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TLV2354IPWLE

Texas Instruments

TLV2354IPWLE by Texas Instruments

TLV2354IPWLE by Texas Instruments is a CMOS COMPARATOR with 4 functions, Vsup of 3V, and IIB of 0.002uA. It has a response time of 640ns and operates in industrial temperature range (-40 to 85 °C). Ideal for applications requiring precise voltage comparison in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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ECAB

Sweden . 10,000 parts In-Stock

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Vyrian

USA . 5,254 parts In-Stock

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5,254

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Digiode

USA . 706 parts In-Stock

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706

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Nova Conductors

Japan . 16 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 195 parts In-Stock

1+ parts

$6.087

100+ parts

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$6.862

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195

$6.087

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$6.862

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Ampacity Inc.

Singapore . 1,113 parts In-Stock

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$6.410

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DigiPath Technology Company

USA . 845 parts In-Stock

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$6.702

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845

$6.702

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ChromeModa Solutions

Germany . 2,534 parts In-Stock

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$6.839

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$5.608

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$6.839

$5.608

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IDEA Electronic Components Group

UK . 1,739 parts In-Stock

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$6.839

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$6.155

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AZTECH Wire

Italy . 752 parts In-Stock

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$7.433

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752

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One Stop Electronics

USA . 561 parts In-Stock

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$9.410

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Continental Prestige Electronics

USA . 5,720 parts In-Stock

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Argo Parts USA

USA . 3,059 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Aranea Global

USA . 500 parts In-Stock

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Corphita

USA . 111 parts In-Stock

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Overview

Discover the high-quality TLV2354IPWLE by Texas Instruments, a top-tier manufacturer known for its innovative solutions in the comparator category. This versatile device offers exceptional value and benefits to customers, with a fast response time of 640 ns and low bias current of 0.002 uA, making it ideal for a wide range of applications. From precision measurement systems to industrial automation, this product provides reliable performance and precise results. Upgrade your project with the TLV2354IPWLE and experience the advantages of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package durable and resistant to external elements, ensuring a longer lifespan.

Maximum Input Offset Voltage: 7000 uV

The high maximum input offset voltage allows for precise and accurate comparisons between input signals.

Maximum Average Bias Current (IIB): 0.002 uA

Low bias current results in reduced power consumption and ensures accurate and stable operation.

Surface Mount: YES

Surface mount capability makes it easy to integrate this product into compact and densely populated electronic circuits.

Nominal Supply Voltage / Vsup (V): 3

Operating at a nominal supply voltage of 3V makes it suitable for low power applications and saves energy.

Maximum Supply Voltage Limit: 8 V

With a maximum supply voltage limit of 8V, this product offers flexibility in various voltage requirements.

Output Type: OPEN-DRAIN

The open-drain output type allows for easy interfacing with other digital circuits, increasing versatility.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in harsh operating environments and wide temperature ranges.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of digital systems.

Amplifier Type: COMPARATOR

Being a comparator, this product is ideal for applications requiring precise comparison of analog signals.

Technical Specifications

Comparators TLV2354IPWLE attributes and parameters. Explore more Comparators devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Technology:

CMOS

Power Supply:

3/5 V

Total Functions:

4

Sub-Category:

Comparators

Output Type:

Open-Drain

Performance Specifications

Maximum Input Offset Voltage:

7 mV

Peak Bias Current:

2 nA

Maximum Bias Current (IIB) @25 °C:

2 nA

Operational Characteristics

Maximum Supply Current:

800 μA

Nominal Supply Voltage:

3 V

Maximum Supply Voltage:

8 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Nominal Response Time:

640 ns

Physical Characteristics

Length:

0.197 in (5 mm)

Width:

0.173 in (4.4 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Total Terminals:

14

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G14

Packaging and Shipping

Package Code:

Package Shape:

Package Type:

Small Outline, Thin Profile, Shrink Pitch

Package Equivalence Code:

TSSOP14,.25

Trade Compliance

TLV2354IPWLE Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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