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TLV824ID

Texas Instruments

TLV824ID by Texas Instruments

TLV824ID by Texas Instruments is an Operational Amplifier with 4000uV Max Input Offset Voltage, 73dB CMRR, and 7000kHz Unity Gain Bandwidth. Ideal for industrial applications requiring low bias current and high common mode rejection in a compact small outline package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,469 parts In-Stock

1+ parts

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7,469

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Digiode

USA . 872 parts In-Stock

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872

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 630 parts In-Stock

1+ parts

$1.410

100+ parts

-

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630

$1.410

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Parana Technologies

USA . 1,525 parts In-Stock

1+ parts

$1.475

100+ parts

-

1k+ parts

$2.155

10k+ parts

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1,525

$1.475

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$2.155

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DigiPath Technology Company

USA . 1,511 parts In-Stock

1+ parts

$1.624

100+ parts

$1.494

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1,511

$1.624

$1.494

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IDEA Electronic Components Group

UK . 1,038 parts In-Stock

1+ parts

$1.657

100+ parts

-

1k+ parts

$1.491

10k+ parts

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1,038

$1.657

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$1.491

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ChromeModa Solutions

Germany . 923 parts In-Stock

1+ parts

$1.657

100+ parts

$1.359

1k+ parts

-

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923

$1.657

$1.359

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AZTECH Wire

Italy . 848 parts In-Stock

1+ parts

$7.948

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848

$7.948

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Corphita

USA . 61 parts In-Stock

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61

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Overview

Discover the superior performance and reliability of the TLV824ID operational amplifier by Texas Instruments. Perfect for a wide range of applications, this high-quality product offers unmatched value and benefits to customers. With Texas Instruments' reputation for excellence in manufacturing, you can trust that this op amp will deliver exceptional results every time. Upgrade your projects with the TLV824ID and experience the advantages of top-notch quality and precision engineering.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for a wide range of applications.

Maximum Input Offset Voltage: 4000 uV

Low input offset voltage ensures accuracy in signal processing, making this operational amplifier reliable for precision applications.

Maximum Average Bias Current (IIB): 0.14 uA

Low bias current helps minimize errors in the output signal, making this Op Amp suitable for high-precision circuits.

Surface Mount: YES

Surface mounting capability allows for easy integration onto PCBs, saving space and enabling efficient assembly processes.

Nominal Common Mode Reject Ratio: 73 dB

High common-mode rejection ratio ensures minimal interference from common-mode signals, leading to more accurate differential signal processing.

Nominal Supply Voltage / Vsup (V): 2.7

Low supply voltage requirement allows for energy-efficient operation and compatibility with a variety of power sources.

Maximum Operating Temperature: 85 °C

Wide operating temperature range makes this Op Amp suitable for industrial applications where temperature variations are common.

Nominal Unity Gain Bandwidth: 7000 kHz

High unity gain bandwidth allows for fast signal processing and response, making this Op Amp ideal for applications requiring high-speed operation.

Technical Specifications

Operational Amplifiers (Op Amps) TLV824ID attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Total Functions:

4

Sub-Category:

Operational Amplifiers

Performance Specifications

Nominal Unity Gain Bandwidth:

7 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

73 dB

Input Offset Voltage Limit:

4000 uV

Nominal Slew Rate:

2 V/us

Peak Bias Current:

140 nA

Operational Characteristics

Nominal Supply Voltage:

2.7 V

Maximum Supply Voltage:

5.5 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Physical Characteristics

Length:

0.341 in (8.65 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

14

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G14

Packaging and Shipping

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Trade Compliance

TLV824ID Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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