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TLV5623IDR

Texas Instruments

TLV5623IDR by Texas Instruments

TLV5623IDR by Texas Instruments is an 8-bit D/A converter with a max analog output voltage of 5.4 V and settling time of 20 us. Ideal for industrial applications, it operates at temperatures ranging from -40 to 85 °C and has a sample rate of 0.102 MHz.

Median Price

$2.450

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 45,232 parts In-Stock

1+ parts

-

100+ parts

$2.190

1k+ parts

$1.960

10k+ parts

$1.850

45,232

-

$2.190

$1.960

$1.850

DigiKey

USA . 45,232 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.890

10k+ parts

-

45,232

-

-

$2.890

-

Verical

USA . 45,232 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.450

10k+ parts

$2.313

45,232

-

-

$2.450

$2.313

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,895 parts In-Stock

1+ parts

$1.900

100+ parts

-

1k+ parts

-

10k+ parts

-

1,895

$1.900

-

-

-

Chip Stock

USA . 3,850 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,850

-

-

-

-

Vyrian

USA . 3,014 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,014

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,564 parts In-Stock

1+ parts

$1.800

100+ parts

-

1k+ parts

-

10k+ parts

-

3,564

$1.800

-

-

-

Microchip USA

USA . 2,514 parts In-Stock

1+ parts

$10.860

100+ parts

$10.800

1k+ parts

$10.760

10k+ parts

$10.730

2,514

$10.860

$10.800

$10.760

$10.730

Parana Technologies

USA . 1,524 parts In-Stock

1+ parts

$15.750

100+ parts

-

1k+ parts

$16.111

10k+ parts

-

1,524

$15.750

-

$16.111

-

DigiPath Technology Company

USA . 1,344 parts In-Stock

1+ parts

$17.343

100+ parts

-

1k+ parts

-

10k+ parts

-

1,344

$17.343

-

-

-

ChromeModa Solutions

Germany . 2,272 parts In-Stock

1+ parts

$17.697

100+ parts

$14.512

1k+ parts

-

10k+ parts

-

2,272

$17.697

$14.512

-

-

IDEA Electronic Components Group

UK . 166 parts In-Stock

1+ parts

$17.697

100+ parts

$16.812

1k+ parts

$15.927

10k+ parts

-

166

$17.697

$16.812

$15.927

-

Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

-

-

-

-

A-Z Elektronik GmbH

Germany . 221 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

221

-

-

-

-

Overview

Enhance your electronic designs with the Texas Instruments TLV5623IDR Digital-to-Analog Converter. Known for their top-notch quality and reliability, Texas Instruments offers a wide range of applications for this product category. The TLV5623IDR provides fast settling times, high linearity accuracy, and low power consumption, making it an ideal choice for industrial-grade projects. Trust in Texas Instruments to deliver superior performance and value in every product they offer. Upgrade your designs today with the TLV5623IDR!

Feature Benefit Bullets

Maximum Analog Output Voltage: 5.4 V

The high maximum analog output voltage allows for a wide range of output levels, providing flexibility in the signal output.

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to external elements, making the product reliable for long-term use.

Surface Mount: YES

Being surface mountable makes installation and integration of the product easy and convenient in electronic circuit designs.

No. of Bits: 8

With 8 bits of resolution, the converter can provide fine-grained output accuracy for precise analog signal generation.

Maximum Settling Time: 20 us

The fast settling time ensures quick and accurate output response, essential for real-time applications.

Power Supplies (V): 3/5

Support for both 3V and 5V power supplies allows versatility in powering the device, making it compatible with a wide range of systems.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range ensures reliable performance even in harsh industrial environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the overall efficiency and reliability of the product.

Sample Rate: 0.102 MHz

With a high sample rate, the converter can accurately process and reproduce input signals, ensuring high fidelity in analog output.

Technical Specifications

Digital-to-Analog Converters TLV5623IDR attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Technology:

CMOS

Sub-Category:

Other Converters

Input Format:

Serial

Input Bit Code:

Binary

Maximum Linearity Error (EL):

0.1953 %

Nominal Settling Time (tstl):

3 µs

Maximum Supply Current:

1.35 mA

Maximum Settling Time:

20 µs

Sample Rate:

102 kHz

No. of Bits:

8

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

3 V

Minimum Analog Output Voltage:

0 V

Maximum Analog Output Voltage:

5.4 V

Power Supplies:

3/5 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Moisture Sensitivity Level (MSL):

1

Form Factor

No. of Terminals:

8

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Finish:

Nickel Palladium Gold

Surface Mount:

Yes

Width:

0.154 in (3.9 mm)

Length:

0.193 in (4.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline

Package Code:

SOP

Package Equivalence Code:

SOP8,.19

Standards and Codes

Qualified:

No

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Trade Compliance

TLV5623IDR Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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