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TLV5619QDWR

Texas Instruments

TLV5619QDWR by Texas Instruments

TLV5619QDWR by Texas Instruments is a 12-bit DAC with max output voltage of 2.9V, settling time of 3us, and linearity error of 0.0977%. Ideal for automotive applications due to its CMOS technology, parallel input format, and low supply current of 3mA.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,291 parts In-Stock

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Vyrian

USA . 2,677 parts In-Stock

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2,677

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AZTECH Wire

Italy . 554 parts In-Stock

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$17.617

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Parana Technologies

USA . 446 parts In-Stock

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$18.008

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$1,672.340

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$16.207

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DigiPath Technology Company

USA . 2,263 parts In-Stock

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$19.829

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IDEA Electronic Components Group

UK . 1,890 parts In-Stock

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$20.234

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$19.222

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$18.211

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ChromeModa Solutions

Germany . 194 parts In-Stock

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$20.234

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$16.592

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One Stop Electronics

USA . 1,225 parts In-Stock

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$30.000

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Kepictronics

USA . 2,600 parts In-Stock

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Corphita

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Microchip USA

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Overview

Unlock the power of precision with the TLV5619QDWR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality digital-to-analog converters that guarantee exceptional performance and reliability. Perfect for a wide range of applications, this innovative product offers customers unmatched value and benefits. Experience seamless operation, high accuracy, and superior output voltage control with the TLV5619QDWR. Elevate your projects to new heights with Texas Instruments at your side.

Feature Benefit Bullets

Maximum Analog Output Voltage: 2.9 V

Provides a high maximum analog output voltage, allowing for a wide range of output levels and flexibility in signal processing.

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability in various operating conditions.

Surface Mount: YES

Enables easy and convenient installation on circuit boards, saving space and reducing assembly time.

No. of Bits: 12

Offers high resolution and accuracy in converting digital signals to analog, resulting in precise output signals.

Maximum Settling Time: 3 us

Allows for fast settling time, ensuring minimal delay in signal conversion and delivery.

Power Supplies (V): 3/5

Compatible with a wide range of power supplies, offering flexibility in application and power source selection.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on circuit boards and allows for compact device design.

Maximum Operating Temperature: 125 °C

Capable of operating in high-temperature environments, making it suitable for a wide range of industrial applications.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive industry standards, ensuring reliability and performance in automotive applications.

Technology: CMOS

Utilizes CMOS technology for low power consumption, high noise immunity, and high speed operation.

Technical Specifications

Digital-to-Analog Converters TLV5619QDWR attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Technology:

CMOS

Sub-Category:

Other Converters

Input Format:

Parallel, Word

Input Bit Code:

Binary

Maximum Linearity Error (EL):

0.0977 %

Nominal Settling Time (tstl):

1 µs

Maximum Supply Current:

3 mA

Maximum Settling Time:

3 µs

No. of Bits:

12

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

3 V

Minimum Analog Output Voltage:

0 V

Maximum Analog Output Voltage:

2.9 V

Power Supplies:

3/5 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Form Factor

No. of Terminals:

20

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.295 in (7.5 mm)

Length:

0.504 in (12.8 mm)

Maximum Seated Height:

0.104 in (2.65 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Standards and Codes

Qualified:

No

JESD-30 Code:

R-PDSO-G20

Trade Compliance

TLV5619QDWR Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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