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TLC7725IDR

Texas Instruments

TLC7725IDR by Texas Instruments

TLC7725IDR by Texas Instruments is a Power Management IC with 8 terminals, operating voltage range of 2-6V, and BICMOS technology. It has a small outline package shape suitable for industrial applications, with dual terminal position and nickel/palladium/gold finish. The IC supports power supply circuits at temperatures ranging from -40 to 85°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,101 parts In-Stock

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5,101

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Bristol Electronics

USA . 2,340 parts In-Stock

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2,340

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Digiode

USA . 1,286 parts In-Stock

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1,286

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 319 parts In-Stock

1+ parts

$3.500

100+ parts

$3.412

1k+ parts

$3.395

10k+ parts

-

319

$3.500

$3.412

$3.395

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One Stop Electronics

USA . 1,437 parts In-Stock

1+ parts

$5.500

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-

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1,437

$5.500

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Microchip USA

USA . 3,968 parts In-Stock

1+ parts

$7.692

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3,968

$7.692

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AZTECH Wire

Italy . 663 parts In-Stock

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$10.046

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663

$10.046

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Parana Technologies

USA . 783 parts In-Stock

1+ parts

$17.283

100+ parts

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$17.497

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783

$17.283

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$17.497

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ChromeModa Solutions

Germany . 4,839 parts In-Stock

1+ parts

$19.419

100+ parts

$15.924

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4,839

$19.419

$15.924

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IDEA Electronic Components Group

UK . 1,924 parts In-Stock

1+ parts

$19.419

100+ parts

$18.448

1k+ parts

$17.477

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1,924

$19.419

$18.448

$17.477

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Lixinc

USA . 6,815 parts In-Stock

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6,815

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A-Z Elektronik GmbH

Germany . 5,015 parts In-Stock

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5,015

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Corphita

USA . 3,200 parts In-Stock

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ChipTracer

USA . 2,590 parts In-Stock

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2,590

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Kepictronics

USA . 2,000 parts In-Stock

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2,000

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DigiPath Technology Company

USA . 514 parts In-Stock

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$17.508

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514

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$17.508

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Corohmni

South Africa . 296 parts In-Stock

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296

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Overview

Unlock the power of efficient power management with the Texas Instruments TLC7725IDR. Manufactured by a trusted industry leader, this Power Management IC offers unparalleled quality and reliability. Ideal for a wide range of applications, this small outline package delivers excellent performance in industrial settings. With a nominal supply voltage of 5V and innovative BICMOS technology, the TLC7725IDR provides customers with a valuable solution that ensures optimal power supply support while maintaining temperature integrity. Experience the benefits of superior design and functionality with Texas Instruments TLC7725IDR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material helps in keeping the package lightweight and durable, making it suitable for various applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards, saving time and effort during production.

Nominal Supply Voltage (Vsup): 5 V

The 5 V nominal supply voltage is a common and widely supported standard, ensuring compatibility with a wide range of systems.

Power Supplies (V): 2/6

Supporting 2 to 6 power supplies provides flexibility in powering multiple components or subsystems within a system.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can withstand higher temperatures, making it suitable for industrial settings or harsh environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable performance even in extreme cold conditions.

Technology: BICMOS

BiCMOS technology combines the advantages of both bipolar and CMOS technologies, offering high speed, low power consumption, and reliability in one package.

Technical Specifications

Power Management ICs TLC7725IDR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

POWER-ON RESET GENERATOR

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.016 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.25V

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3.9 mm

Trade Compliance

TLC7725IDR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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