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TLV320ADC3100IRGER

Texas Instruments

TLV320ADC3100IRGER by Texas Instruments

TLV320ADC3100IRGER by Texas Instruments is a 24-terminal CONSUMER CIRCUIT IC with operating temperature range of -40 to 85 °C. It has a supply voltage range of 2.7-3.6 V and peak reflow temp of 260C, suitable for INDUSTRIAL applications requiring high precision audio signal processing in compact form factor.

Median Price

$2.750

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,322,382 parts In-Stock

1+ parts

$2.202

100+ parts

$1.819

1k+ parts

$0.983

10k+ parts

-

1,322,382

$2.202

$1.819

$0.983

-

DigiKey

USA . 2,882 parts In-Stock

1+ parts

$2.750

100+ parts

$1.684

1k+ parts

$1.492

10k+ parts

$1.409

2,882

$2.750

$1.684

$1.492

$1.409

Mouser Electronics

USA . 227 parts In-Stock

1+ parts

$2.750

100+ parts

$1.690

1k+ parts

$1.500

10k+ parts

$1.430

227

$2.750

$1.690

$1.500

$1.430

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Maritex

Poland . 20 parts In-Stock

1+ parts

$1.360

100+ parts

$0.694

1k+ parts

$0.599

10k+ parts

$0.523

20

$1.360

$0.694

$0.599

$0.523

Digiode

USA . 1,049 parts In-Stock

1+ parts

$2.092

100+ parts

-

1k+ parts

-

10k+ parts

-

1,049

$2.092

-

-

-

Vyrian

USA . 5,601 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,601

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,241 parts In-Stock

1+ parts

$0.918

100+ parts

-

1k+ parts

$1.836

10k+ parts

-

2,241

$0.918

-

$1.836

-

DigiPath Technology Company

USA . 1,325 parts In-Stock

1+ parts

$1.010

100+ parts

$0.930

1k+ parts

-

10k+ parts

-

1,325

$1.010

$0.930

-

-

ChromeModa Solutions

Germany . 3,643 parts In-Stock

1+ parts

$1.031

100+ parts

$0.845

1k+ parts

-

10k+ parts

-

3,643

$1.031

$0.845

-

-

IDEA Electronic Components Group

UK . 1,492 parts In-Stock

1+ parts

$1.031

100+ parts

-

1k+ parts

$0.928

10k+ parts

-

1,492

$1.031

-

$0.928

-

Corphita

USA . 813 parts In-Stock

1+ parts

$1.982

100+ parts

-

1k+ parts

-

10k+ parts

-

813

$1.982

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 7,691 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,691

-

-

-

-

Kepictronics

USA . 6,740 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,740

-

-

-

-

Authorized Procurement Solutions

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,000

-

-

-

-

Lixinc

USA . 2,682 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,682

-

-

-

-

Formix International (Excess)

India . 548 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

548

-

-

-

-

Overview

Elevate your consumer electronic designs with the TLV320ADC3100IRGER by Texas Instruments. Known for their exceptional quality and reliability, Texas Instruments delivers cutting-edge solutions in the field of Consumer ICs. This chip carrier, heat sink/slug package boasts a wide operating temperature range and superior terminal finish for optimal performance. Perfect for a variety of industrial applications, this high-quality IC offers customers unmatched value and benefits. Upgrade your products with the TLV320ADC3100IRGER and experience the difference Texas Instruments can make in your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protects the internal components of the IC from external elements, making it a reliable choice for consumer applications.

Surface Mount: YES

Being surface mountable allows for easy integration into circuit boards, saving space and enabling efficient assembly processes.

Package Shape: RECTANGULAR

The rectangular package shape is standard and facilitates placement and orientation during PCB layout, contributing to ease of design.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this IC can withstand elevated temperatures without compromising performance, suitable for industrial environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures functionality even in extreme cold conditions, increasing the versatility of the product.

Moisture Sensitivity Level (MSL): 2

Having a moisture sensitivity level of 2 indicates that the IC is less susceptible to moisture-related damage during manufacturing, storage, and usage, enhancing its reliability.

Technical Specifications

Other Function Consumer ICs TLV320ADC3100IRGER attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-PQCC-N24

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

TLV320ADC3100IRGER General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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