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TMS320C5515AZCHA10

Texas Instruments

TMS320C5515AZCHA10 by Texas Instruments

TMS320C5515AZCHA10 by Texas Instruments is a 16-bit DSP with 163840 RAM words, operating at up to 12 MHz. Ideal for industrial applications, it features a low power mode and boundary scan capability. With a package style of grid array and terminal finish of tin silver copper, this DSP offers high performance in a compact form factor.

Median Price

$8.765

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 3 parts In-Stock

1+ parts

$1.763

100+ parts

$1.731

1k+ parts

$1.726

10k+ parts

-

3

$1.763

$1.731

$1.726

-

Chip1Stop

Japan . 3 parts In-Stock

1+ parts

$7.220

100+ parts

-

1k+ parts

-

10k+ parts

-

3

$7.220

-

-

-

Texas Instruments

USA . 2,270 parts In-Stock

1+ parts

$8.765

100+ parts

$7.656

1k+ parts

$5.280

10k+ parts

-

2,270

$8.765

$7.656

$5.280

-

Mouser Electronics

USA . 33 parts In-Stock

1+ parts

$17.860

100+ parts

$10.030

1k+ parts

$9.730

10k+ parts

-

33

$17.860

$10.030

$9.730

-

Rochester

USA . 171 parts In-Stock

1+ parts

-

100+ parts

$8.700

1k+ parts

$7.790

10k+ parts

$7.330

171

-

$8.700

$7.790

$7.330

DigiKey

USA . 171 parts In-Stock

1+ parts

-

100+ parts

$11.450

1k+ parts

-

10k+ parts

-

171

-

$11.450

-

-

Verical

USA . 171 parts In-Stock

1+ parts

-

100+ parts

$10.875

1k+ parts

$9.738

10k+ parts

$9.162

171

-

$10.875

$9.738

$9.162

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,123 parts In-Stock

1+ parts

$4.604

100+ parts

-

1k+ parts

-

10k+ parts

-

4,123

$4.604

-

-

-

Vyrian

USA . 8,333 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,333

-

-

-

-

Nova Conductors

Japan . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 379 parts In-Stock

1+ parts

$4.120

100+ parts

-

1k+ parts

-

10k+ parts

-

379

$4.120

-

-

-

Corphita

USA . 2,862 parts In-Stock

1+ parts

$4.361

100+ parts

-

1k+ parts

-

10k+ parts

-

2,862

$4.361

-

-

-

Parana Technologies

USA . 1,614 parts In-Stock

1+ parts

$28.250

100+ parts

-

1k+ parts

$45.409

10k+ parts

-

1,614

$28.250

-

$45.409

-

DigiPath Technology Company

USA . 2,238 parts In-Stock

1+ parts

$31.107

100+ parts

$28.619

1k+ parts

-

10k+ parts

-

2,238

$31.107

$28.619

-

-

ChromeModa Solutions

Germany . 4,171 parts In-Stock

1+ parts

$31.742

100+ parts

$26.028

1k+ parts

-

10k+ parts

-

4,171

$31.742

$26.028

-

-

IDEA Electronic Components Group

UK . 1,047 parts In-Stock

1+ parts

$31.742

100+ parts

$30.155

1k+ parts

$28.568

10k+ parts

-

1,047

$31.742

$30.155

$28.568

-

Corohmni

South Africa . 2,931 parts In-Stock

1+ parts

$84.394

100+ parts

-

1k+ parts

-

10k+ parts

-

2,931

$84.394

-

-

-

Argo Parts USA

USA . 4,490 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,490

-

-

-

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Continental Prestige Electronics

USA . 4,275 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,275

-

-

-

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,000

-

-

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Perfect Parts

USA . 166 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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166

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Overview

Unlock the power of cutting-edge technology with the TMS320C5515AZCHA10 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality and reliability in their Digital Signal Processors (DSPs). Ideal for a wide range of applications, this product offers unmatched value and benefits to customers looking for high-performance solutions. Experience seamless operation and superior functionality with the TMS320C5515AZCHA10, setting new standards in efficiency and innovation. Elevate your projects with this exceptional DSP from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components of the DSP, ensuring long-term reliability.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 1.15 V

Operates efficiently within a safe voltage range, preventing potential damage to the device.

