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TLC3574IDWRG4

Texas Instruments

TLC3574IDWRG4 by Texas Instruments

TLC3574IDWRG4 by Texas Instruments is a 14-bit ADC with 0.0061% EL, 4 analog in channels, and 2.785us conversion time. Ideal for industrial applications requiring high precision data acquisition in a compact form factor. Operates at -40 to 85°C with small outline package style for surface mount assembly.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,162 parts In-Stock

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Digiode

USA . 709 parts In-Stock

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709

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Distributors (Availability)

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One Stop Electronics

USA . 1,439 parts In-Stock

1+ parts

$8.000

100+ parts

-

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1,439

$8.000

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Parana Technologies

USA . 934 parts In-Stock

1+ parts

$9.512

100+ parts

-

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$10.112

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934

$9.512

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$10.112

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DigiPath Technology Company

USA . 1,662 parts In-Stock

1+ parts

$10.474

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1,662

$10.474

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ChromeModa Solutions

Germany . 2,231 parts In-Stock

1+ parts

$10.688

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$8.764

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2,231

$10.688

$8.764

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IDEA Electronic Components Group

UK . 1,205 parts In-Stock

1+ parts

$10.688

100+ parts

$10.154

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$9.619

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1,205

$10.688

$10.154

$9.619

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AZTECH Wire

Italy . 217 parts In-Stock

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$11.345

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217

$11.345

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Microchip USA

USA . 1,097 parts In-Stock

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1,097

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Corphita

USA . 151 parts In-Stock

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151

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Overview

Looking for high-quality Analog-to-Digital Converters? Look no further than the TLC3574IDWRG4 by Texas Instruments. With a reputation for excellence, Texas Instruments delivers top-notch products like this one, perfect for applications requiring precise conversion accuracy. This converter offers customers value, benefits, and advantages that can't be beaten. Upgrade your project with the TLC3574IDWRG4 and experience superior performance and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides good protection and insulation for the internal components of the Analog-to-Digital Converter.

No. of Analog In Channels: 4

Having 4 analog input channels allows for versatile and flexible input signal options, making the converter suitable for a variety of applications.

Surface Mount: YES

The surface mount feature makes the installation of the converter easier and more convenient, especially in compact electronic systems.

No. of Bits: 14

With 14 bits, this converter offers high resolution for accurate and detailed digital representations of analog signals.

Maximum Linearity Error (EL): 0.0061%

The low linearity error ensures precision in the conversion process, providing accurate output readings.

Power Supplies (V): 3/5,5

The availability of multiple power supply options (3V and 5.5V) allows for flexibility in designing and integrating the converter into various systems.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and makes the converter suitable for compact electronic devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the converter's reliability and performance in harsh operating environments.

Technical Specifications

Analog-to-Digital Converters TLC3574IDWRG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

4

No. of Functions:

1

No. of Bits:

14

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Offset Binary, 2's Complement Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0061 %

Sample Rate:

200 kHz

Hold Mode:

Sample

Maximum Conversion Time:

2.785 µs

Electrical Specifications

Power Supplies:

3/5,5 V

Minimum Analog Input Voltage:

-10 V

Maximum Analog Input Voltage:

10 V

Nominal Supply Voltage:

5 V

Minimum Supply Voltage:

2.7 V

Maximum Supply Current:

5 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Form Factor

Terminal Position:

Dual

No. of Terminals:

20

Terminal Form:

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.295 in (7.5 mm)

Length:

0.504 in (12.8 mm)

Maximum Seated Height:

0.104 in (2.65 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline

Package Shape:

Package Equivalence Code:

SOP20,.4

Package Code:

SOP

Standards and Codes

JESD-30 Code:

R-PDSO-G20

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

TLC3574IDWRG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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