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TLV1549CPE4

Texas Instruments

TLV1549CPE4 by Texas Instruments

TLV1549CPE4 by Texas Instruments is a 10-bit ADC with 0.0977% linearity error, 3.3V supply, and 21us conversion time. Ideal for commercial applications, this CMOS technology converter has a serial output format and operates at temperatures from 0 to 70°C.

Median Price

$20.180

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 99 parts In-Stock

1+ parts

$20.180

100+ parts

$10.210

1k+ parts

-

10k+ parts

-

99

$20.180

$10.210

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,217 parts In-Stock

1+ parts

$11.086

100+ parts

-

1k+ parts

-

10k+ parts

-

2,217

$11.086

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-

-

Vyrian

USA . 9,597 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,597

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,463 parts In-Stock

1+ parts

$10.503

100+ parts

-

1k+ parts

-

10k+ parts

-

3,463

$10.503

-

-

-

Parana Technologies

USA . 1,077 parts In-Stock

1+ parts

$12.289

100+ parts

-

1k+ parts

$12.717

10k+ parts

-

1,077

$12.289

-

$12.717

-

DigiPath Technology Company

USA . 255 parts In-Stock

1+ parts

$13.532

100+ parts

$12.449

1k+ parts

-

10k+ parts

-

255

$13.532

$12.449

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-

ChromeModa Solutions

Germany . 4,672 parts In-Stock

1+ parts

$13.808

100+ parts

$11.323

1k+ parts

-

10k+ parts

-

4,672

$13.808

$11.323

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-

IDEA Electronic Components Group

UK . 1,866 parts In-Stock

1+ parts

$13.808

100+ parts

$13.118

1k+ parts

$12.427

10k+ parts

-

1,866

$13.808

$13.118

$12.427

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Microchip USA

USA . 1,560 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,560

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Overview

Enhance your analog-to-digital conversion experience with the TLV1549CPE4 by Texas Instruments. Crafted with precision and reliability, this ADC offers unparalleled quality and performance. Ideal for a wide range of applications, this product ensures accurate and efficient data conversion. With Texas Instruments' reputation for excellence in manufacturing, you can trust that the TLV1549CPE4 delivers value, benefits, and advantages that surpass expectations. Elevate your projects with this cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product reliable for long-term use.

No. of Bits: 10

The high number of bits ensures accurate conversion of analog signals to digital, providing precise data.

Maximum Linearity Error (EL): 0.0977 %

With low linearity error, the product delivers accurate and consistent conversion results.

Power Supplies (V): 3.3

Operating at a common voltage level makes it compatible with a wide range of systems and applications.

Maximum Conversion Time: 21 us

The quick conversion time allows for efficient processing of analog signals, making it suitable for real-time applications.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, enhancing the overall performance of the product.

Technical Specifications

Analog-to-Digital Converters TLV1549CPE4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

10

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0977 %

Sample Rate:

38 kHz

Hold Mode:

Sample

Maximum Conversion Time:

21 µs

Electrical Specifications

Power Supplies:

3.3 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

3.6 V

Nominal Supply Voltage:

3.3 V

Minimum Supply Voltage:

3 V

Maximum Supply Current:

2.5 mA

Operating Conditions

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Form Factor

Terminal Position:

Dual

No. of Terminals:

8

Terminal Form:

Terminal Pitch:

0.1 in (2.54 mm)

Surface Mount:

No

Width:

0.3 in (7.62 mm)

Length:

0.378 in (9.59 mm)

Maximum Seated Height:

0.2 in (5.08 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

In-Line

Package Shape:

Package Equivalence Code:

DIP8,.3

Package Code:

DIP

Standards and Codes

JESD-30 Code:

R-PDIP-T8

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

TLV1549CPE4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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