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TLV5624IDR

Texas Instruments

TLV5624IDR by Texas Instruments

TLV5624IDR by Texas Instruments is an 8-bit DAC with max output voltage of 2.9V, settling time of 7us, and linearity error of 0.1953%. Ideal for industrial applications requiring precise analog signal generation in a compact package. Operates at temperatures ranging from -40 to 85°C with low supply current of 3.3mA.

Median Price

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Lifecycle Status

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6

In-Stock Inventory

1k+

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Vyrian

USA . 4,131 parts In-Stock

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Digiode

USA . 3,522 parts In-Stock

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Bristol Electronics

USA . 1,390 parts In-Stock

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ComSIT Distribution GmbH

Germany . 1,255 parts In-Stock

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Chip Stock

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LWI Electronics Inc

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AZTECH Wire

Italy . 498 parts In-Stock

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$6.967

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Parana Technologies

USA . 842 parts In-Stock

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$9.121

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$9.773

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DigiPath Technology Company

USA . 1,329 parts In-Stock

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$10.043

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$9.240

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IDEA Electronic Components Group

UK . 995 parts In-Stock

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$10.248

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$9.736

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$9.223

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ChromeModa Solutions

Germany . 933 parts In-Stock

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$10.248

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$8.403

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Microchip USA

USA . 3,200 parts In-Stock

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$16.660

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$16.560

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$16.510

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One Stop Electronics

USA . 1,265 parts In-Stock

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Component Stockers USA

USA . 2,381 parts In-Stock

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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Kepictronics

USA . 2,500 parts In-Stock

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Computer Components Inc. - USA

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Corphita

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Overview

Unlock the power of precision with the TLV5624IDR by Texas Instruments. This top-of-the-line Digital-to-Analog Converter offers unparalleled quality and reliability, making it a must-have for your next project. With a wide range of applications in industrial settings, this versatile converter delivers fast settling times and exceptional linearity error rates. Trust Texas Instruments to provide cutting-edge technology that meets your needs and exceeds your expectations. Elevate your designs with the TLV5624IDR and experience the difference today.

Feature Benefit Bullets

Maximum Analog Output Voltage: 2.9 V

High maximum analog output voltage allows for versatile signal outputs.

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and insulation for the components.

Surface Mount: YES

Easy to install and saves space on circuit boards.

No. of Bits: 8

Good resolution for converting digital signals to analog.

Maximum Settling Time: 7 us

Fast settling time ensures accurate and reliable output.

Power Supplies (V): 3/5

Compatible with common power supply voltages.

Maximum Operating Temperature: 85 °C

Suitable for industrial environments with varying temperature conditions.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity.

Sample Rate: 0.233 MHz

Decent sample rate for processing digital signals efficiently.

Converter Type: D/A CONVERTER

Specifically designed for converting digital signals to analog output.

Technical Specifications

Digital-to-Analog Converters TLV5624IDR attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Technology:

CMOS

Sub-Category:

Other Converters

Input Format:

Serial

Input Bit Code:

Binary

Maximum Linearity Error (EL):

0.1953 %

Nominal Settling Time (tstl):

1 µs

Maximum Supply Current:

3.3 mA

Maximum Settling Time:

7 µs

Sample Rate:

233 kHz

No. of Bits:

8

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

3 V

Minimum Analog Output Voltage:

0 V

Maximum Analog Output Voltage:

2.9 V

Power Supplies:

3/5 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Moisture Sensitivity Level (MSL):

1

Form Factor

No. of Terminals:

8

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Finish:

Nickel Palladium Gold

Surface Mount:

Yes

Width:

0.154 in (3.9 mm)

Length:

0.193 in (4.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Standards and Codes

Qualified:

No

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Trade Compliance

TLV5624IDR Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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