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TMS320C31PQL60

Texas Instruments

TMS320C31PQL60 by Texas Instruments

TMS320C31PQL60 by Texas Instruments is a 32-bit DSP with 5V supply, 60MHz clock frequency, and 1024 RAM words. Ideal for digital signal processing applications due to its floating-point format, low power mode, and barrel shifter feature.

Median Price

$55.270

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

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Rochester

USA . 222 parts In-Stock

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$55.270

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$54.170

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$53.070

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$55.270

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$53.070

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DF Sales Co.

USA . 4 parts In-Stock

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DF Sales Co.

USA . 4 parts In-Stock

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Vyrian

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Digiode

USA . 3,799 parts In-Stock

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Chip Stock

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ACDS - Activité Composants Distribution Service

France . 58 parts In-Stock

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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Sogenti Electronics

Canada . 6 parts In-Stock

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J & M Industries LLC

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Prism Electronics

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Classic Components Corporation

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Resion

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Netsource Technology, Inc.

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Distributors (Availability)

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One Stop Electronics

USA . 176 parts In-Stock

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$6.000

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AZTECH Wire

Italy . 502 parts In-Stock

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$8.272

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Parana Technologies

USA . 903 parts In-Stock

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$35.988

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$35.988

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DigiPath Technology Company

USA . 1,217 parts In-Stock

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$39.627

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$36.457

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ChromeModa Solutions

Germany . 4,553 parts In-Stock

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$40.436

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$33.158

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IDEA Electronic Components Group

UK . 1,482 parts In-Stock

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$40.436

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$38.414

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$36.392

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Corohmni

South Africa . 2,396 parts In-Stock

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Corphita

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Microchip USA

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Perfect Parts

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Kepictronics

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A-Z Elektronik GmbH

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Cyclops Electronics Ltd (Excess)

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Glotronic Ltd.

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Overview

Elevate your digital signal processing capabilities with the TMS320C31PQL60 by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-quality products for a wide range of applications. The TMS320C31PQL60 is a powerful DSP that offers unparalleled value and benefits to customers. Unlock new possibilities and enhance your projects with this high-performance processor. Experience the advantage of cutting-edge technology and reliable performance with the TMS320C31PQL60.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection to the internal components of the DSP, making it suitable for various environments.

Maximum Supply Voltage: 5.25 V

A higher maximum supply voltage allows for flexibility in power supply options and ensures reliable operation even with fluctuations in the power source.

Bit Size: 32

With a 32-bit size, this DSP can process complex digital signals efficiently and accurately, making it ideal for applications requiring high processing power.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range ensures that the DSP can perform reliably in various temperature conditions without overheating or performance degradation.

Internal Bus Architecture: MULTIPLE

Having a multiple internal bus architecture allows for efficient data transfer within the DSP, enabling faster processing speeds and overall improved performance.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C31PQL60 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

24

Barrel Shifter:

YES

Bit Size:

32

Boundary Scan:

NO

Maximum Clock Frequency:

60 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G132

JESD-609 Code:

e4

Length:

24.13 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

1

No. of External Interrupts:

4

No. of Serial I/Os:

1

No. of Terminals:

132

No. of Timers:

2

On Chip Data RAM Width:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

SPQFP132,1.1SQ

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

1024

Maximum Seated Height:

4.57 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

475 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24.13 mm

Peripheral IC Type:

Trade Compliance

TMS320C31PQL60 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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