Loading...

TMS320C5505AZCH10

Texas Instruments

TMS320C5505AZCH10 by Texas Instruments

TMS320C5505AZCH10 by Texas Instruments is a 16-bit DSP with 100 MHz clock frequency, 196 terminals, and 163840 RAM words. Ideal for digital signal processing applications due to its low power mode, multiple internal bus architecture, and boundary scan capability.

Median Price

$6.091

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 51,713 parts In-Stock

1+ parts

$6.532

100+ parts

$5.706

1k+ parts

$3.935

10k+ parts

-

51,713

$6.532

$5.706

$3.935

-

Rochester

USA . 7 parts In-Stock

1+ parts

-

100+ parts

$5.650

1k+ parts

$5.060

10k+ parts

$4.760

7

-

$5.650

$5.060

$4.760

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,211 parts In-Stock

1+ parts

$5.196

100+ parts

-

1k+ parts

-

10k+ parts

-

1,211

$5.196

-

-

-

Vyrian

USA . 5,349 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,349

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,096 parts In-Stock

1+ parts

$4.923

100+ parts

-

1k+ parts

-

10k+ parts

-

2,096

$4.923

-

-

-

Component Stockers USA

USA . 8 parts In-Stock

1+ parts

$5.580

100+ parts

-

1k+ parts

-

10k+ parts

-

8

$5.580

-

-

-

Corohmni

South Africa . 851 parts In-Stock

1+ parts

$8.020

100+ parts

-

1k+ parts

-

10k+ parts

-

851

$8.020

-

-

-

AZTECH Wire

Italy . 994 parts In-Stock

1+ parts

$8.030

100+ parts

-

1k+ parts

-

10k+ parts

-

994

$8.030

-

-

-

Parana Technologies

USA . 936 parts In-Stock

1+ parts

$66.268

100+ parts

-

1k+ parts

-

10k+ parts

-

936

$66.268

-

-

-

ChromeModa Solutions

Germany . 5,912 parts In-Stock

1+ parts

$74.458

100+ parts

$61.056

1k+ parts

-

10k+ parts

-

5,912

$74.458

$61.056

-

-

IDEA Electronic Components Group

UK . 1,677 parts In-Stock

1+ parts

$74.458

100+ parts

$70.735

1k+ parts

$67.012

10k+ parts

-

1,677

$74.458

$70.735

$67.012

-

DigiPath Technology Company

USA . 2,007 parts In-Stock

1+ parts

-

100+ parts

$67.131

1k+ parts

-

10k+ parts

-

2,007

-

$67.131

-

-

Overview

Unleash the power of cutting-edge technology with the TMS320C5505AZCH10 by Texas Instruments. As a leader in digital signal processors, Texas Instruments delivers top-notch quality and reliability. This versatile DSP is perfect for a wide range of applications, offering customers unmatched value and performance. Experience seamless operation and unparalleled efficiency with the TMS320C5505AZCH10, setting new standards in the industry. Elevate your projects to new heights with this innovative product from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is cost-effective and widely available, making the product more affordable for consumers.

Surface Mount: YES

Surface mount technology allows for a more compact design, saving space on circuit boards.

Maximum Supply Voltage: 1.43 V

Operating at a lower voltage helps in reducing power consumption and heat generation.

On Chip Data RAM Width: 8

Having a wider data RAM width allows for faster data processing and more efficient performance.

Address Bus Width: 27

A wider address bus allows for greater memory addressability, increasing the overall capabilities of the DSP.

Bit Size: 16

A 16-bit architecture offers a good balance between performance and efficiency for processing digital signals.

Power Supplies (V): 1.05/1.3,1.8/3.3

Having multiple power supply options provides flexibility for different application requirements.

No. of Terminals: 196

A higher number of terminals allow for more connections and functionality in the device.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The package style enables high-density mounting and efficient thermal management for better performance.

Minimum Supply Voltage: 1.24 V

Having a low minimum supply voltage ensures reliable operation even under low power conditions.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions.

No. of External Interrupts: 2

External interrupts allow for timely response to external events, enhancing the device's real-time processing capabilities.

Minimum Operating Temperature: -10 °C

The ability to operate at low temperatures extends the product's usability in various environments.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides excellent conductivity and corrosion resistance for reliable connections.

Terminal Position: BOTTOM

Bottom terminal position facilitates easier integration into circuit boards and reduces the overall footprint of the device.

Maximum Seated Height: 1.3 mm

A low seated height allows for more efficient stacking and mounting of components in a compact space.

RAM Words: 163840

With a large RAM capacity, the device can store and process a significant amount of data for complex signal processing tasks.

Width: 10 mm

Compact width dimensions make the product suitable for applications where space is limited.

Boundary Scan: YES

Boundary scan support enables efficient testing and debugging of the device during manufacturing and maintenance.

External Data Bus Width: 16

A wider external data bus allows for faster data transfer between the DSP and external components.

Maximum Clock Frequency: 100 MHz

Operating at a high clock frequency enables rapid signal processing and real-time data handling.

Maximum Time At Peak Reflow Temperature (s): 30

With a defined reflow profile, the device is well-suited for SMT assembly processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures proper soldering and reliability of connections during assembly.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architectures allow for efficient data transfer and processing within the DSP.

Length: 10 mm

Compact length dimensions contribute to the overall small form factor of the product.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures reliable operation in standard operating conditions.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Dedicated peripheral ICs for signal processing enhance the device's capabilities and performance in specific applications.

No. of Timers: 3

Multiple timers provide accurate timing control and synchronization for various operations in the device.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product suitable for battery-powered applications.

Terminal Form: BALL

Ball terminal form allows for reliable connections and easy soldering during assembly.

Nominal Supply Voltage: 1.3 V

A stable nominal supply voltage ensures consistent performance and reliability of the device.

No. of DMA Channels: 16

Multiple DMA channels enable efficient data transfer between memory and peripherals, optimizing system performance.

ROM Programmability: MROM

MROM (Mask ROM) provides a secure and non-volatile memory option for storing critical code and data.

Terminal Pitch: 0.65 mm

Narrow terminal pitch allows for high-density mounting and space-saving designs in electronic systems.

Format: FIXED POINT

Fixed-point format offers efficient numerical representation for signal processing tasks while optimizing performance.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates the device's resistance to moisture during handling, storage, and assembly processes.

Low Power Mode: YES

Low power mode feature helps in reducing power consumption and extending battery life in portable and energy-efficient applications.

On Chip Program ROM Width: 8

The width of the on-chip program ROM determines the storage capacity for essential firmware and program code, enhancing the device's functionality.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C5505AZCH10 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 60 MHZ WITH 1.05 V SUPPLY

Address Bus Width:

27

Barrel Shifter:

NO

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

100 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B196

JESD-609 Code:

e1

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

16

No. of External Interrupts:

2

No. of Terminals:

196

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-10 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA196,14X14,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.05/1.3,1.8/3.3

Qualification:

Not Qualified

RAM Words:

163840

ROM Programmability:

MROM

Maximum Seated Height:

1.3 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.43 V

Minimum Supply Voltage:

1.24 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

TMS320C5505AZCH10 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20