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TLV5639CDWRG4

Texas Instruments

TLV5639CDWRG4 by Texas Instruments

TLV5639CDWRG4 by Texas Instruments is a 12-bit DAC with max output voltage of 5.1V and settling time of 7us. Ideal for industrial automation, motor control, and audio equipment due to its small outline package and low linearity error of 0.0732%.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,617 parts In-Stock

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2,617

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Digiode

USA . 896 parts In-Stock

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896

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Distributors (Availability)

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Parana Technologies

USA . 2,223 parts In-Stock

1+ parts

$6.970

100+ parts

-

1k+ parts

$7.545

10k+ parts

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2,223

$6.970

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$7.545

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One Stop Electronics

USA . 166 parts In-Stock

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$7.000

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166

$7.000

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ChromeModa Solutions

Germany . 5,523 parts In-Stock

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$7.831

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$6.421

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5,523

$7.831

$6.421

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IDEA Electronic Components Group

UK . 1,451 parts In-Stock

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$7.831

100+ parts

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$7.048

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1,451

$7.831

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$7.048

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AZTECH Wire

Italy . 458 parts In-Stock

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$16.815

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458

$16.815

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Corphita

USA . 893 parts In-Stock

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DigiPath Technology Company

USA . 301 parts In-Stock

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$7.060

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$7.060

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Microchip USA

USA . 277 parts In-Stock

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Overview

Unlock a world of precision and reliability with the TLV5639CDWRG4 by Texas Instruments. As a leader in digital-to-analog converters, Texas Instruments offers unparalleled quality and performance in every product. Ideal for a wide range of applications, this converter provides a seamless transition from digital to analog signals, ensuring accurate and efficient data conversion. Experience the value and benefits of Texas Instruments' expertise with the TLV5639CDWRG4, where innovation meets excellence.

Feature Benefit Bullets

Maximum Analog Output Voltage: 5.1 V

Higher maximum analog output voltage allows for greater flexibility in output signal range, making this product suitable for a wide range of applications.

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and cost-effective, without compromising on durability.

No. of Bits: 12

A higher number of bits allows for finer resolution in the conversion process, resulting in more accurate analog output, which is ideal for high precision applications.

Maximum Settling Time: 7 us

The fast settling time ensures that the output signal stabilizes quickly after changes in input, improving overall performance and responsiveness of the product.

Maximum Linearity Error (EL): 0.0732 %

Low linearity error ensures that the output signal closely matches the input signal, enhancing the overall accuracy and fidelity of the conversion process.

Nominal Supply Voltage: 3 V

Having a low nominal supply voltage makes the product energy-efficient, reducing power consumption and heat generation, which is beneficial for battery-powered devices or applications sensitive to power usage.

Technical Specifications

Digital-to-Analog Converters TLV5639CDWRG4 attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Technology:

CMOS

Sub-Category:

Other Converters

Input Format:

Parallel, Word

Input Bit Code:

Binary

Maximum Linearity Error (EL):

0.0732 %

Nominal Settling Time (tstl):

3.5 µs

Maximum Supply Current:

2.8 mA

Maximum Settling Time:

7 µs

No. of Bits:

12

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

3 V

Minimum Analog Output Voltage:

0 V

Maximum Analog Output Voltage:

5.1 V

Operating Conditions

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Form Factor

No. of Terminals:

20

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.295 in (7.5 mm)

Length:

0.504 in (12.8 mm)

Maximum Seated Height:

0.104 in (2.65 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Standards and Codes

Qualified:

No

JESD-30 Code:

R-PDSO-G20

Trade Compliance

TLV5639CDWRG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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