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TLV5604IDRG4

Texas Instruments

TLV5604IDRG4 by Texas Instruments

TLV5604IDRG4 by Texas Instruments is a 10-bit DAC with max output voltage of 5.1V, settling time of 18us, and linearity error of 0.0977%. Ideal for industrial applications requiring precise analog signal generation in compact spaces due to its small outline package and low power consumption.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,867 parts In-Stock

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Digiode

USA . 225 parts In-Stock

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225

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Distributors (Availability)

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One Stop Electronics

USA . 1,204 parts In-Stock

1+ parts

$6.000

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1,204

$6.000

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AZTECH Wire

Italy . 398 parts In-Stock

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$15.800

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$15.800

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Parana Technologies

USA . 2,104 parts In-Stock

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$23.814

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$24.450

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2,104

$23.814

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$24.450

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ChromeModa Solutions

Germany . 4,996 parts In-Stock

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$26.757

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$21.941

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4,996

$26.757

$21.941

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IDEA Electronic Components Group

UK . 2,242 parts In-Stock

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$26.757

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$25.419

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$24.081

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2,242

$26.757

$25.419

$24.081

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Component Stockers USA

USA . 572 parts In-Stock

1+ parts

$99.990

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572

$99.990

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DigiPath Technology Company

USA . 1,578 parts In-Stock

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$24.124

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$24.124

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Corphita

USA . 656 parts In-Stock

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Microchip USA

USA . 255 parts In-Stock

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Kepictronics

USA . 120 parts In-Stock

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Overview

Experience the exceptional quality and precision of the Texas Instruments TLV5604IDRG4 Digital-to-Analog Converter. Known for their reliable manufacturing standards, Texas Instruments delivers top-notch products that meet the highest industry standards. Ideal for a wide range of applications, this converter provides accurate analog output voltage with minimal error. With fast settling times and low power consumption, this compact device offers outstanding value and performance for all your digital-to-analog conversion needs. Trust Texas Instruments to deliver excellence in every product they create.

Feature Benefit Bullets

Maximum Analog Output Voltage: 5.1 V

High maximum output voltage allows for a wide range of analog signal outputs, making this product suitable for a variety of applications.

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ensuring long-term reliability and ease of handling.

Surface Mount: YES

Surface mount capability simplifies PCB assembly and allows for efficient use of board space, ideal for compact electronic designs.

No. of Bits: 10

With 10 bits of resolution, this converter provides precise analog output signals, suitable for applications requiring high accuracy.

Maximum Settling Time: 18 us

Fast settling time ensures quick and accurate conversion of digital signals to analog output, making it ideal for real-time applications.

Power Supplies (V): 3/5

Compatible with both 3V and 5V power supplies, providing flexibility in system design and compatibility with different voltage requirements.

Maximum Operating Temperature: 85 °C

Wide operating temperature range allows for reliable performance in harsh environmental conditions, suitable for industrial applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the converter energy-efficient and reliable in various operating conditions.

Technical Specifications

Digital-to-Analog Converters TLV5604IDRG4 attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Technology:

CMOS

Sub-Category:

Other Converters

Input Format:

Serial

Input Bit Code:

Binary

Maximum Linearity Error (EL):

0.0977 %

Nominal Settling Time (tstl):

8.5 µs

Maximum Supply Current:

5.5 mA

Maximum Settling Time:

18 µs

No. of Bits:

10

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

3 V

Minimum Analog Output Voltage:

0 V

Maximum Analog Output Voltage:

5.1 V

Power Supplies:

3/5 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

No. of Terminals:

16

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.154 in (3.9 mm)

Length:

0.39 in (9.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Standards and Codes

Qualified:

No

JESD-30 Code:

R-PDSO-G16

Trade Compliance

TLV5604IDRG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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