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TLV822IPWR

Texas Instruments

TLV822IPWR by Texas Instruments

TLV822IPWR by Texas Instruments is a dual operational amplifier with 4000uV max input offset voltage and 73dB nominal CMRR. Ideal for industrial applications, it operates at -40 to 85 °C with micropower consumption of 0.9mA at 3/5V supplies.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,662 parts In-Stock

1+ parts

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4,662

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Vyrian

USA . 4,130 parts In-Stock

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4,130

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,578 parts In-Stock

1+ parts

$1.410

100+ parts

-

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1,578

$1.410

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Parana Technologies

USA . 146 parts In-Stock

1+ parts

$3.237

100+ parts

-

1k+ parts

$3.759

10k+ parts

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146

$3.237

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$3.759

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ChromeModa Solutions

Germany . 3,936 parts In-Stock

1+ parts

$3.637

100+ parts

$2.982

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3,936

$3.637

$2.982

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IDEA Electronic Components Group

UK . 537 parts In-Stock

1+ parts

$3.637

100+ parts

-

1k+ parts

$3.273

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537

$3.637

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$3.273

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AZTECH Wire

Italy . 337 parts In-Stock

1+ parts

$19.774

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337

$19.774

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DigiPath Technology Company

USA . 2,294 parts In-Stock

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100+ parts

$3.279

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2,294

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$3.279

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Corphita

USA . 1,681 parts In-Stock

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1,681

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Overview

Unlock the power of precision with Texas Instruments' TLV822IPWR operational amplifiers. With a sleek rectangular package shape and micropower technology, this amplifier offers unparalleled performance and versatility for a wide range of applications. Whether you're designing medical devices, industrial automation systems, or automotive electronics, the TLV822IPWR delivers exceptional quality, reliability, and value. Experience the difference with Texas Instruments' cutting-edge technology and elevate your projects to new heights of success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and provides good protection for the internal components of the operational amplifier, ensuring longevity and reliability.

Maximum Input Offset Voltage: 4000 uV

Low input offset voltage helps in minimizing errors in the output signal, making this operational amplifier suitable for precision applications.

Surface Mount: YES

Surface mount packaging allows for easy and compact integration onto PCBs, making installation and assembly efficient.

Nominal Common Mode Reject Ratio: 73 dB

High common mode rejection ratio indicates good rejection of noise and interference from the input signal, leading to clearer output signals.

Nominal Supply Voltage / Vsup (V): 2.7

Low supply voltage requirement enables compatibility with a wide range of power sources and makes it suitable for portable and low-power applications.

Minimum Slew Rate: 2 V/us

Fast slew rate allows the operational amplifier to respond quickly to changes in input signals, making it ideal for applications requiring rapid signal processing.

Nominal Unity Gain Bandwidth: 7000 kHz

High unity gain bandwidth ensures that the operational amplifier can maintain stable operation at various gain settings, providing versatility for different applications.

Technical Specifications

Operational Amplifiers (Op Amps) TLV822IPWR attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BIPOLAR

Power Supply:

3/5 V

Total Functions:

2

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

No

Low-Offset:

No

Micropower:

Yes

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

7 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

73 dB

Input Offset Voltage Limit:

4000 uV

Minimum Voltage Gain:

18000

Minimum Slew Rate:

2 V/us

Nominal Slew Rate:

2 V/us

Peak Bias Current:

140 nA

Maximum Bias Current (IIB) @25 °C:

100 nA

Operational Characteristics

Nominal Supply Voltage:

2.7 V

Maximum Supply Voltage:

5.5 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Maximum Supply Current:

900 μA

Physical Characteristics

Length:

0.173 in (4.4 mm)

Width:

0.118 in (3 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Total Terminals:

8

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Equivalence Code:

TSSOP8,.25

Trade Compliance

TLV822IPWR Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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