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TLV5619CDWR

Texas Instruments

TLV5619CDWR by Texas Instruments

TLV5619CDWR by Texas Instruments is a 12-bit DAC with max output voltage of 2.9V, settling time of 3us, and linearity error of 0.0977%. Ideal for applications requiring fast response times and precise analog signal generation in commercial temperature range.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 10,680 parts In-Stock

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Vyrian

USA . 3,757 parts In-Stock

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3,757

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Digiode

USA . 716 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 3 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 673 parts In-Stock

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$8.918

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673

$8.918

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Microchip USA

USA . 4,560 parts In-Stock

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$19.180

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$18.900

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$18.770

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$18.630

4,560

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$18.630

Parana Technologies

USA . 1,390 parts In-Stock

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$22.225

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$22.886

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$22.225

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DigiPath Technology Company

USA . 1,021 parts In-Stock

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$24.473

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$24.473

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IDEA Electronic Components Group

UK . 2,032 parts In-Stock

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$24.972

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$23.723

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$22.475

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2,032

$24.972

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$22.475

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ChromeModa Solutions

Germany . 1,127 parts In-Stock

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$24.972

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$20.477

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$24.972

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One Stop Electronics

USA . 1,368 parts In-Stock

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$35.000

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Corphita

USA . 934 parts In-Stock

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Overview

Unlock the power of precision with the TLV5619CDWR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality digital-to-analog converters ideal for a wide range of applications. This innovative product offers customers unparalleled value, benefits, and advantages, making it the ultimate choice for your analog output needs. Experience superior performance and reliability with the TLV5619CDWR, setting new standards in efficiency and accuracy. Elevate your projects with this cutting-edge solution today.

Feature Benefit Bullets

Maximum Analog Output Voltage: 2.9 V

Provides a high maximum analog output voltage for accurate and precise conversion.

No. of Bits: 12

Offers a high resolution with 12 bits for detailed and accurate conversion.

Maximum Settling Time: 3 us

Fast settling time ensures quick and efficient conversion.

Power Supplies (V): 3/5

Allows flexibility in power supply options with support for 3V and 5V.

Maximum Operating Temperature: 70 °C

Wide operating temperature range suitable for various environments.

Sample Rate: 1 MHz

High sampling rate of 1 MHz enables real-time and high-speed conversion.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity.

Technical Specifications

Digital-to-Analog Converters TLV5619CDWR attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Technology:

CMOS

Sub-Category:

Other Converters

Input Format:

Parallel, Word

Input Bit Code:

Binary

Maximum Linearity Error (EL):

0.0977 %

Nominal Settling Time (tstl):

1 µs

Maximum Supply Current:

3 mA

Maximum Settling Time:

3 µs

Sample Rate:

1 MHz

No. of Bits:

12

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

3 V

Minimum Analog Output Voltage:

0 V

Maximum Analog Output Voltage:

2.9 V

Power Supplies:

3/5 V

Operating Conditions

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Moisture Sensitivity Level (MSL):

1

Form Factor

No. of Terminals:

20

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Finish:

Nickel Palladium Gold

Surface Mount:

Yes

Width:

0.295 in (7.5 mm)

Length:

0.504 in (12.8 mm)

Maximum Seated Height:

0.104 in (2.65 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Standards and Codes

Qualified:

No

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Trade Compliance

TLV5619CDWR Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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