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TLV5623IDGKR

Texas Instruments

TLV5623IDGKR by Texas Instruments

TLV5623IDGKR by Texas Instruments is an 8-bit D/A converter with a max analog output voltage of 5.4 V and settling time of 20 us. It operates on power supplies of 3/5 V, suitable for industrial applications requiring precise voltage outputs in a compact package. With a sample rate of 0.102 MHz, it offers high linearity and low supply current for efficient performance.

Median Price

$1.244

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 41 parts In-Stock

1+ parts

$1.244

100+ parts

-

1k+ parts

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41

$1.244

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Vyrian

USA . 7,858 parts In-Stock

1+ parts

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7,858

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Digiode

USA . 1,659 parts In-Stock

1+ parts

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1,659

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-

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Sea View Technologies

USA . 656 parts In-Stock

1+ parts

-

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656

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Bristol Electronics

USA . 656 parts In-Stock

1+ parts

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656

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 5,744 parts In-Stock

1+ parts

$1.244

100+ parts

-

1k+ parts

-

10k+ parts

$1.219

5,744

$1.244

-

-

$1.219

Argo Parts USA

USA . 4,421 parts In-Stock

1+ parts

$1.244

100+ parts

-

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4,421

$1.244

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-

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Netroflash

USA . 500 parts In-Stock

1+ parts

$1.244

100+ parts

-

1k+ parts

$1.182

10k+ parts

$1.157

500

$1.244

-

$1.182

$1.157

Microchip USA

USA . 2,151 parts In-Stock

1+ parts

$10.860

100+ parts

$10.800

1k+ parts

$10.760

10k+ parts

$10.730

2,151

$10.860

$10.800

$10.760

$10.730

AZTECH Wire

Italy . 217 parts In-Stock

1+ parts

$14.777

100+ parts

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217

$14.777

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Parana Technologies

USA . 2,127 parts In-Stock

1+ parts

$15.025

100+ parts

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1k+ parts

$15.440

10k+ parts

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2,127

$15.025

-

$15.440

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DigiPath Technology Company

USA . 2,316 parts In-Stock

1+ parts

$16.544

100+ parts

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2,316

$16.544

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ChromeModa Solutions

Germany . 4,969 parts In-Stock

1+ parts

$16.882

100+ parts

$13.843

1k+ parts

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4,969

$16.882

$13.843

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IDEA Electronic Components Group

UK . 1,278 parts In-Stock

1+ parts

$16.882

100+ parts

$16.038

1k+ parts

$15.194

10k+ parts

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1,278

$16.882

$16.038

$15.194

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Ampacity Inc.

Singapore . 575 parts In-Stock

1+ parts

$20.000

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575

$20.000

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Component Stockers USA

USA . 2,228 parts In-Stock

1+ parts

$21.410

100+ parts

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2,228

$21.410

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One Stop Electronics

USA . 227 parts In-Stock

1+ parts

$32.000

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227

$32.000

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Lixinc

USA . 8,686 parts In-Stock

1+ parts

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8,686

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A-Z Elektronik GmbH

Germany . 4,760 parts In-Stock

1+ parts

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4,760

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Corphita

USA . 979 parts In-Stock

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979

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Kepictronics

USA . 123 parts In-Stock

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123

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Overview

Unlock the power of precision with the TLV5623IDGKR by Texas Instruments. This high-quality digital-to-analog converter offers unparalleled performance and reliability, making it the ideal choice for a wide range of applications. Whether you're designing industrial control systems or audio equipment, this versatile converter delivers exceptional value and benefits. Trust Texas Instruments for cutting-edge technology and innovative solutions that meet your needs. Elevate your designs with the TLV5623IDGKR and experience superior quality like never before.

Feature Benefit Bullets

Maximum Analog Output Voltage: 5.4 V

High maximum analog output voltage allows for a wide range of signal output possibilities, making this product versatile in various applications.

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and protection for the internal components of the converter.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and simplifying the assembly process.

No. of Bits: 8

With 8 bits, this converter can provide precise and accurate analog output, suitable for a wide range of applications.

Maximum Settling Time: 20 us

Fast settling time ensures quick response and accuracy in converting digital signals to analog output.

Power Supplies (V): 3/5

Support for multiple power supply options (3V/5V) allows for flexibility in different circuit configurations.

Maximum Operating Temperature: 85 °C

Wide operating temperature range enables reliable performance in various environmental conditions.

Technical Specifications

Digital-to-Analog Converters TLV5623IDGKR attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Technology:

CMOS

Sub-Category:

Other Converters

Input Format:

Serial

Input Bit Code:

Binary

Maximum Linearity Error (EL):

0.1953 %

Nominal Settling Time (tstl):

3 µs

Maximum Supply Current:

1.35 mA

Maximum Settling Time:

20 µs

Sample Rate:

102 kHz

No. of Bits:

8

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

3 V

Minimum Analog Output Voltage:

0 V

Maximum Analog Output Voltage:

5.4 V

Power Supplies:

3/5 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Moisture Sensitivity Level (MSL):

1

Form Factor

No. of Terminals:

8

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Finish:

Nickel Palladium Gold Silver

Surface Mount:

Yes

Width:

0.118 in (3 mm)

Length:

0.118 in (3 mm)

Maximum Seated Height:

0.043 in (1.1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Code:

Package Equivalence Code:

SSOP8,.19

Standards and Codes

Qualified:

No

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Trade Compliance

TLV5623IDGKR Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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