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TLV320AIC23BIPWG4

Texas Instruments

TLV320AIC23BIPWG4 by Texas Instruments

TLV320AIC23BIPWG4 by Texas Instruments is a consumer IC with 28 terminals, operating at -40 to 85°C. It has power supplies of 1.5-3.3V and terminal finish of NiPdAu. This IC is used in industrial applications requiring a small outline package with dual terminal position.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,138 parts In-Stock

1+ parts

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7,138

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Digiode

USA . 4,026 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,026

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Martec Srl

Italy . 77 parts In-Stock

1+ parts

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77

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,908 parts In-Stock

1+ parts

$2.857

100+ parts

-

1k+ parts

$3.347

10k+ parts

-

1,908

$2.857

-

$3.347

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ChromeModa Solutions

Germany . 6,981 parts In-Stock

1+ parts

$3.210

100+ parts

$2.632

1k+ parts

-

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6,981

$3.210

$2.632

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IDEA Electronic Components Group

UK . 1,012 parts In-Stock

1+ parts

$3.210

100+ parts

-

1k+ parts

$2.889

10k+ parts

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1,012

$3.210

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$2.889

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One Stop Electronics

USA . 869 parts In-Stock

1+ parts

$3.800

100+ parts

-

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869

$3.800

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AZTECH Wire

Italy . 491 parts In-Stock

1+ parts

$11.453

100+ parts

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491

$11.453

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Corphita

USA . 3,723 parts In-Stock

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3,723

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DigiPath Technology Company

USA . 661 parts In-Stock

1+ parts

-

100+ parts

$2.894

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661

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$2.894

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Microchip USA

USA . 500 parts In-Stock

1+ parts

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500

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Overview

Elevate your audio experience with the TLV320AIC23BIPWG4 by Texas Instruments. Crafted by a renowned manufacturer, this consumer IC delivers exceptional quality and reliability. Perfect for a variety of applications in the consumer electronics industry, this small outline, thin profile package offers unmatched value to customers seeking superior sound performance. Take your products to the next level with the TLV320AIC23BIPWG4 and enjoy the benefits of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the IC, making it suitable for consumer electronics.

Surface Mount: YES

Allows for easy and efficient assembly onto PCBs, saving time and effort in manufacturing.

Power Supplies (V): 1.5,3.3

Supports a wide range of power supply voltages, making it versatile for various applications.

No. of Terminals: 28

Provides sufficient connectivity options for integrating the IC into circuit designs.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial environments where heat may be a factor.

Width: 4.4 mm

Compact size allows for space-saving designs, ideal for compact electronic devices.

Temperature Grade: INDUSTRIAL

Designed to meet industrial standards for reliability and performance in harsh environments.

Terminal Form: GULL WING

Gull wing terminals provide secure solder joints and easy assembly onto PCBs.

Maximum Supply Voltage (Vsup): 3.6 V

Supports a higher supply voltage, offering flexibility in power requirements for the IC.

Technical Specifications

Other Function Consumer ICs TLV320AIC23BIPWG4 attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 1.42V TO 3.6V SUPPLY

General IC Type:

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

9.7 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP28,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.5,3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

TLV320AIC23BIPWG4 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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