1+ parts

$31.980

100+ parts

$31.520

1k+ parts

$31.290

10k+ parts

$31.060

1,805

$31.980

$31.520

$31.290

$31.060

Parana Technologies

USA . 1,327 parts In-Stock

1+ parts

$68.781

100+ parts

-

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1,327

$68.781

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IDEA Electronic Components Group

UK . 680 parts In-Stock

1+ parts

$77.282

100+ parts

$73.418

1k+ parts

$69.554

10k+ parts

-

680

$77.282

$73.418

$69.554

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ChromeModa Solutions

Germany . 109 parts In-Stock

1+ parts

$77.282

100+ parts

$63.371

1k+ parts

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109

$77.282

$63.371

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Ampacity Inc.

Singapore . 119 parts In-Stock

1+ parts

$134.790

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119

$134.790

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Corphita

USA . 1,148 parts In-Stock

1+ parts

$142.722

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1,148

$142.722

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Component Stockers USA

USA . 106 parts In-Stock

1+ parts

$147.880

100+ parts

$139.010

1k+ parts

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10k+ parts

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106

$147.880

$139.010

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Corohmni

South Africa . 47 parts In-Stock

1+ parts

$154.445

100+ parts

-

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47

$154.445

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A-Z Elektronik GmbH

Germany . 6,032 parts In-Stock

1+ parts

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6,032

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Futuretech Components

Singapore . 3,000 parts In-Stock

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3,000

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DigiPath Technology Company

USA . 1,239 parts In-Stock

1+ parts

-

100+ parts

$69.677

1k+ parts

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10k+ parts

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1,239

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$69.677

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

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100+ parts

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1,000

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Overview

Unlock the power of seamless digital signal processing with the TMS320C6201GJLA200 by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-notch quality and reliability. This DSP is perfect for a wide range of applications, from audio processing to telecommunications. Offering high performance at a competitive price point, the TMS320C6201GJLA200 provides customers with exceptional value, efficiency, and versatility. Upgrade your projects with this cutting-edge solution and experience the advantages of advanced technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the DSP, ensuring longevity and reliability.

Integrated Cache: YES

Having an integrated cache allows for faster access to frequently used data, improving overall performance.

Maximum Supply Voltage: 1.89 V

This allows for efficient power usage while still providing enough voltage for the DSP to operate effectively.

Address Bus Width: 22

A wider address bus allows for the processing of larger amounts of data at once, enhancing the DSP's capabilities.

Package Shape: SQUARE

The square shape of the package allows for easy integration into various electronic devices and systems.

Bit Size: 32

A 32-bit architecture enables the DSP to handle complex computations and data processing tasks efficiently.

Power Supplies (V): 1.8,3.3

Offering multiple power supply options gives flexibility in designing power systems for different applications.

No. of Terminals: 352

A higher number of terminals allows for more connectivity options and integration with other components in a system.

Maximum Seated Height: 3.8 mm

The low profile of the DSP makes it suitable for compact or space-constrained devices and systems.

RAM Words: 16384

With a large RAM capacity, the DSP can efficiently store and access data for processing tasks, enhancing performance.

Maximum Clock Frequency: 200 MHz

A high clock frequency enables the DSP to perform calculations and processing tasks quickly, ideal for real-time applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

This versatile IC type allows the DSP to interface with a variety of external devices and systems, expanding its functionality.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6201GJLA200 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

22

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

200 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B352

JESD-609 Code:

e0

Length:

27 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

4

No. of External Interrupts:

4

No. of Terminals:

352

No. of Timers:

2

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA352,26X26,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

3.8 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.89 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

27 mm

Peripheral IC Type:

Trade Compliance

TMS320C6201GJLA200 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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