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TLV320AIC33IZXH

Texas Instruments

TLV320AIC33IZXH by Texas Instruments

TLV320AIC33IZXH by Texas Instruments is a consumer IC with 80 terminals in a grid array package. It operates b/w -40 to 85°C, with supply voltage range of 2.7-3.6V. Ideal for applications requiring fine pitch and low profile designs like portable audio devices.

Median Price

$14.550

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 576 parts In-Stock

1+ parts

$14.550

100+ parts

$9.340

1k+ parts

$8.300

10k+ parts

-

576

$14.550

$9.340

$8.300

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 377 parts In-Stock

1+ parts

$11.419

100+ parts

-

1k+ parts

-

10k+ parts

-

377

$11.419

-

-

-

Vyrian

USA . 6,893 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,893

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,088 parts In-Stock

1+ parts

$2.157

100+ parts

-

1k+ parts

$2.670

10k+ parts

-

1,088

$2.157

-

$2.670

-

DigiPath Technology Company

USA . 910 parts In-Stock

1+ parts

$2.376

100+ parts

-

1k+ parts

-

10k+ parts

-

910

$2.376

-

-

-

ChromeModa Solutions

Germany . 5,493 parts In-Stock

1+ parts

$2.424

100+ parts

$1.988

1k+ parts

-

10k+ parts

-

5,493

$2.424

$1.988

-

-

IDEA Electronic Components Group

UK . 362 parts In-Stock

1+ parts

$2.424

100+ parts

-

1k+ parts

$2.182

10k+ parts

-

362

$2.424

-

$2.182

-

Semicontronic

India . 526 parts In-Stock

1+ parts

$10.220

100+ parts

$9.964

1k+ parts

$9.913

10k+ parts

-

526

$10.220

$9.964

$9.913

-

Ampacity Inc.

Singapore . 267 parts In-Stock

1+ parts

$10.220

100+ parts

-

1k+ parts

-

10k+ parts

-

267

$10.220

-

-

-

Corphita

USA . 2,275 parts In-Stock

1+ parts

$10.818

100+ parts

-

1k+ parts

-

10k+ parts

-

2,275

$10.818

-

-

-

Corohmni

South Africa . 436 parts In-Stock

1+ parts

$12.020

100+ parts

-

1k+ parts

-

10k+ parts

-

436

$12.020

-

-

-

Microchip USA

USA . 2,397 parts In-Stock

1+ parts

$23.700

100+ parts

$23.360

1k+ parts

$23.190

10k+ parts

$23.030

2,397

$23.700

$23.360

$23.190

$23.030

Overview

Experience unparalleled sound quality and performance with the TLV320AIC33IZXH by Texas Instruments. As a leader in the industry, Texas Instruments brings you cutting-edge technology in consumer ICs, ensuring top-notch reliability and functionality. This versatile product is perfect for a wide range of applications, offering customers exceptional value and benefits. Upgrade your audio experience today with the TLV320AIC33IZXH and enjoy the advantages of superior sound processing in a compact and durable package.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for portable consumer electronics.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards, saving time and space.

Package Shape: SQUARE

Square package shape allows for more efficient use of space on a circuit board compared to other shapes, maximizing design flexibility.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can withstand temperature fluctuations and continue to operate reliably in various environments.

Minimum Supply Voltage (Vsup): 2.7 V

Low minimum supply voltage ensures compatibility with a wide range of power sources, making this IC versatile and suitable for different applications.

Technical Specifications

Other Function Consumer ICs TLV320AIC33IZXH attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 1.65V TO 1.95V SUPPLY

General IC Type:

JESD-30 Code:

S-PBGA-B80

JESD-609 Code:

e1

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA80,9X9,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

5 mm

Trade Compliance

TLV320AIC33IZXH General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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