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TLV5624CDGKR

Texas Instruments

TLV5624CDGKR by Texas Instruments

TLV5624CDGKR by Texas Instruments is an 8-bit DAC with max output voltage of 2.9V, settling time of 7us, and linearity error of 0.1953%. Ideal for applications requiring fast response times and precise analog signal generation in commercial temperature range.

Median Price

$3.925

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 11,716 parts In-Stock

1+ parts

-

100+ parts

$3.140

1k+ parts

$2.810

10k+ parts

$2.640

11,716

-

$3.140

$2.810

$2.640

DigiKey

USA . 11,716 parts In-Stock

1+ parts

-

100+ parts

$4.130

1k+ parts

-

10k+ parts

-

11,716

-

$4.130

-

-

Verical

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

$3.925

1k+ parts

$3.513

10k+ parts

$3.300

5,000

-

$3.925

$3.513

$3.300

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 826 parts In-Stock

1+ parts

$2.679

100+ parts

-

1k+ parts

-

10k+ parts

-

826

$2.679

-

-

-

DigiKey Marketplace

USA . 19,716 parts In-Stock

1+ parts

-

100+ parts

$2.590

1k+ parts

-

10k+ parts

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19,716

-

$2.590

-

-

Vyrian

USA . 7,957 parts In-Stock

1+ parts

-

100+ parts

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7,957

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-

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Chip Stock

USA . 5,808 parts In-Stock

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5,808

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Semi Source

USA . 142 parts In-Stock

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142

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-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,969 parts In-Stock

1+ parts

$2.538

100+ parts

-

1k+ parts

-

10k+ parts

-

1,969

$2.538

-

-

-

Parana Technologies

USA . 786 parts In-Stock

1+ parts

$7.477

100+ parts

-

1k+ parts

$7.968

10k+ parts

-

786

$7.477

-

$7.968

-

DigiPath Technology Company

USA . 382 parts In-Stock

1+ parts

$8.233

100+ parts

$7.574

1k+ parts

-

10k+ parts

-

382

$8.233

$7.574

-

-

ChromeModa Solutions

Germany . 3,376 parts In-Stock

1+ parts

$8.401

100+ parts

$6.889

1k+ parts

-

10k+ parts

-

3,376

$8.401

$6.889

-

-

IDEA Electronic Components Group

UK . 1,267 parts In-Stock

1+ parts

$8.401

100+ parts

$7.981

1k+ parts

$7.561

10k+ parts

-

1,267

$8.401

$7.981

$7.561

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Microchip USA

USA . 3,950 parts In-Stock

1+ parts

$15.957

100+ parts

-

1k+ parts

-

10k+ parts

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3,950

$15.957

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-

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Kepictronics

USA . 2,500 parts In-Stock

1+ parts

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2,500

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Overview

Unlock the power of precision with the TLV5624CDGKR by Texas Instruments. This cutting-edge Digital-to-Analog Converter offers unparalleled quality and reliability, backed by the trusted reputation of TI. Perfect for a range of applications, from industrial automation to consumer electronics, this product delivers accurate analog output voltage with lightning-fast settling time. Experience the value and innovation that only Texas Instruments can provide, and elevate your designs to new heights with the TLV5624CDGKR.

Feature Benefit Bullets

Maximum Analog Output Voltage: 2.9 V

This high maximum analog output voltage allows for a wide range of output signals, making the product suitable for a variety of applications.

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body ensures durability and reliability of the product while keeping it lightweight.

Surface Mount: YES

Being surface mountable makes the product easy to integrate into electronic circuits, facilitating efficient assembly processes.

No. of Bits: 8

An 8-bit resolution provides a good balance between accuracy and cost, making the product suitable for a wide range of applications.

Maximum Settling Time: 7 us

The fast settling time ensures that the output reaches the desired value quickly, contributing to the overall performance of the product.

Power Supplies (V): 3/5

The product supports dual power supply voltages of 3V and 5V, offering flexibility in system design and compatibility with different power sources.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, the product can operate reliably in a variety of environmental conditions.

Sample Rate: 0.233 MHz

The high sample rate of 0.233 MHz allows for fast and accurate conversion of digital signals to analog, making the product suitable for real-time applications.

Technical Specifications

Digital-to-Analog Converters TLV5624CDGKR attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Technology:

CMOS

Sub-Category:

Other Converters

Input Format:

Serial

Input Bit Code:

Binary

Maximum Linearity Error (EL):

0.1953 %

Nominal Settling Time (tstl):

1 µs

Maximum Supply Current:

3.3 mA

Maximum Settling Time:

7 µs

Sample Rate:

233 kHz

No. of Bits:

8

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

3 V

Minimum Analog Output Voltage:

0 V

Maximum Analog Output Voltage:

2.9 V

Power Supplies:

3/5 V

Operating Conditions

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Moisture Sensitivity Level (MSL):

1

Form Factor

No. of Terminals:

8

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Finish:

Nickel Palladium Gold Silver

Surface Mount:

Yes

Width:

0.118 in (3 mm)

Length:

0.118 in (3 mm)

Maximum Seated Height:

0.043 in (1.1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Code:

Package Equivalence Code:

SSOP8,.19

Standards and Codes

Qualified:

No

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Trade Compliance

TLV5624CDGKR Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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