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TLV2371IDBVRG4

Texas Instruments

TLV2371IDBVRG4 by Texas Instruments

TLV2371IDBVRG4 by Texas Instruments is a CMOS Operational Amplifier with low bias current (0.00006 uA), high common mode rejection ratio (72 dB), and wideband unity gain bandwidth (3000 kHz). Ideal for automotive applications due to its small outline, low profile package and temperature grade.

Median Price

$0.478

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 17,652 parts In-Stock

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$0.478

17,652

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$0.478

Distributors (In-Stock)

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Nova Conductors

Japan . 56 parts In-Stock

1+ parts

$0.735

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56

$0.735

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Chip Stock

USA . 128,430 parts In-Stock

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Vyrian

USA . 17,455 parts In-Stock

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Digiode

USA . 1,399 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 17,625 parts In-Stock

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$0.406

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17,625

$0.406

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Semicontronic

India . 17,155 parts In-Stock

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$0.406

100+ parts

$0.396

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$0.394

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17,155

$0.406

$0.396

$0.394

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Continental Prestige Electronics

USA . 3,968 parts In-Stock

1+ parts

$0.735

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$0.720

3,968

$0.735

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$0.720

Argo Parts USA

USA . 2,275 parts In-Stock

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$0.735

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2,275

$0.735

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Netroflash

USA . 2,000 parts In-Stock

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$0.735

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$0.720

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$0.735

$0.720

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$0.759

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$0.721

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$0.721

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3,000

$0.759

$0.721

$0.721

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Modulus Dynamics

Lithuania . 94 parts In-Stock

1+ parts

$0.816

100+ parts

$0.808

1k+ parts

$0.783

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94

$0.816

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$0.783

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Parana Technologies

USA . 1,645 parts In-Stock

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$4.162

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$4.606

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$4.162

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$4.606

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IDEA Electronic Components Group

UK . 1,659 parts In-Stock

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$4.676

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$4.208

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1,659

$4.676

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$4.208

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ChromeModa Solutions

Germany . 496 parts In-Stock

1+ parts

$4.676

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$3.834

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496

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Corohmni

South Africa . 1,118 parts In-Stock

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$6.730

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A-Z Elektronik GmbH

Germany . 9,440 parts In-Stock

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Lixinc

USA . 7,602 parts In-Stock

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Corphita

USA . 4,421 parts In-Stock

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Kepictronics

USA . 3,099 parts In-Stock

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Microchip USA

USA . 925 parts In-Stock

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Robosynatics

Brazil . 150 parts In-Stock

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Lucentia Tech

USA . 150 parts In-Stock

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DigiPath Technology Company

USA . 61 parts In-Stock

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$4.216

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61

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$4.216

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Overview

Unlock a world of precision and reliability with Texas Instruments' TLV2371IDBVRG4 Operational Amplifier. Crafted with superior quality materials and cutting-edge technology, this amplifier offers unmatched performance and versatility, making it ideal for a wide range of applications. Whether you're designing automotive systems, medical instruments, or industrial equipment, this amplifier delivers the value, benefits, and advantages that customers need to succeed. Trust Texas Instruments for top-of-the-line operational amplifiers that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Maximum Input Offset Voltage: 6000 uV

The low input offset voltage helps in achieving high accuracy in signal processing applications.

Surface Mount: YES

Surface mount capability makes the product suitable for compact and densely populated PCB designs.

Nominal Common Mode Reject Ratio: 72 dB

High common mode rejection ratio ensures minimal interference from unwanted signals.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V provides compatibility with standard power sources.

Minimum Slew Rate: 1 V/us

Fast slew rate enables the op amp to respond quickly to input signal changes.

Maximum Supply Voltage Limit: 16.5 V

Wide supply voltage range allows for flexibility in various power supply configurations.

Technology: CMOS

CMOS technology offers low power consumption and high input impedance, making the op amp suitable for battery-operated devices.

Nominal Unity Gain Bandwidth: 3000 kHz

High unity gain bandwidth ensures stable operation at different gains and frequencies.

Technical Specifications

Operational Amplifiers (Op Amps) TLV2371IDBVRG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

±1.35/±8/2.7/16 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

No

Wideband:

Yes

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

3 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

72 dB

Minimum Common Mode Rejection Ratio (CMRR ):

55 dB

Input Offset Voltage Limit:

6000 uV

Minimum Voltage Gain:

79432

Minimum Slew Rate:

1 V/us

Nominal Slew Rate:

2.4 V/us

Maximum Input Offset Current (IIO):

60 pA

Peak Bias Current:

60 pA

Maximum Bias Current (IIB) @25 °C:

60 pA

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

16.5 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Supply Current:

660 μA

Physical Characteristics

Length:

0.114 in (2.9 mm)

Width:

0.063 in (1.6 mm)

Maximum Seated Height:

0.057 in (1.45 mm)

Total Terminals:

5

Terminal Pitch:

0.037 in (0.95 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel/Palladium/Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Style:

Small Outline, Low Profile, Shrink Pitch

Package Equivalence Code:

TSOP5/6,.11,37

Trade Compliance

TLV2371IDBVRG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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