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TM4C1236E6PMIR

Texas Instruments

TM4C1236E6PMIR by Texas Instruments

TM4C1236E6PMIR by Texas Instruments is a 32-bit microcontroller with 131072 ROM words, 32768 RAM bytes, and 12-Ch 12-Bit ADC channels. It operates at up to 25 MHz clock frequency and features various peripherals like PWM, UART(8), and USB. Ideal for industrial applications requiring high-speed data processing and connectivity.

Median Price

$8.110

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 950 parts In-Stock

1+ parts

$8.110

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950

$8.110

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 418 parts In-Stock

1+ parts

$7.704

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418

$7.704

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Vyrian

USA . 7,121 parts In-Stock

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7,121

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 743 parts In-Stock

1+ parts

$7.299

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743

$7.299

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AZTECH Wire

Italy . 1,081 parts In-Stock

1+ parts

$10.890

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1,081

$10.890

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Microchip USA

USA . 3,449 parts In-Stock

1+ parts

$17.500

100+ parts

$17.250

1k+ parts

$17.130

10k+ parts

$17.000

3,449

$17.500

$17.250

$17.130

$17.000

Parana Technologies

USA . 1,059 parts In-Stock

1+ parts

$17.552

100+ parts

-

1k+ parts

$17.748

10k+ parts

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1,059

$17.552

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$17.748

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ChromeModa Solutions

Germany . 1,571 parts In-Stock

1+ parts

$19.721

100+ parts

$16.171

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1,571

$19.721

$16.171

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IDEA Electronic Components Group

UK . 552 parts In-Stock

1+ parts

$19.721

100+ parts

$18.735

1k+ parts

$17.749

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552

$19.721

$18.735

$17.749

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DigiPath Technology Company

USA . 348 parts In-Stock

1+ parts

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$17.780

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348

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$17.780

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Overview

Elevate your projects with the TM4C1236E6PMIR microcontroller by Texas Instruments, a powerhouse in the industry. Designed to meet the demands of various applications, this cutting-edge device offers unmatched quality and reliability. With a wide range of features and peripherals, including ADC and DMA channels, PWM capabilities, and multiple connectivity options, this microcontroller provides exceptional value and performance. Trust Texas Instruments for top-tier products that deliver results, every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and cost-effective, making the product suitable for a wide range of applications.

Maximum Supply Voltage: 1.32 V

Provides flexibility in power supply options while ensuring efficient operation within the specified voltage range.

Bit Size: 32

Offers high processing power and capability to handle complex operations and data processing tasks.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes a reduced instruction set computing (RISC) architecture, enhancing speed and efficiency in executing instructions.

Connectivity: CAN, I2C(6), IRDA, MICROWIRE, SPI, SSI(4), UART(8), USB

Provides a wide range of connectivity options for external devices, enabling seamless integration with various systems.

Technical Specifications

Microcontrollers TM4C1236E6PMIR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

49

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

2K

Connectivity:

CAN, I2C(6), IRDA, MICROWIRE, SPI, SSI(4), UART(8), USB

Peripherals:

BOD, COMPARATOR(2), DMA(32), POR, PWM, QEI(2), RTC, TIMER(13), WDT(2)

Analog To Digital Convertors:

12-Ch 12-Bit

Trade Compliance

TM4C1236E6PMIR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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