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TMS320C54V90PGE

Texas Instruments

TMS320C54V90PGE by Texas Instruments

TMS320C54V90PGE by Texas Instruments is a 16-bit DSP with 23-bit address bus, operating at max frequency of 14.7456 MHz. Ideal for digital signal processing applications, it features low power mode and boundary scan capability, packaged in a square shape with 144 terminals.

Median Price

$19.500

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 10 parts In-Stock

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-

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$19.500

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$17.450

10k+ parts

$16.420

10

-

$19.500

$17.450

$16.420

Distributors (In-Stock)

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Digiode

USA . 2,726 parts In-Stock

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$20.586

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$20.586

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ComSIT Distribution GmbH

Germany . 4,582 parts In-Stock

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Vyrian

USA . 4,498 parts In-Stock

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Pegasus Components GmbH

Germany . 230 parts In-Stock

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PC Components Company LLC

USA . 55 parts In-Stock

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Bristol Electronics

USA . 55 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 364 parts In-Stock

1+ parts

$11.610

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364

$11.610

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Corphita

USA . 568 parts In-Stock

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$19.503

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$19.503

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Corohmni

South Africa . 730 parts In-Stock

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$53.899

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$53.899

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Parana Technologies

USA . 425 parts In-Stock

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$57.170

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DigiPath Technology Company

USA . 1,843 parts In-Stock

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$62.951

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$57.915

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$62.951

$57.915

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ChromeModa Solutions

Germany . 6,472 parts In-Stock

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$64.236

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$52.674

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$64.236

$52.674

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IDEA Electronic Components Group

UK . 1,427 parts In-Stock

1+ parts

$64.236

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$61.024

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$57.812

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1,427

$64.236

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$57.812

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A-Z Elektronik GmbH

Germany . 4,575 parts In-Stock

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Authorized Procurement Solutions

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Assy Fe

Spain . 1,000 parts In-Stock

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Microchip USA

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Kepictronics

USA . 63 parts In-Stock

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Overview

Unlock the power of digital signal processing with the TMS320C54V90PGE by Texas Instruments. This innovative DSP offers unparalleled quality and reliability, backed by the trusted reputation of its manufacturer. Ideal for a wide range of applications, this product provides customers with exceptional value, benefits, and advantages. Experience superior performance and efficiency with the TMS320C54V90PGE, setting new standards in the world of digital signal processors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good protection for the internal components and offers durability for the product.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and effort in the production process.

Maximum Supply Voltage: 1.65 V

Ensures safe operation within the specified voltage range to prevent damage to the DSP.

Address Bus Width: 23

Provides sufficient address space for efficient data handling and processing capabilities.

Package Shape: SQUARE

Helps optimize space utilization on the circuit board and promotes efficient layout designs.

Bit Size: 16

Offers high processing capabilities for handling complex digital signals and data.

Power Supplies (V): 1.5,3/3.3,5

Supports a wide range of power supply options for versatile compatibility with various systems.

No. of Terminals: 144

Provides ample connectivity options for interfacing with external devices and components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Offers multiple packaging styles for flexibility in design integration and space-saving benefits.

Minimum Supply Voltage: 1.42 V

Ensures reliable operation even at low voltage conditions for consistent performance.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures for extended use in various environments.

Minimum Operating Temperature: 0 °C

Can operate effectively in colder temperatures without impacting performance.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent conductivity and corrosion resistance for long-term reliability.

Terminal Position: QUAD

Allows for efficient placement on the circuit board and simplifies the assembly process.

Maximum Seated Height: 1.6 mm

Offers a low profile design for space-constrained applications and compact layouts.

RAM Words: 40960

Provides ample memory capacity for storing and processing data efficiently.

Width: 20 mm

Compact size enables easy integration into various electronic devices and systems.

Boundary Scan: YES

Facilitates testing and debugging processes during production and maintenance phases.

External Data Bus Width: 16

Enables efficient data transfer between the DSP and external devices for seamless communication.

Maximum Clock Frequency: 14.7456 MHz

Supports high-speed processing for rapid data computation and signal manipulation.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures reliability during reflow soldering processes for robust product assembly.

Peak Reflow Temperature °C: 260

Can withstand high reflow temperatures without compromising performance or integrity.

Internal Bus Architecture: MULTIPLE

Enables efficient data flow and processing within the DSP for optimized performance.

Length: 20 mm

Compact size allows for flexibility in design layouts and space-saving benefits.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Provides versatile peripheral options for interfacing with a wide range of external devices.

Technology: CMOS

Utilizes CMOS technology for low power consumption and efficient operation.

Terminal Form: GULL WING

Facilitates easy soldering and connection during assembly processes for quick and reliable installation.

Nominal Supply Voltage: 1.5 V

Standard voltage rating ensures compatibility with most power sources for seamless integration.

Terminal Pitch: 0.5 mm

Offers precise terminal spacing for accurate connections and improved signal integrity.

Format: FIXED POINT

Utilizes fixed-point processing for efficient data handling and precise calculations.

Low Power Mode: YES

Supports energy-efficient operation for extended battery life and reduced power consumption.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C54V90PGE attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

23

Barrel Shifter:

NO

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

14.7456 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

20 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

144

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.5,3/3.3,5

Qualification:

Not Qualified

RAM Words:

40960

Maximum Seated Height:

1.6 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.65 V

Minimum Supply Voltage:

1.42 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Trade Compliance

TMS320C54V90PGE Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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