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TLV320AIC23BRHD

Texas Instruments

TLV320AIC23BRHD by Texas Instruments

TLV320AIC23BRHD by Texas Instruments is a consumer IC with 28 terminals, operating at 0-70°C. It has power supplies of 1.5-3.3V and a max supply current of 26mA. Ideal for applications requiring a compact chip carrier package with nickel palladium gold finish, suitable for commercial temperature grades.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,233 parts In-Stock

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Chip Stock

USA . 5,039 parts In-Stock

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5,039

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Digiode

USA . 1,199 parts In-Stock

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1,199

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DigiKey Marketplace

USA . 516 parts In-Stock

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516

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Cyclops Electronics Ltd

UK . 369 parts In-Stock

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369

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Distributors (Availability)

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Parana Technologies

USA . 1,635 parts In-Stock

1+ parts

$2.780

100+ parts

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$3.264

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$2.780

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$3.264

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DigiPath Technology Company

USA . 1,684 parts In-Stock

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$3.062

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$2.817

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$3.062

$2.817

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ChromeModa Solutions

Germany . 6,555 parts In-Stock

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$3.124

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$2.562

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$3.124

$2.562

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IDEA Electronic Components Group

UK . 838 parts In-Stock

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$3.124

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$2.812

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838

$3.124

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$2.812

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AZTECH Wire

Italy . 473 parts In-Stock

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$7.378

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473

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One Stop Electronics

USA . 274 parts In-Stock

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$9.800

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274

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Lixinc

USA . 18,492 parts In-Stock

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Authorized Procurement Solutions

USA . 17,000 parts In-Stock

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Kepictronics

USA . 4,000 parts In-Stock

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Microchip USA

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Corphita

USA . 317 parts In-Stock

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317

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Overview

Experience the next level of audio quality with the TLV320AIC23BRHD by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch consumer ICs like this one that offer unparalleled sound performance. Whether you're designing a smartphone, tablet, or portable gaming device, this chip carrier package with very thin profile is perfect for your needs. With a minimum supply voltage of 2.7V and maximum supply voltage of 3.6V, this commercial-grade IC provides high-quality audio while consuming only 26mA of power. Upgrade your product's audio capabilities with the TLV320AIC23BRHD and stand out from the competition.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability for the product.

Surface Mount: YES

Being surface mountable makes it easier to integrate this IC into electronic assemblies.

Package Shape: SQUARE

The square package shape allows for efficient use of space in electronic designs.

Power Supplies (V): 1.5, 3.3

Support for multiple power supply voltages provides flexibility in different applications.

No. of Terminals: 28

Having 28 terminals allows for connectivity and functionality in various circuits.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The different package styles offer options for optimal heat dissipation and space-saving designs.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures reliability in various environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures functionality even in colder environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold terminal finish enhances conductivity and corrosion resistance.

Terminal Position: QUAD

The quad terminal position allows for easy connections in circuit layouts.

Width: 5 mm

The compact width makes this IC suitable for space-constrained electronic designs.

Minimum Supply Voltage (Vsup): 2.7 V

The low minimum supply voltage enables operation in low power scenarios.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures reliable soldering during assembly.

Temperature Grade: COMMERCIAL

Being rated for commercial temperature grades ensures compatibility with standard operating conditions.

Terminal Form: NO LEAD

The no lead terminal form is environmentally friendly and complies with regulations.

Maximum Supply Current: 26 mA

With a maximum supply current of 26 mA, the IC is suitable for low-power applications.

Terminal Pitch: 0.5 mm

The small terminal pitch allows for high-density mounting and efficient use of PCB space.

Moisture Sensitivity Level (MSL): 2

MSL level 2 indicates moderate sensitivity to moisture, which is suitable for standard handling and storage.

Maximum Supply Voltage (Vsup): 3.6 V

The high maximum supply voltage allows for compatibility with various power sources.

Technical Specifications

Other Function Consumer ICs TLV320AIC23BRHD attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 1.42V TO 3.6V SUPPLY

General IC Type:

JESD-30 Code:

S-PQCC-N28

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.5,3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Current:

26 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

TLV320AIC23BRHD General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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