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TLV821IDCKR

Texas Instruments

TLV821IDCKR by Texas Instruments

TLV821IDCKR by Texas Instruments is a 5-terminal Op Amp with 4000uV max input offset voltage, 73dB CMRR, and 2V/us min slew rate. Ideal for industrial applications requiring low power consumption and high precision amplification in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,929 parts In-Stock

1+ parts

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2,929

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Digiode

USA . 1,834 parts In-Stock

1+ parts

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1,834

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,645 parts In-Stock

1+ parts

$0.410

100+ parts

-

1k+ parts

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10k+ parts

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1,645

$0.410

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Parana Technologies

USA . 1,376 parts In-Stock

1+ parts

$1.571

100+ parts

-

1k+ parts

$2.211

10k+ parts

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1,376

$1.571

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$2.211

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DigiPath Technology Company

USA . 715 parts In-Stock

1+ parts

$1.730

100+ parts

$1.591

1k+ parts

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10k+ parts

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715

$1.730

$1.591

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ChromeModa Solutions

Germany . 5,808 parts In-Stock

1+ parts

$1.765

100+ parts

$1.447

1k+ parts

-

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5,808

$1.765

$1.447

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IDEA Electronic Components Group

UK . 2,150 parts In-Stock

1+ parts

$1.765

100+ parts

-

1k+ parts

$1.588

10k+ parts

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2,150

$1.765

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$1.588

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AZTECH Wire

Italy . 508 parts In-Stock

1+ parts

$14.519

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508

$14.519

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Corphita

USA . 1,010 parts In-Stock

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1,010

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Overview

Experience unparalleled performance and reliability with the TLV821IDCKR operational amplifier by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers cutting-edge technology that ensures precision and efficiency in various applications. From industrial automation to consumer electronics, this op amp provides superior functionality and stability, allowing you to achieve optimal results. Trust in Texas Instruments to deliver high-quality products that meet your needs and exceed your expectations. Elevate your designs with the TLV821IDCKR and experience innovation like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and reliability to the operational amplifier, making it suitable for various industrial applications.

Maximum Input Offset Voltage: 4000 uV

Low input offset voltage ensures accurate and precise amplification of signals.

Surface Mount: YES

Ease of installation and compact design for space-constrained applications.

Nominal Common Mode Reject Ratio: 73 dB

High common mode rejection ratio helps in reducing interference and noise in the signal processing.

Nominal Supply Voltage / Vsup (V): 2.7

Low supply voltage requirement makes it suitable for battery-operated devices.

Minimum Slew Rate: 2 V/us

Fast slew rate allows for quick response to input signal changes.

Maximum Operating Temperature: 85 °C

Wide operating temperature range makes it suitable for industrial environments.

Amplifier Type: OPERATIONAL AMPLIFIER

Specifically designed for precise amplification of input signals in various applications.

Technical Specifications

Operational Amplifiers (Op Amps) TLV821IDCKR attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BIPOLAR

Power Supply:

3/5 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

No

Low-Offset:

No

Micropower:

Yes

Wideband:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

7 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

73 dB

Input Offset Voltage Limit:

4000 uV

Minimum Voltage Gain:

18000

Minimum Slew Rate:

2 V/us

Nominal Slew Rate:

2 V/us

Peak Bias Current:

140 nA

Maximum Bias Current (IIB) @25 °C:

100 nA

Operational Characteristics

Nominal Supply Voltage:

2.7 V

Maximum Supply Voltage:

5.5 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Maximum Supply Current:

600 μA

Physical Characteristics

Length:

0.079 in (2 mm)

Width:

0.049 in (1.25 mm)

Maximum Seated Height:

0.043 in (1.1 mm)

Total Terminals:

5

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G5

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Equivalence Code:

TSSOP5/6,.08

Trade Compliance

TLV821IDCKR Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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