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TLV5637CDR

Texas Instruments

TLV5637CDR by Texas Instruments

TLV5637CDR by Texas Instruments is a 10-bit D/A converter with max analog output voltage of 2.9V and settling time of 5.5us. Ideal for applications requiring precise voltage outputs in commercial temperature range, it operates on 3/5V supplies with low power consumption at 7mA.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,239 parts In-Stock

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7,239

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Digiode

USA . 4,995 parts In-Stock

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4,995

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Distributors (Availability)

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AZTECH Wire

Italy . 514 parts In-Stock

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$6.416

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514

$6.416

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Microchip USA

USA . 2,406 parts In-Stock

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$14.070

100+ parts

$13.860

1k+ parts

$13.760

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$13.660

2,406

$14.070

$13.860

$13.760

$13.660

One Stop Electronics

USA . 950 parts In-Stock

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$19.000

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950

$19.000

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Parana Technologies

USA . 581 parts In-Stock

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$22.487

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$23.153

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581

$22.487

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$23.153

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DigiPath Technology Company

USA . 1,315 parts In-Stock

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$24.761

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$22.780

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1,315

$24.761

$22.780

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ChromeModa Solutions

Germany . 6,553 parts In-Stock

1+ parts

$25.266

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$20.718

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6,553

$25.266

$20.718

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IDEA Electronic Components Group

UK . 1,303 parts In-Stock

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$25.266

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$24.003

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$22.739

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$25.266

$24.003

$22.739

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Lixinc

USA . 10,941 parts In-Stock

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A-Z Elektronik GmbH

Germany . 8,888 parts In-Stock

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Kepictronics

USA . 2,285 parts In-Stock

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Corphita

USA . 2,154 parts In-Stock

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Perfect Parts

USA . 6 parts In-Stock

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Overview

Unlock unparalleled precision and reliability with the TLV5637CDR from Texas Instruments, a leading manufacturer in the industry. This 10-bit digital-to-analog converter offers a maximum analog output voltage of 2.9V, making it ideal for a wide range of applications. With fast settling times and minimal linearity errors, this small outline package delivers exceptional performance. Trust Texas Instruments to provide cutting-edge technology that exceeds expectations, providing customers with unmatched value and quality. Elevate your designs with the TLV5637CDR and experience the difference today.

Feature Benefit Bullets

Maximum Analog Output Voltage: 2.9 V

Provides a high output voltage, which allows for a wide range of signal levels to be accurately converted.

Package Body Material: PLASTIC/EPOXY

Durable and reliable material for the package body, ensuring the longevity and stability of the converter.

Surface Mount: YES

Easy to integrate and install on circuit boards, making it suitable for mass production and compact designs.

No. of Bits: 10

Offers high precision and resolution in converting digital signals to analog, resulting in accurate output values.

Maximum Settling Time: 5.5 us

Fast settling time ensures quick response and stability in output voltage, suitable for real-time applications.

Power Supplies (V): 3/5

Versatility in power supply options allows for compatibility with different systems and requirements.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, enhancing overall performance and efficiency.

Technical Specifications

Digital-to-Analog Converters TLV5637CDR attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Technology:

CMOS

Sub-Category:

Other Converters

Input Format:

Serial

Input Bit Code:

Binary

Maximum Linearity Error (EL):

0.0977 %

Nominal Settling Time (tstl):

800 ns

Maximum Supply Current:

7 mA

Maximum Settling Time:

5.5 µs

Sample Rate:

278 kHz

No. of Bits:

10

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

3 V

Minimum Analog Output Voltage:

0 V

Maximum Analog Output Voltage:

2.9 V

Power Supplies:

3/5 V

Operating Conditions

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Moisture Sensitivity Level (MSL):

1

Form Factor

No. of Terminals:

8

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Finish:

Nickel Palladium Gold

Surface Mount:

Yes

Width:

0.154 in (3.9 mm)

Length:

0.193 in (4.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Standards and Codes

Qualified:

No

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Trade Compliance

TLV5637CDR Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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