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TLC3578IDWR

Texas Instruments

TLC3578IDWR by Texas Instruments

TLC3578IDWR by Texas Instruments is an 8-channel, 14-bit ADC with 0.0061% linearity error. Operating at -40 to 85°C, it has a sample rate of 0.2 MHz and supports input voltages from -10V to +10V. Ideal for industrial applications requiring precise analog-to-digital conversion in a compact package.

Median Price

$28.480

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 2,000 parts In-Stock

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$28.480

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$28.480

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Vyrian

USA . 8,558 parts In-Stock

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8,558

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Digiode

USA . 1,893 parts In-Stock

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Chip Stock

USA . 825 parts In-Stock

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825

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Distributors (Availability)

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Parana Technologies

USA . 1,168 parts In-Stock

1+ parts

$17.035

100+ parts

-

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$17.259

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$17.035

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$17.259

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DigiPath Technology Company

USA . 2,085 parts In-Stock

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$18.757

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$18.757

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ChromeModa Solutions

Germany . 5,737 parts In-Stock

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$19.140

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$15.695

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$19.140

$15.695

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IDEA Electronic Components Group

UK . 1,594 parts In-Stock

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$19.140

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$18.183

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$17.226

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$19.140

$18.183

$17.226

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AZTECH Wire

Italy . 748 parts In-Stock

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$19.610

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$19.610

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Microchip USA

USA . 1,259 parts In-Stock

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$25.790

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$25.420

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$25.240

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$25.050

1,259

$25.790

$25.420

$25.240

$25.050

Lixinc

USA . 14,942 parts In-Stock

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Kepictronics

USA . 9,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,104 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Corphita

USA . 2,789 parts In-Stock

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Assy Fe

Spain . 25 parts In-Stock

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Overview

Unlock the potential of your analog-to-digital conversion needs with the Texas Instruments TLC3578IDWR. Designed with precision and quality in mind, this ADC boasts 8 channels and 14 bits for accurate data conversion. Texas Instruments, a leader in semiconductor technology, delivers a product that exceeds expectations in industrial applications. From temperature monitoring to sensor data acquisition, the TLC3578IDWR offers high performance and reliability. Experience the value of seamless integration and superior performance with this compact and efficient solution. Elevate your projects with Texas Instruments today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package lightweight and durable, suitable for a variety of applications.

No. of Analog In Channels: 8

Having 8 analog input channels allows for multiple signals to be converted simultaneously, making the product versatile and efficient.

No. of Bits: 14

With 14 bits of resolution, the ADC can provide accurate conversion of analog signals into digital data, ensuring high quality output.

Maximum Operating Temperature: 85 °C

The wide operating temperature range of up to 85°C makes this ADC suitable for industrial applications where temperature fluctuations may occur.

Sample Rate: 0.2 MHz

The high sample rate of 0.2 MHz enables fast conversion of analog signals to digital data, providing real-time data acquisition and processing.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and noise immunity, making the ADC reliable and efficient in various applications.

Technical Specifications

Analog-to-Digital Converters TLC3578IDWR attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

8

No. of Functions:

1

No. of Bits:

14

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Offset Binary, 2's Complement Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0061 %

Sample Rate:

200 kHz

Hold Mode:

Sample

Maximum Conversion Time:

2.785 µs

Electrical Specifications

Power Supplies:

3/5,5 V

Minimum Analog Input Voltage:

-10 V

Maximum Analog Input Voltage:

10 V

Nominal Supply Voltage:

5 V

Minimum Supply Voltage:

2.7 V

Maximum Supply Current:

5 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

24

Terminal Form:

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.295 in (7.5 mm)

Length:

0.606 in (15.4 mm)

Maximum Seated Height:

0.104 in (2.65 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline

Package Shape:

Package Equivalence Code:

SOP24,.4

Package Code:

SOP

Standards and Codes

JESD-30 Code:

R-PDSO-G24

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

TLC3578IDWR Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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