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TM4C1236E6PMI

Texas Instruments

TM4C1236E6PMI by Texas Instruments

TM4C1236E6PMI by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU family. It features 131072 ROM words, 32768 RAM bytes, and 12-Ch 12-Bit ADC channels. Ideal for industrial applications requiring CAN, I2C, SPI connectivity and operating temperature range of -40 to 85 °C.

Median Price

$9.660

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 110 parts In-Stock

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$9.660

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110

$9.660

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Distributors (In-Stock)

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Digiode

USA . 108 parts In-Stock

1+ parts

$9.177

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108

$9.177

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Vyrian

USA . 7,628 parts In-Stock

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7,628

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Distributors (Availability)

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Corphita

USA . 1,558 parts In-Stock

1+ parts

$8.694

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1,558

$8.694

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AZTECH Wire

Italy . 36 parts In-Stock

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$18.500

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36

$18.500

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Parana Technologies

USA . 1,571 parts In-Stock

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$21.221

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$21.520

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1,571

$21.221

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$21.520

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DigiPath Technology Company

USA . 1,473 parts In-Stock

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$23.367

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1,473

$23.367

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ChromeModa Solutions

Germany . 2,944 parts In-Stock

1+ parts

$23.844

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$19.552

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2,944

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IDEA Electronic Components Group

UK . 1,894 parts In-Stock

1+ parts

$23.844

100+ parts

$22.652

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$21.460

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1,894

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$22.652

$21.460

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Microchip USA

USA . 2,375 parts In-Stock

1+ parts

$25.160

100+ parts

$24.800

1k+ parts

$24.620

10k+ parts

$24.440

2,375

$25.160

$24.800

$24.620

$24.440

Perfect Parts

USA . 1,075 parts In-Stock

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Overview

Experience the cutting-edge technology of Texas Instruments with the TM4C1236E6PMI microcontroller. This high-quality device offers unparalleled performance and reliability, making it perfect for a wide range of applications. With features such as advanced peripherals, low power consumption, and industrial-grade temperature tolerance, this microcontroller provides exceptional value to customers looking for a powerful yet efficient solution. Trust Texas Instruments for superior quality and innovation in microcontrollers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and resistant to damage.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly of electronic components, reducing overall production costs.

Maximum Supply Voltage: 1.32 V

The maximum supply voltage ensures stable operation without risking damage to the microcontroller.

Bit Size: 32

Having a 32-bit architecture allows for processing larger amounts of data and running more complex algorithms efficiently.

Power Supplies (V): 1.2,3.3

Having multiple power supply options provides flexibility in designing and integrating the microcontroller into different systems.

No. of Terminals: 64

Having a sufficient number of terminals allows for easy connection to other components and peripherals.

ADC Channels: YES

The presence of ADC channels enables analog signals to be accurately converted to digital data, expanding the microcontroller's capabilities.

DMA Channels: YES

DMA channels enhance data transfer speeds and reduce CPU load by enabling efficient direct memory access operations.

Maximum Clock Frequency: 25 MHz

The high clock frequency allows for fast and efficient processing of instructions, enhancing overall performance.

Connectivity: CAN, I2C(6), IRDA, MICROWIRE, SPI, SSI(4), UART(8), USB

Multiple connectivity options provide versatility in communication with external devices and networking capabilities.

Technical Specifications

Microcontrollers TM4C1236E6PMI attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

49

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

2K

Connectivity:

CAN, I2C(6), IRDA, MICROWIRE, SPI, SSI(4), UART(8), USB

Peripherals:

BOD, COMPARATOR(2), DMA(32), POR, PWM, QEI(2), RTC, TIMER(13), WDT(2)

Analog To Digital Convertors:

12-Ch 12-Bit

Trade Compliance

TM4C1236E6PMI Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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