On Chip Data RAM Width: 8

Offers sufficient memory capacity for storing and processing data efficiently.

Address Bus Width: 21

Provides a wide address bus for accessing memory locations quickly and effectively.

Bit Size: 16

Offers a good balance between processing power and energy efficiency.

Power Supplies (V): 1.05/1.3,1.8/3.3

Supports a wide range of power supplies, making it adaptable to various voltage requirements.

No. of Terminals: 196

Provides ample connectivity options for interfacing with other components in a complex system.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Enables compact and efficient packaging, ideal for space-constrained applications.

Minimum Supply Voltage: 0.998 V

Operates within a low voltage range, promoting energy efficiency and minimizing heat generation.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures without compromising performance, suitable for industrial environments.

No. of External Interrupts: 2

Allows for efficient handling of external events, enhancing responsiveness and real-time processing capabilities.

Minimum Operating Temperature: -40 °C

Capable of operating in extremely low temperatures, making it suitable for rugged or outdoor applications.

Terminal Finish: TIN SILVER COPPER

Ensures reliable electrical connections and resistance to corrosion for long-term operation.

Terminal Position: BOTTOM

Facilitates easy integration into the overall circuit design, improving the efficiency of signal routing.

Maximum Seated Height: 1.3 mm

Low profile design enables compact and space-saving installations in thin electronic devices.

RAM Words: 163840

Ample memory capacity for storing and processing a large amount of data efficiently.

Width: 10 mm

Compact form factor for easy integration into various electronic devices.

Boundary Scan: YES

Facilitates testing and diagnostics during manufacturing and maintenance, ensuring quality and reliability.

External Data Bus Width: 16

Wide data bus allows for quick data transfer between external devices, enhancing overall system performance.

Maximum Clock Frequency: 12 MHz

Capable of high-speed processing, suitable for applications requiring real-time data processing.

Maximum Time At Peak Reflow Temperature (s): 30

Facilitates a quick and efficient reflow process during assembly, saving time and reducing manufacturing costs.

Peak Reflow Temperature °C: 260

Can withstand high reflow temperatures without damage, ensuring reliable solder connections.

Internal Bus Architecture: SINGLE

Simplified bus architecture for efficient data flow and reduced power consumption.

Length: 10 mm

Compact size for easy integration into various electronic devices and circuit layouts.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments, ensuring reliable operation under challenging conditions.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Versatile peripheral IC type suitable for a wide range of digital signal processing applications.

No. of Timers: 3

Multiple timers for accurate timekeeping and scheduling in time-sensitive applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ideal for energy-efficient devices.

Terminal Form: BALL

Ball terminal form for reliable and secure connections, ensuring stable electrical conductivity.

Nominal Supply Voltage: 1.05 V

Optimal supply voltage for efficient and reliable operation of the DSP.

No. of DMA Channels: 16

Multiple DMA channels for efficient data transfer and processing, enhancing overall system performance.

ROM Programmability: MROM

Mask ROM programmability for secure and permanent storage of critical firmware or code.

Terminal Pitch: 0.65 mm

Close terminal pitch for compact footprint and efficient PCB design.

Format: FIXED POINT

Fixed-point format for efficient numerical calculations and processing in signal processing applications.

Moisture Sensitivity Level (MSL): 3

MSL 3 design for enhanced moisture resistance during storage and handling.

Low Power Mode: YES

Low power mode for energy-efficient operation and extended battery life.

On Chip Program ROM Width: 8

On-chip program ROM with sufficient width for storing critical firmware or code.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C5515AZCHA10 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

21

Barrel Shifter:

NO

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

12 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

SINGLE

JESD-30 Code:

S-PBGA-B196

JESD-609 Code:

e1

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

16

No. of External Interrupts:

2

No. of Terminals:

196

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA196,14X14,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.05/1.3,1.8/3.3

Qualification:

Not Qualified

RAM Words:

163840

ROM Programmability:

MROM

Maximum Seated Height:

1.3 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.15 V

Minimum Supply Voltage:

.998 V

Nominal Supply Voltage:

1.05 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

TMS320C5515AZCHA10 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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