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TLV2462AQDREP

Texas Instruments

TLV2462AQDREP by Texas Instruments

TLV2462AQDREP by Texas Instruments is a CMOS Operational Amplifier with 1700uV Max Input Offset Voltage, 85dB Nominal CMRR, and 5200kHz Unity Gain Bandwidth. Ideal for automotive applications due to its VOLTAGE-FEEDBACK architecture and low bias current of 0.075uA.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,222 parts In-Stock

1+ parts

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5,222

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Digiode

USA . 3,500 parts In-Stock

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3,500

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 144 parts In-Stock

1+ parts

$3.793

100+ parts

-

1k+ parts

$4.282

10k+ parts

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144

$3.793

-

$4.282

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DigiPath Technology Company

USA . 2,326 parts In-Stock

1+ parts

$4.177

100+ parts

$3.843

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2,326

$4.177

$3.843

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IDEA Electronic Components Group

UK . 2,001 parts In-Stock

1+ parts

$4.262

100+ parts

-

1k+ parts

$3.836

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2,001

$4.262

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$3.836

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ChromeModa Solutions

Germany . 278 parts In-Stock

1+ parts

$4.262

100+ parts

$3.495

1k+ parts

-

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278

$4.262

$3.495

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AZTECH Wire

Italy . 202 parts In-Stock

1+ parts

$5.551

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202

$5.551

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One Stop Electronics

USA . 737 parts In-Stock

1+ parts

$8.410

100+ parts

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737

$8.410

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A-Z Elektronik GmbH

Germany . 7,250 parts In-Stock

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7,250

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Corphita

USA . 3,130 parts In-Stock

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3,130

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Overview

Discover the high-performance TLV2462AQDREP operational amplifier by Texas Instruments, designed to meet all your application needs with precision and reliability. With a compact package size and low power consumption, this amplifier offers exceptional value for a wide range of automotive and industrial applications. Trust in the quality and expertise of Texas Instruments to provide you with the best solutions for your design challenges. Elevate your projects with the TLV2462AQDREP and experience superior performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the operational amplifier, making it suitable for various applications.

Maximum Input Offset Voltage: 1700 uV

Low input offset voltage ensures accurate signal processing and minimal error in the output signal, making this operational amplifier reliable for precision measurements.

Maximum Average Bias Current (IIB): 0.075 uA

Low bias current results in minimal power consumption and ensures stable performance of the operational amplifier.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving space and time during production.

Nominal Common Mode Reject Ratio: 85 dB

High common mode rejection ratio ensures that unwanted common mode signals are effectively rejected, resulting in a cleaner and more accurate output signal.

Nominal Supply Voltage / Vsup (V): 3

Operating at a nominal supply voltage of 3V makes this operational amplifier suitable for low power applications, extending battery life in portable devices.

Technology: CMOS

The CMOS technology used in this operational amplifier offers low power consumption and high input impedance, making it ideal for battery-powered and high-impedance circuit applications.

Nominal Unity Gain Bandwidth: 5200 kHz

High unity gain bandwidth allows for a wide frequency response, making this operational amplifier suitable for high-speed signal processing applications.

Technical Specifications

Operational Amplifiers (Op Amps) TLV2462AQDREP attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

±1.35/±3/2.7/6 V

Total Functions:

2

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

No

Low-Offset:

No

Micropower:

No

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

5.2 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

85 dB

Minimum Common Mode Rejection Ratio (CMRR ):

66 dB

Input Offset Voltage Limit:

1700 uV

Minimum Voltage Gain:

31622

Minimum Slew Rate:

0.8 V/us

Nominal Slew Rate:

1.6 V/us

Maximum Input Offset Current (IIO):

7 nA

Peak Bias Current:

75 nA

Maximum Bias Current (IIB) @25 °C:

14 nA

Operational Characteristics

Nominal Supply Voltage:

3 V

Maximum Supply Voltage:

6 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Maximum Supply Current:

1.8 mA

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

TLV2462AQDREP Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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