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TMS320C5533AZHH10

Texas Instruments

TMS320C5533AZHH10 by Texas Instruments

TMS320C5533AZHH10 by Texas Instruments is a 16-bit DSP with 65536 RAM words, 12 MHz clock frequency, and 1.43V max supply voltage. Ideal for digital signal processing applications due to its multiple internal bus architecture, fixed-point format, and low power mode capabilities.

Median Price

$3.035

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 226 parts In-Stock

1+ parts

-

100+ parts

$2.810

1k+ parts

$2.520

10k+ parts

$2.370

226

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$2.810

$2.520

$2.370

DigiKey

USA . 226 parts In-Stock

1+ parts

-

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$3.260

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226

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$3.260

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Distributors (In-Stock)

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Digiode

USA . 2,946 parts In-Stock

1+ parts

$2.974

100+ parts

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2,946

$2.974

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Vyrian

USA . 6,431 parts In-Stock

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DigiKey Marketplace

USA . 226 parts In-Stock

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226

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Distributors (Availability)

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Corphita

USA . 4,831 parts In-Stock

1+ parts

$2.817

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-

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4,831

$2.817

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Corohmni

South Africa . 235 parts In-Stock

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$42.791

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-

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235

$42.791

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Parana Technologies

USA . 1,836 parts In-Stock

1+ parts

$50.819

100+ parts

-

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-

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1,836

$50.819

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Advanced Electronics

New Zealand . 95 parts In-Stock

1+ parts

$55.730

100+ parts

$50.714

1k+ parts

$45.699

10k+ parts

-

95

$55.730

$50.714

$45.699

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DigiPath Technology Company

USA . 2,194 parts In-Stock

1+ parts

$55.958

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2,194

$55.958

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ChromeModa Solutions

Germany . 6,526 parts In-Stock

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$57.100

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$46.822

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6,526

$57.100

$46.822

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IDEA Electronic Components Group

UK . 2,216 parts In-Stock

1+ parts

$57.100

100+ parts

$54.245

1k+ parts

$51.390

10k+ parts

-

2,216

$57.100

$54.245

$51.390

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Microchip USA

USA . 379 parts In-Stock

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Perfect Parts

USA . 315 parts In-Stock

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Overview

Unlock the power of digital signal processing with the TMS320C5533AZHH10 by Texas Instruments. This versatile DSP offers unmatched quality and reliability, backed by a renowned manufacturer with a long history of innovation. Perfect for a wide range of applications, this DSP provides customers with exceptional value, superior performance, and cutting-edge features. Whether you're designing a new audio system, implementing advanced control algorithms, or developing innovative IoT solutions, the TMS320C5533AZHH10 delivers the performance and flexibility you need to bring your ideas to life. Dive into the world of digital signal processing and experience the difference with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, which is ideal for portable and rugged applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on PCBs, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 1.43 V

The low maximum supply voltage helps in reducing power consumption and extending the battery life of devices powered by this DSP.

On Chip Data RAM Width: 8

Having an 8-bit data RAM width allows for faster data processing and efficient memory utilization in the DSP.

Package Shape: SQUARE

The square package shape facilitates easier placement and alignment on PCBs, enhancing overall board layout and design.

Bit Size: 16

The 16-bit architecture enables higher precision and accuracy in signal processing tasks, making this DSP suitable for demanding applications.

Power Supplies (V): 1.05/1.3, 1.8/3.3

Support for multiple voltage options allows flexibility in power input, catering to a wider range of system requirements and designs.

No. of Terminals: 144

The abundant number of terminals provides ample connectivity options for interfacing with other components, enhancing versatility in system integration.

Package Style (Meter): GRID ARRAY

The grid array package style offers enhanced thermal performance and reliability, making it suitable for high-temperature operations and demanding environments.

Minimum Supply Voltage: 1.24 V

The low minimum supply voltage ensures stable operation even under low-power conditions, making the DSP efficient and reliable in various scenarios.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this DSP can withstand harsh environmental conditions and operate reliably in industrial and automotive applications.

No. of External Interrupts: 2

Support for external interrupts enables efficient handling of time-sensitive events, improving responsiveness and real-time performance of the DSP.

