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TLC3548IDWRG4

Texas Instruments

TLC3548IDWRG4 by Texas Instruments

TLC3548IDWRG4 by Texas Instruments is a 14-bit ADC with 8 analog in channels, 0.0061% EL, and 2.785us conversion time. Ideal for industrial applications requiring high precision data acquisition at temperatures ranging from -40 to 85°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,362 parts In-Stock

1+ parts

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7,362

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Digiode

USA . 1,685 parts In-Stock

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1,685

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 224 parts In-Stock

1+ parts

$13.135

100+ parts

-

1k+ parts

$13.639

10k+ parts

-

224

$13.135

-

$13.639

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ChromeModa Solutions

Germany . 6,236 parts In-Stock

1+ parts

$14.758

100+ parts

$12.102

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6,236

$14.758

$12.102

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IDEA Electronic Components Group

UK . 962 parts In-Stock

1+ parts

$14.758

100+ parts

$14.020

1k+ parts

$13.282

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962

$14.758

$14.020

$13.282

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AZTECH Wire

Italy . 490 parts In-Stock

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$18.140

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490

$18.140

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Advanced Electronics

New Zealand . 200 parts In-Stock

1+ parts

$18.767

100+ parts

$18.579

1k+ parts

$17.828

10k+ parts

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200

$18.767

$18.579

$17.828

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One Stop Electronics

USA . 1,045 parts In-Stock

1+ parts

$19.000

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1,045

$19.000

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Corphita

USA . 2,941 parts In-Stock

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2,941

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DigiPath Technology Company

USA . 1,524 parts In-Stock

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$13.306

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1,524

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$13.306

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Microchip USA

USA . 1,356 parts In-Stock

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1,356

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Overview

Unlock the power of precision and reliability with the TLC3548IDWRG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Analog-to-Digital Converters for a wide range of applications. With 14 bits of resolution and low linearity error, this converter ensures accurate and efficient data conversion. Experience the value and benefits of Texas Instruments' cutting-edge technology, providing customers with superior performance and peace of mind. Elevate your projects with the TLC3548IDWRG4 and see the difference quality makes.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material for easy handling and robust construction.

No. of Analog In Channels: 8

Allows for multiple input signals to be converted simultaneously, improving efficiency.

No. of Bits: 14

High resolution for accurate conversion of analog signals to digital data.

Minimum Supply Voltage: 2.7 V

Works efficiently even with low supply voltage, suitable for various power systems.

Maximum Operating Temperature: 85 °C

Can operate in high temperature environments without degradation in performance.

Sample Rate: 0.2 MHz

High sampling rate for fast and accurate conversion of input signals.

Technology: CMOS

Low power consumption and high noise immunity, ideal for various applications.

Technical Specifications

Analog-to-Digital Converters TLC3548IDWRG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

8

No. of Functions:

1

No. of Bits:

14

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary, 2's Complement Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0061 %

Sample Rate:

200 kHz

Hold Mode:

Sample

Maximum Conversion Time:

2.785 µs

Electrical Specifications

Power Supplies:

3/5,5 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

4.07 V

Nominal Supply Voltage:

5 V

Minimum Supply Voltage:

2.7 V

Maximum Supply Current:

3.6 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Form Factor

Terminal Position:

Dual

No. of Terminals:

24

Terminal Form:

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.295 in (7.5 mm)

Length:

0.606 in (15.4 mm)

Maximum Seated Height:

0.104 in (2.65 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline

Package Shape:

Package Equivalence Code:

SOP24,.4

Package Code:

SOP

Standards and Codes

JESD-30 Code:

R-PDSO-G24

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

TLC3548IDWRG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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