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TLV2371IDBVTG4

Texas Instruments

TLV2371IDBVTG4 by Texas Instruments

TLV2371IDBVTG4 by Texas Instruments is a CMOS Operational Amplifier with 6000uV Max Input Offset Voltage, 72dB Nominal CMRR, and 3000kHz Unity Gain Bandwidth. Widely used in automotive applications due to its low-bias current, VOLTAGE-FEEDBACK architecture, and wideband performance.

Median Price

$0.811

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.811

10k+ parts

$0.699

500

-

-

$0.811

$0.699

Distributors (In-Stock)

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Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$1.170

100+ parts

-

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500

$1.170

-

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Chip Stock

USA . 133,550 parts In-Stock

1+ parts

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133,550

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Vyrian

USA . 4,872 parts In-Stock

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Digiode

USA . 4,452 parts In-Stock

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4,452

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Distributors (Availability)

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Ampacity Inc.

Singapore . 422 parts In-Stock

1+ parts

$0.690

100+ parts

-

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422

$0.690

-

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Semicontronic

India . 25 parts In-Stock

1+ parts

$0.690

100+ parts

$0.673

1k+ parts

$0.669

10k+ parts

-

25

$0.690

$0.673

$0.669

-

Continental Prestige Electronics

USA . 4,769 parts In-Stock

1+ parts

$1.170

100+ parts

-

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$1.147

4,769

$1.170

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$1.147

Argo Parts USA

USA . 3,835 parts In-Stock

1+ parts

$1.170

100+ parts

-

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3,835

$1.170

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Netroflash

USA . 100 parts In-Stock

1+ parts

$1.170

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$1.147

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100

$1.170

$1.147

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Modulus Dynamics

Lithuania . 870 parts In-Stock

1+ parts

$1.299

100+ parts

$1.286

1k+ parts

$1.247

10k+ parts

-

870

$1.299

$1.286

$1.247

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Parana Technologies

USA . 377 parts In-Stock

1+ parts

$3.778

100+ parts

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$4.269

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377

$3.778

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$4.269

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DigiPath Technology Company

USA . 1,950 parts In-Stock

1+ parts

$4.160

100+ parts

$3.827

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$4.160

$3.827

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IDEA Electronic Components Group

UK . 1,881 parts In-Stock

1+ parts

$4.245

100+ parts

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$3.820

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1,881

$4.245

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$3.820

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ChromeModa Solutions

Germany . 1,179 parts In-Stock

1+ parts

$4.245

100+ parts

$3.481

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1,179

$4.245

$3.481

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$4.690

100+ parts

$4.455

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$4.455

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-

2,500

$4.690

$4.455

$4.455

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Corohmni

South Africa . 269 parts In-Stock

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$6.067

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269

$6.067

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AZTECH Wire

Italy . 563 parts In-Stock

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$11.788

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563

$11.788

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Microchip USA

USA . 10,580 parts In-Stock

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Metaverse IC Inc.

Canada . 7,820 parts In-Stock

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Corphita

USA . 4,935 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 2,268 parts In-Stock

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Robosynatics

Brazil . 950 parts In-Stock

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950

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Lucentia Tech

USA . 950 parts In-Stock

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950

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Overview

Elevate your projects with the TLV2371IDBVTG4 by Texas Instruments, a top-tier operational amplifier that guarantees superior performance and reliability. Crafted with precision using cutting-edge technology, this op amp delivers unparalleled stability and efficiency in various applications. Whether you're working on automotive electronics, medical devices, or industrial systems, this compact and versatile component ensures optimal functionality, making it a must-have for professionals seeking quality and value in their designs. Upgrade to the TLV2371IDBVTG4 and experience the difference in performance today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and ensures reliable performance in various environments.

Maximum Input Offset Voltage: 6000 uV

The low input offset voltage of 6000uV ensures high accuracy and precision in signal processing applications.

Maximum Average Bias Current (IIB): 0.00006 uA

The ultra-low bias current of 0.00006uA helps in minimizing power consumption and improving efficiency.

Surface Mount: YES

The surface mount feature allows for easy installation and saves space on the PCB, making it suitable for compact designs.

Package Shape: RECTANGULAR

The rectangular package shape provides ease of handling and integration into electronic circuits.

Nominal Common Mode Reject Ratio: 72 dB

The high common mode reject ratio of 72 dB ensures effective rejection of common-mode noise for clean signal output.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V makes it compatible with a wide range of electronic systems and power sources.

Power Supplies (V): +-1.35/+-8/2.7/16

The flexibility in power supply options ranging from +-1.35V to 16V enables versatile use in different voltage environments.

