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TMS320C40GFL40

Texas Instruments

TMS320C40GFL40 by Texas Instruments

TMS320C40GFL40 by Texas Instruments is a 32-bit DSP with 5V supply, 40MHz clock frequency, and 8-bit data RAM. Ideal for digital signal processing applications requiring high-speed computation in commercial temperature environments. Features include floating-point format, barrel shifter, and boundary scan capability.

Median Price

$785.915

Lifecycle Status

Suppliers In-Stock

23

In-Stock Inventory

1k+

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Rochester

USA . 541 parts In-Stock

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$712.020

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$669.300

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$626.580

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$712.020

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DigiKey

USA . 541 parts In-Stock

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$859.810

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Freelance Electronics

USA . 18 parts In-Stock

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$454.286

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$477.001

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$449.744

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$454.286

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Digiode

USA . 3,337 parts In-Stock

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$785.403

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Vyrian

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PC Components Company LLC

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Bristol Electronics

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LittleDiode

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Atlantic Semiconductor

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Corel Iberica Componentes, S.L.

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Beltway Electronics Company

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ACDS - Activité Composants Distribution Service

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Manotoh

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Sogenti Electronics

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Eagle Technology Solutions

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Advanced Electronics

New Zealand . 100 parts In-Stock

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$9.959

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$9.063

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$8.166

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Parana Technologies

USA . 429 parts In-Stock

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$40.089

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$3,722.887

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$36.080

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DigiPath Technology Company

USA . 1,015 parts In-Stock

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$44.143

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ChromeModa Solutions

Germany . 4,621 parts In-Stock

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IDEA Electronic Components Group

UK . 158 parts In-Stock

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$42.792

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$40.540

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Corohmni

South Africa . 1,152 parts In-Stock

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Corphita

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Overview

Unleash the power of cutting-edge technology with the TMS320C40GFL40 by Texas Instruments. As a leader in digital signal processors, Texas Instruments delivers unparalleled quality and performance in this innovative product. Ideal for a wide range of applications, this DSP offers customers exceptional value and benefits, from high-speed processing to low power consumption. Experience seamless integration and reliable operation with the TMS320C40GFL40, setting new standards in efficiency and effectiveness. Elevate your projects with this top-of-the-line solution from Texas Instruments.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

Provides excellent thermal conductivity and durability, ensuring reliable performance even in harsh environments.

Maximum Supply Voltage: 5.25 V

Allows for sufficient power supply to the DSP for optimal performance without risking damage due to overvoltage.

On Chip Data RAM Width: 8

Wider data RAM width allows for faster data processing and storage, enhancing the overall efficiency of the DSP.

Address Bus Width: 31

The wide address bus width allows for efficient memory addressing and access, facilitating quick data retrieval and processing.

Package Shape: SQUARE

Square package shape facilitates easier integration into PCB designs and compact layouts, saving space and improving overall system efficiency.

Power Supplies (V): 5

Operates at a standard power supply voltage of 5V, ensuring compatibility with common power sources and ease of integration in various systems.

No. of Terminals: 325

Having a large number of terminals allows for versatile connectivity options and integration of various peripheral devices, enhancing the functionality of the DSP.

Minimum Supply Voltage: 4.75 V

The low minimum supply voltage ensures efficient power management and reduces power consumption, making the DSP suitable for energy-efficient applications.

Maximum Operating Temperature: 70 °C

Capable of operating at high temperatures without degradation in performance, making it suitable for demanding industrial and automotive applications.

No. of External Interrupts: 5

Multiple external interrupts allow for efficient handling of external events and real-time signal processing, enhancing system responsiveness and reliability.

Minimum Operating Temperature: 0 °C

Capable of operating in low-temperature environments, ensuring consistent performance in a wide range of operating conditions.

Terminal Finish: GOLD

Gold terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable connections and long-term performance.

Maximum Seated Height: 5.08 mm

Low seated height enables slim and compact design integration, making it suitable for space-constrained applications.

RAM Words: 4096

Large RAM capacity allows for efficient storage and processing of a significant amount of data, enhancing overall system performance.

Width: 47.25 mm

Compact width dimensions enable easier integration into PCB designs and compact system layouts, saving space and simplifying system assembly.

Boundary Scan: YES

Boundary scan capability enables easier testing and debugging of the DSP during development and production, reducing time and cost.

External Data Bus Width: 32

Wide external data bus width allows for fast data transfer between external devices and the DSP, enhancing overall system efficiency and performance.

Maximum Clock Frequency: 40 MHz

High maximum clock frequency enables fast data processing and real-time signal handling, making it suitable for time-critical applications.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture allows for efficient data flow and parallel processing, enhancing overall system performance and speed.

Length: 47.25 mm

Compact length dimensions enable easier integration into PCB designs and compact system layouts, saving space and simplifying system assembly.

Temperature Grade: COMMERCIAL

Commercial-grade temperature rating ensures reliable performance in standard operating conditions, making it suitable for commercial applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Versatile peripheral IC type allows for integration of various peripheral devices, expanding the functionality and applicability of the DSP in diverse applications.

No. of Timers: 2

Having multiple timers enables efficient timing control and event triggering, enhancing the versatility and functionality of the DSP in timing-critical applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the DSP suitable for energy-efficient and reliable operation in various applications.

Terminal Form: PIN/PEG

Pin/peg terminal form provides reliable and secure connections, ensuring stable operation and easy integration into system designs.

Maximum Supply Current: 850 mA

Capable of handling high supply current requirements without overheating or performance degradation, ensuring reliable operation in high-power applications.

Nominal Supply Voltage: 5 V

Standard nominal supply voltage ensures compatibility with common power sources, simplifying system integration and power management.

No. of DMA Channels: 6

Multiple DMA channels enable efficient data transfer and processing, reducing CPU load and improving overall system performance in data-intensive applications.

Terminal Pitch: 2.54 mm

Standard terminal pitch enables easy connection to external devices and PCBs, facilitating system integration and assembly.

Format: FLOATING POINT

Floating-point format allows for high-precision numerical calculations, making the DSP suitable for applications requiring complex mathematical operations and accuracy.

Low Power Mode: YES

Low power mode capability enables power-saving operation during idle or low-demand periods, reducing overall power consumption and extending battery life.

Barrel Shifter: YES

Barrel shifter feature allows for efficient bitwise operations and data manipulation, enhancing the DSP's capability for complex signal processing tasks.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C40GFL40 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

31

Barrel Shifter:

YES

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

40 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-CPGA-P325

JESD-609 Code:

e4

Length:

47.25 mm

Low Power Mode:

YES

No. of DMA Channels:

6

No. of External Interrupts:

5

No. of Serial I/Os:

0

No. of Terminals:

325

No. of Timers:

2

On Chip Data RAM Width:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

SPGA325,35X35MOD

Package Shape:

Package Style (Meter):

GRID ARRAY, INTERSTITIAL PITCH

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

4096

Maximum Seated Height:

5.08 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

850 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

PERPENDICULAR

Width:

47.25 mm

Peripheral IC Type:

Trade Compliance

TMS320C40GFL40 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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