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TLV320AIC23IPWRG4

Texas Instruments

TLV320AIC23IPWRG4 by Texas Instruments

TLV320AIC23IPWRG4 by Texas Instruments is a consumer IC with power supplies of 1.5V and 3.3V, operating temperature range from -40 to 85°C, and terminal pitch of 0.65mm. It is used in industrial applications requiring small outline, thin profile packages for audio processing circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,931 parts In-Stock

1+ parts

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3,931

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Vyrian

USA . 2,944 parts In-Stock

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2,944

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,830 parts In-Stock

1+ parts

$2.362

100+ parts

-

1k+ parts

$2.861

10k+ parts

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1,830

$2.362

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$2.861

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ChromeModa Solutions

Germany . 3,301 parts In-Stock

1+ parts

$2.654

100+ parts

$2.176

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3,301

$2.654

$2.176

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IDEA Electronic Components Group

UK . 512 parts In-Stock

1+ parts

$2.654

100+ parts

-

1k+ parts

$2.389

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512

$2.654

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$2.389

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One Stop Electronics

USA . 895 parts In-Stock

1+ parts

$12.800

100+ parts

-

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895

$12.800

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AZTECH Wire

Italy . 597 parts In-Stock

1+ parts

$14.631

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597

$14.631

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QUARKTWIN TECHNOLOGY LTD

USA . 29,681 parts In-Stock

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29,681

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Corphita

USA . 4,887 parts In-Stock

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4,887

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Microchip USA

USA . 355 parts In-Stock

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355

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DigiPath Technology Company

USA . 98 parts In-Stock

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$2.393

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98

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$2.393

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Overview

Enhance your audio experience with the TLV320AIC23IPWRG4 by Texas Instruments. As a leader in semiconductor manufacturing, Texas Instruments ensures top-notch quality and reliability in their products. This consumer IC is versatile and can be used in various applications. With its small outline and thin profile package style, it offers convenience without compromising performance. Whether you're looking to improve sound quality in your devices or enhance functionality, this IC provides value and benefits that cater to your needs. Upgrade your electronics with the TLV320AIC23IPWRG4 for an exceptional audio experience.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material offers durability and protection for the internal components of the IC, ensuring long-term reliability.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto circuit boards, saving time and labor costs.

Power Supplies (V): 1.5,3.3

Support for multiple power supply voltages enables flexibility in design and compatibility with various system requirements.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact package style saves space on the circuit board and allows for high-density designs in consumer electronics.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range ensures reliable performance in harsh environmental conditions, suitable for a wide range of applications.

Technical Specifications

Other Function Consumer ICs TLV320AIC23IPWRG4 attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 1.42V TO 3.6V SUPPLY

General IC Type:

JESD-30 Code:

R-PDSO-G28

Length:

9.7 mm

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP28,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.5,3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

TLV320AIC23IPWRG4 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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