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TMS320C5534AZHH05

Texas Instruments

TMS320C5534AZHH05 by Texas Instruments

TMS320C5534AZHH05 by Texas Instruments is a 16-bit DSP with 131072 RAM words, 12 MHz clock frequency, and 1.15 V max supply voltage. Ideal for digital signal processing applications due to its multiple internal bus architecture, fixed-point format, and low power mode capabilities.

Median Price

$3.370

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 960 parts In-Stock

1+ parts

-

100+ parts

$2.920

1k+ parts

$2.610

10k+ parts

$2.460

960

-

$2.920

$2.610

$2.460

DigiKey

USA . 960 parts In-Stock

1+ parts

-

100+ parts

$3.370

1k+ parts

-

10k+ parts

-

960

-

$3.370

-

-

Verical

USA . 960 parts In-Stock

1+ parts

-

100+ parts

$3.837

1k+ parts

$3.263

10k+ parts

$3.075

960

-

$3.837

$3.263

$3.075

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,902 parts In-Stock

1+ parts

$3.078

100+ parts

-

1k+ parts

-

10k+ parts

-

2,902

$3.078

-

-

-

Vyrian

USA . 4,578 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,578

-

-

-

-

DigiKey Marketplace

USA . 960 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

960

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,081 parts In-Stock

1+ parts

$2.916

100+ parts

-

1k+ parts

-

10k+ parts

-

1,081

$2.916

-

-

-

Component Stockers USA

USA . 1,380 parts In-Stock

1+ parts

$3.290

100+ parts

$3.090

1k+ parts

-

10k+ parts

-

1,380

$3.290

$3.090

-

-

Microchip USA

USA . 287 parts In-Stock

1+ parts

$21.910

100+ parts

$21.770

1k+ parts

$21.700

10k+ parts

$21.640

287

$21.910

$21.770

$21.700

$21.640

Corohmni

South Africa . 754 parts In-Stock

1+ parts

$53.204

100+ parts

-

1k+ parts

-

10k+ parts

-

754

$53.204

-

-

-

Parana Technologies

USA . 1,189 parts In-Stock

1+ parts

$71.107

100+ parts

-

1k+ parts

-

10k+ parts

-

1,189

$71.107

-

-

-

ChromeModa Solutions

Germany . 5,609 parts In-Stock

1+ parts

$79.896

100+ parts

$65.515

1k+ parts

-

10k+ parts

-

5,609

$79.896

$65.515

-

-

IDEA Electronic Components Group

UK . 1,050 parts In-Stock

1+ parts

$79.896

100+ parts

$75.901

1k+ parts

$71.906

10k+ parts

-

1,050

$79.896

$75.901

$71.906

-

DigiPath Technology Company

USA . 952 parts In-Stock

1+ parts

-

100+ parts

$72.034

1k+ parts

-

10k+ parts

-

952

-

$72.034

-

-

Overview

Experience the power of cutting-edge technology with the TMS320C5534AZHH05 by Texas Instruments, a leading manufacturer in the field of Digital Signal Processors. This versatile product offers unparalleled performance and reliability, making it ideal for a wide range of applications. From audio processing to industrial automation, this DSP delivers exceptional value, benefits, and advantages to customers seeking top-notch quality and innovation. Trust Texas Instruments to provide you with the tools you need to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection to the DSP, making it suitable for a variety of applications.

Surface Mount: YES

Allows for easy integration onto PCBs, saving space and simplifying assembly.

Maximum Supply Voltage: 1.15 V

Efficient power consumption and compatibility with various power sources.

Bit Size: 16

Offers high processing capabilities for complex algorithms and calculations.

No. of Terminals: 144

Enables versatile connectivity options and interfaces with other components.

Maximum Operating Temperature: 70 °C

Ensures reliable performance even in high-temperature environments.

Technology: CMOS

Utilizes low power consumption and high noise immunity technology for efficient operation.

Moisture Sensitivity Level (MSL): 3

Indicates the level of protection against moisture, ensuring the longevity of the DSP.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C5534AZHH05 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

0

Barrel Shifter:

NO

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

12 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B144

JESD-609 Code:

e1

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

16

No. of External Interrupts:

2

No. of Terminals:

144

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-10 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA144,14X14,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.05,1.8/3.3

Qualification:

Not Qualified

RAM Words:

131072

ROM Programmability:

MROM

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.15 V

Minimum Supply Voltage:

.998 V

Nominal Supply Voltage:

1.05 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Trade Compliance

TMS320C5534AZHH05 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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