Minimum Operating Temperature: -10 °C

The wide operating temperature range allows the DSP to function reliably in extreme cold conditions, making it suitable for outdoor and automotive applications.

Terminal Finish: TIN SILVER COPPER

The terminal finish with tin, silver, and copper provides excellent conductivity and corrosion resistance, ensuring long-term reliability and performance of the DSP.

Terminal Position: BOTTOM

Having terminals positioned at the bottom makes it easier for soldering and mounting on the PCB, simplifying the assembly process and improving overall reliability.

Maximum Seated Height: 1.4 mm

The low maximum seated height allows for a compact and slim profile, making the DSP suitable for space-constrained designs and applications.

RAM Words: 65536

With a large RAM capacity of 65536 words, the DSP can store and process a significant amount of data efficiently, enabling complex signal processing tasks.

Width: 12 mm

The compact width of 12 mm makes the DSP suitable for integration into small form factor devices and systems, saving space and enabling sleek designs.

Boundary Scan: YES

Support for boundary scan technology allows for efficient testing and debugging during production, ensuring high-quality and reliable operation of the DSP.

Maximum Clock Frequency: 12 MHz

The high maximum clock frequency of 12 MHz enables fast data processing and real-time operation, making the DSP ideal for time-critical applications.

Maximum Time At Peak Reflow Temperature (s): 30

The specified reflow time of 30 seconds at peak temperature ensures proper soldering and thermal stability during manufacturing, enhancing the product's reliability.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C allows for efficient and reliable soldering of the DSP onto the PCB, ensuring strong connections and long-term performance.

Internal Bus Architecture: MULTIPLE

Having multiple internal bus architectures facilitates parallel processing and multitasking capabilities, improving overall performance and efficiency of the DSP.

Length: 12 mm

The compact length of 12 mm contributes to the overall small footprint of the DSP, making it suitable for space-constrained applications and compact designs.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures reliable operation within standard temperature ranges, making the DSP suitable for general-purpose commercial applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The versatile peripheral IC type, including digital signal processing capabilities and other functionalities, allows for diverse application possibilities and customization options.

No. of Timers: 4

Having 4 timers provides precise timing control and synchronization functions, essential for event handling and coordination in real-time applications.

Technology: CMOS

Utilizing CMOS technology offers low power consumption and high noise immunity, making the DSP energy-efficient and reliable in various operating environments.

Terminal Form: BALL

The terminal form factor in ball shape ensures secure connections and reliable solder joints, enhancing the durability and mechanical strength of the DSP.

Nominal Supply Voltage: 1.3 V

The specified nominal supply voltage of 1.3 V ensures stable and efficient operation of the DSP, providing a balance between performance and power consumption.

No. of DMA Channels: 16

With 16 DMA channels, the DSP can efficiently manage data transfer and processing tasks, improving overall system performance and data throughput.

ROM Programmability: MROM

The MROM programmability feature allows for non-volatile memory storage, ensuring that program instructions are retained even when power is removed, enhancing the reliability of the DSP.

Terminal Pitch: 0.8 mm

The small terminal pitch of 0.8 mm enables high-density mounting and compact PCB designs, making the DSP suitable for space-constrained applications.

Format: FIXED POINT

The fixed-point format offers efficient and precise numerical representation, essential for mathematical calculations and signal processing tasks in the DSP.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates moderate sensitivity to moisture during storage and handling, requiring proper precautions to prevent damage to the DSP.

Low Power Mode: YES

Support for low power mode allows for energy-efficient operation, extending battery life and reducing overall power consumption in portable and battery-powered devices.

On Chip Program ROM Width: 8

Having an 8-bit program ROM width enables efficient storage and retrieval of program instructions, enhancing the performance and speed of the DSP in executing tasks.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C5533AZHH10 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

IT ALSO OPERATES AT 1.05 V AT 50 MHZ

Address Bus Width:

0

Barrel Shifter:

NO

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

12 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B144

JESD-609 Code:

e1

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

16

No. of External Interrupts:

2

No. of Terminals:

144

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-10 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA144,14X14,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.05/1.3,1.8/3.3

Qualification:

Not Qualified

RAM Words:

65536

ROM Programmability:

MROM

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.43 V

Minimum Supply Voltage:

1.24 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Trade Compliance

TMS320C5533AZHH10 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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