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TLV1570IPWG4

Texas Instruments

TLV1570IPWG4 by Texas Instruments

TLV1570IPWG4 by Texas Instruments is a 10-bit ADC with 8 analog in channels, operating at 1.25 MHz sample rate. Ideal for industrial applications, it offers a max linearity error of 0.0977% and operates on power supplies of 3/5 V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,658 parts In-Stock

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Digiode

USA . 2,489 parts In-Stock

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2,489

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Distributors (Availability)

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AZTECH Wire

Italy . 558 parts In-Stock

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$11.790

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558

$11.790

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Parana Technologies

USA . 1,298 parts In-Stock

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$16.118

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$16.447

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$16.118

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$16.447

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DigiPath Technology Company

USA . 519 parts In-Stock

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$17.748

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$16.328

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519

$17.748

$16.328

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ChromeModa Solutions

Germany . 5,261 parts In-Stock

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$18.110

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$14.850

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5,261

$18.110

$14.850

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IDEA Electronic Components Group

UK . 633 parts In-Stock

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$18.110

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$17.204

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$16.299

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633

$18.110

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$16.299

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One Stop Electronics

USA . 1,616 parts In-Stock

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$25.000

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$25.000

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Corphita

USA . 3,217 parts In-Stock

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Microchip USA

USA . 1,218 parts In-Stock

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Overview

Experience exceptional performance and reliability with the TLV1570IPWG4 Analog-to-Digital Converter by Texas Instruments. This high-quality product offers 10-bit resolution and a low linearity error of 0.0977%. Perfect for industrial applications, this converter features 8 analog input channels and operates on a supply voltage of 3V, providing precise and fast conversions with a sample rate of 1.25 MHz. Trust in Texas Instruments' expertise in analog technology and elevate your designs with the value and benefits that the TLV1570IPWG4 brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material helps in reducing the overall weight of the product, making it suitable for applications where weight is a concern.

No. of Analog In Channels: 8

Having 8 analog input channels allows for multiple signals to be converted simultaneously, increasing efficiency and reducing processing time.

No. of Bits: 10

With 10 bits resolution, this product can provide accurate conversion and measurement of analog signals, making it suitable for precise applications.

Power Supplies (V): 3/5

Support for multiple power supply voltages (3V and 5V) increases compatibility with different systems and allows for flexibility in integration.

Technology: CMOS

The use of CMOS technology ensures low power consumption and high noise immunity, making the product reliable and energy-efficient.

Sample Rate: 1.25 MHz

With a high sample rate of 1.25 MHz, this product is capable of capturing fast-changing signals accurately, making it suitable for high-speed applications.

Technical Specifications

Analog-to-Digital Converters TLV1570IPWG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

8

No. of Functions:

1

No. of Bits:

10

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0977 %

Sample Rate:

1.25 MHz

Hold Mode:

Sample

Maximum Conversion Time:

1 µs

Electrical Specifications

Power Supplies:

3/5 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

5.5 V

Nominal Supply Voltage:

3 V

Minimum Supply Voltage:

2.7 V

Maximum Supply Current:

8.5 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

20

Terminal Form:

Terminal Pitch:

0.026 in (0.65 mm)

Surface Mount:

Yes

Width:

0.173 in (4.4 mm)

Length:

0.256 in (6.5 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Shape:

Package Equivalence Code:

TSSOP20,.25

Package Code:

Standards and Codes

JESD-30 Code:

R-PDSO-G20

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

TLV1570IPWG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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