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TLV2352MFK

Texas Instruments

TLV2352MFK by Texas Instruments

TLV2352MFK by Texas Instruments is a CMOS Comparator with 2 functions, 10000 uV Max Input Offset Voltage, and 0.02 uA Max Average Bias Current. Ideal for military applications due to its MIL-Grade Temperature Range of -55 to 125 °C and NO LEAD Terminal Form.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,479 parts In-Stock

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Digiode

USA . 4,838 parts In-Stock

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4,838

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Distributors (Availability)

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One Stop Electronics

USA . 1,325 parts In-Stock

1+ parts

$3.410

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$3.410

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Parana Technologies

USA . 1,561 parts In-Stock

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$5.081

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$5.657

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1,561

$5.081

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DigiPath Technology Company

USA . 296 parts In-Stock

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$5.595

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296

$5.595

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ChromeModa Solutions

Germany . 1,431 parts In-Stock

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$5.709

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$4.681

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1,431

$5.709

$4.681

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IDEA Electronic Components Group

UK . 221 parts In-Stock

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$5.709

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$5.138

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221

$5.709

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$5.138

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AZTECH Wire

Italy . 576 parts In-Stock

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$15.334

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576

$15.334

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Corphita

USA . 3,896 parts In-Stock

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Overview

Looking for a reliable and high-quality comparator for your next project? Look no further than the TLV2352MFK by Texas Instruments. With a reputation for excellence in manufacturing, Texas Instruments delivers a top-notch product that is perfect for a wide range of applications. From precision measurement to sensor interfaces, this comparator offers outstanding value with its low power consumption and fast response time. Trust Texas Instruments to provide you with the best solution for your electronic needs. Choose the TLV2352MFK for superior performance and reliability.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides durability and protection for the internal components of the comparator, making it suitable for various environments and applications.

Maximum Input Offset Voltage: 10000 uV

The low input offset voltage ensures accurate comparisons between input signals, making this comparator ideal for precision measurement and control systems.

No. of Functions: 2

Having two functions in one comparator allows for more versatile use and functionality in circuits, increasing the overall efficiency of the system.

Nominal Supply Voltage / Vsup (V): 3

The nominal supply voltage of 3V allows for compatibility with a wide range of electronic components and systems, making it a versatile choice for integration.

Output Type: OPEN-DRAIN

The open-drain output type provides flexibility in the circuit design and allows for easy interfacing with other components, making it a convenient choice for various applications.

Technology: CMOS

Utilizing CMOS technology offers low power consumption, high noise immunity, and fast response times, making this comparator efficient and reliable for a wide range of applications.

Technical Specifications

Comparators TLV2352MFK attributes and parameters. Explore more Comparators devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Technology:

CMOS

Power Supply:

3/5 V

Total Functions:

2

Sub-Category:

Comparators

Output Type:

Open-Drain

Performance Specifications

Maximum Input Offset Voltage:

10 mV

Peak Bias Current:

20 nA

Operational Characteristics

Maximum Supply Current:

400 μA

Nominal Supply Voltage:

3 V

Maximum Supply Voltage:

8 V

Lowest Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Nominal Response Time:

1.4 µs

Physical Characteristics

Length:

0.35 in (8.89 mm)

Width:

0.35 in (8.89 mm)

Maximum Seated Height:

0.08 in (2.03 mm)

Total Terminals:

20

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Quad

Terminal Form:

Package Body Material:

Ceramic, Metal-Sealed Cofired

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

S-CQCC-N20

Packaging and Shipping

Package Code:

Package Shape:

Package Type:

Chip Carrier

Package Equivalence Code:

LCC20,.35SQ

Trade Compliance

TLV2352MFK Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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