Loading...

TLV2352MUB

Texas Instruments

TLV2352MUB by Texas Instruments

TLV2352MUB by Texas Instruments is a dual comparator with 10 terminals, CMOS technology, and open-drain output. It operates b/w -55 to 125 °C with a response time of 1400 ns. Ideal for military applications due to MIL-STD-883 screening level and compact flatpack package style.

Median Price

$4.382

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 74 parts In-Stock

1+ parts

$4.382

100+ parts

-

1k+ parts

-

10k+ parts

-

74

$4.382

-

-

-

Vyrian

USA . 7,763 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,763

-

-

-

-

Digiode

USA . 4,400 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,400

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,024 parts In-Stock

1+ parts

$1.410

100+ parts

-

1k+ parts

-

10k+ parts

-

1,024

$1.410

-

-

-

Parana Technologies

USA . 1,694 parts In-Stock

1+ parts

$5.879

100+ parts

-

1k+ parts

$6.664

10k+ parts

-

1,694

$5.879

-

$6.664

-

ChromeModa Solutions

Germany . 4,593 parts In-Stock

1+ parts

$6.606

100+ parts

$5.417

1k+ parts

-

10k+ parts

-

4,593

$6.606

$5.417

-

-

IDEA Electronic Components Group

UK . 245 parts In-Stock

1+ parts

$6.606

100+ parts

-

1k+ parts

$5.945

10k+ parts

-

245

$6.606

-

$5.945

-

AZTECH Wire

Italy . 449 parts In-Stock

1+ parts

$15.687

100+ parts

-

1k+ parts

-

10k+ parts

-

449

$15.687

-

-

-

Corphita

USA . 2,329 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,329

-

-

-

-

DigiPath Technology Company

USA . 1,757 parts In-Stock

1+ parts

-

100+ parts

$5.956

1k+ parts

-

10k+ parts

-

1,757

-

$5.956

-

-

Overview

Upgrade your electronics with the TLV2352MUB by Texas Instruments, a top-tier manufacturer known for quality and innovation. This high-performance comparator is perfect for precision applications, offering fast response times and low power consumption. With a wide temperature range and military-grade screening, this versatile device is ideal for demanding environments. Trust in Texas Instruments to deliver reliable products that exceed expectations. Experience the difference with the TLV2352MUB.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and protection for the internal components, ensuring reliable performance in harsh environments.

Maximum Input Offset Voltage: 10000 uV

Allows for precise voltage measurements and accurate comparisons between input signals.

Maximum Average Bias Current (IIB): 0.02 uA

Ensures minimal current draw, making the product energy-efficient and suitable for low-power applications.

Surface Mount: YES

Facilitates easy and convenient installation on circuit boards, saving time and effort during assembly.

Temperature Grade: MILITARY

Meets stringent military standards for reliability and performance, making it suitable for mission-critical applications.

Technology: CMOS

Utilizes CMOS technology for low power consumption, high speed, and compatibility with a wide range of applications.

Technical Specifications

Comparators TLV2352MUB attributes and parameters. Explore more Comparators devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Technology:

CMOS

Power Supply:

3/5 V

Total Functions:

2

Sub-Category:

Comparators

Output Type:

Open-Drain

Performance Specifications

Maximum Input Offset Voltage:

10 mV

Peak Bias Current:

20 nA

Operational Characteristics

Maximum Supply Current:

400 μA

Nominal Supply Voltage:

3 V

Maximum Supply Voltage:

8 V

Lowest Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Nominal Response Time:

1.4 µs

Physical Characteristics

Length:

0.245 in (6.225 mm)

Width:

0.245 in (6.225 mm)

Maximum Seated Height:

0.08 in (2.03 mm)

Total Terminals:

10

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Ceramic, Glass-Sealed

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Screening Level:

MIL-STD-883

Standards

JESD-30 Code:

S-GDFP-F10

Packaging and Shipping

Package Code:

DFP

Package Shape:

Package Type:

Flatpack

Package Equivalence Code:

FL10,.24

Trade Compliance

TLV2352MUB Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 19