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TLV1570IPWRG4

Texas Instruments

TLV1570IPWRG4 by Texas Instruments

TLV1570IPWRG4 by Texas Instruments is a 10-bit ADC with 8 analog in channels, 1.25 MHz sample rate, and 0.0977% linearity error. Ideal for industrial applications requiring precise analog-to-digital conversion in a compact SOT-23 package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,267 parts In-Stock

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Digiode

USA . 2,683 parts In-Stock

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2,683

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Distributors (Availability)

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AZTECH Wire

Italy . 552 parts In-Stock

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$8.484

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552

$8.484

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Parana Technologies

USA . 1,022 parts In-Stock

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$18.222

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$18.359

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$18.222

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$18.359

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DigiPath Technology Company

USA . 588 parts In-Stock

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$20.065

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$18.459

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588

$20.065

$18.459

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ChromeModa Solutions

Germany . 1,708 parts In-Stock

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$20.474

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$16.789

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1,708

$20.474

$16.789

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IDEA Electronic Components Group

UK . 1,499 parts In-Stock

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$20.474

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$19.450

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$18.427

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1,499

$20.474

$19.450

$18.427

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One Stop Electronics

USA . 290 parts In-Stock

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$33.000

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290

$33.000

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Corphita

USA . 2,536 parts In-Stock

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Kepictronics

USA . 1,050 parts In-Stock

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Microchip USA

USA . 948 parts In-Stock

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Overview

Unlock unparalleled precision and reliability with the TLV1570IPWRG4 by Texas Instruments. As a leading manufacturer in the field of Analog-to-Digital Converters, Texas Instruments delivers cutting-edge technology that empowers your applications with unmatched accuracy and performance. Whether you're in the industrial or consumer electronics sector, this ADC provides seamless integration, high-speed operation, and low power consumption to optimize your designs. Elevate your projects with the TLV1570IPWRG4 and experience superior quality and value like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the components inside the package, ensuring the converter is long-lasting and reliable.

No. of Analog In Channels: 8

With 8 analog input channels, this converter can handle multiple input signals simultaneously, making it versatile for various applications.

No. of Bits: 10

With 10 bits resolution, this converter provides accurate and precise conversion of analog inputs to digital outputs.

Sample Rate: 1.25 MHz

The high sample rate allows for fast and efficient conversion of analog signals, making it suitable for applications that require real-time data processing.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this converter energy-efficient and reliable in noisy environments.

Maximum Analog Input Voltage: 5.5 V

With a high maximum analog input voltage, this converter can handle a wide range of input signals without risk of damage, providing flexibility in various applications.

Technical Specifications

Analog-to-Digital Converters TLV1570IPWRG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

8

No. of Functions:

1

No. of Bits:

10

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0977 %

Sample Rate:

1.25 MHz

Hold Mode:

Sample

Maximum Conversion Time:

1 µs

Electrical Specifications

Power Supplies:

3/5 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

5.5 V

Nominal Supply Voltage:

3 V

Minimum Supply Voltage:

2.7 V

Maximum Supply Current:

8.5 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

20

Terminal Form:

Terminal Pitch:

0.026 in (0.65 mm)

Surface Mount:

Yes

Width:

0.173 in (4.4 mm)

Length:

0.256 in (6.5 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Shape:

Package Equivalence Code:

TSSOP20,.25

Package Code:

Standards and Codes

JESD-30 Code:

R-PDSO-G20

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

TLV1570IPWRG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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