No. of Terminals: 5

The 5 terminal configuration allows for easy connectivity and integration into electronic circuits.

Maximum Input Offset Current (IIO): 0.00006 uA

The low input offset current of 0.00006uA helps in reducing errors and improving overall performance.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

The compact and low profile package style with shrink pitch design saves space and enhances portability.

Minimum Slew Rate: 1 V/us

The minimum slew rate of 1V/us ensures fast response time and accurate signal amplification.

Maximum Supply Voltage Limit: 16.5 V

The high supply voltage limit of 16.5V provides protection against overvoltage conditions for reliable operation.

Maximum Operating Temperature: 125 °C

The wide operating temperature range of up to 125°C allows for reliable performance in harsh environmental conditions.

Maximum Bias Current (IIB) @25°C: 0.00006 uA

The low bias current of 0.00006uA at 25°C ensures stable operation and low power consumption.

Frequency Compensation: YES

The frequency compensation feature ensures stability in feedback loops and reliable performance in various applications.

Minimum Voltage Gain: 79432

The high minimum voltage gain of 79432 ensures strong signal amplification and clear output signals.

Minimum Operating Temperature: -40 °C

The low operating temperature limit of -40°C allows for reliable performance in extreme cold conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The terminal finish of nickel/palladium/gold provides corrosion resistance and ensures long-term reliability.

Terminal Position: DUAL

The dual terminal position allows for versatile connectivity options in different circuit configurations.

Maximum Seated Height: 1.45 mm

The low maximum seated height of 1.45mm saves space and enables compact designs.

Width: 1.6 mm

The narrow width of 1.6mm allows for easy integration into tight spaces on the PCB.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures reliable soldering and assembly during manufacturing processes.

Length: 2.9 mm

The short length of 2.9mm saves space on the PCB and allows for compact system designs.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade ensures reliable performance in automotive applications with varying temperature conditions.

Low-Bias: YES

The low-bias feature helps in reducing errors and improving overall accuracy in signal processing applications.

Nominal Unity Gain Bandwidth: 3000 kHz

The nominal unity gain bandwidth of 3000kHz ensures high-frequency response and fast signal processing.

Minimum Common Mode Reject Ratio: 55 dB

The minimum common mode reject ratio of 55dB ensures effective rejection of common-mode noise for clean signal output.

Technology: CMOS

The CMOS technology ensures low power consumption, high reliability, and compatibility with various electronic systems.

Terminal Form: GULL WING

The gull wing terminal form provides secure soldering connections and ease of PCB assembly.

Amplifier Type: OPERATIONAL AMPLIFIER

The operational amplifier type offers high amplification capabilities and precision in signal processing applications.

Maximum Supply Current: 0.66 mA

The maximum supply current of 0.66mA ensures efficient power consumption and long battery life in portable devices.

Architecture: VOLTAGE-FEEDBACK

The voltage-feedback architecture provides stable operation, high gain, and low distortion in signal amplification applications.

Packing Method: TR

The TR packing method ensures safe and secure packaging for transportation and storage.

Nominal Slow Rate: 2.4 V/us

The nominal slew rate of 2.4V/us ensures fast signal response and accurate amplification.

Terminal Pitch: 0.95 mm

The narrow terminal pitch of 0.95mm allows for dense packing on the PCB and enables compact designs.

Wideband: YES

The wideband feature allows for high-frequency response and versatility in signal processing applications.

Technical Specifications

Operational Amplifiers (Op Amps) TLV2371IDBVTG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

±1.35/±8/2.7/16 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

No

Wideband:

Yes

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

3 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

72 dB

Minimum Common Mode Rejection Ratio (CMRR ):

55 dB

Input Offset Voltage Limit:

6000 uV

Minimum Voltage Gain:

79432

Minimum Slew Rate:

1 V/us

Nominal Slew Rate:

2.4 V/us

Maximum Input Offset Current (IIO):

60 pA

Peak Bias Current:

60 pA

Maximum Bias Current (IIB) @25 °C:

60 pA

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

16.5 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Supply Current:

660 μA

Physical Characteristics

Length:

0.114 in (2.9 mm)

Width:

0.063 in (1.6 mm)

Maximum Seated Height:

0.057 in (1.45 mm)

Total Terminals:

5

Terminal Pitch:

0.037 in (0.95 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel/Palladium/Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Style:

Small Outline, Low Profile, Shrink Pitch

Package Equivalence Code:

TSOP5/6,.11,37

Trade Compliance

TLV2371IDBVTG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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