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TLC3548CDWR

Texas Instruments

TLC3548CDWR by Texas Instruments

TLC3548CDWR by Texas Instruments is a 14-bit ADC with 8 analog in channels, 0.0061% linearity error, and 0.2 MHz sample rate. Ideal for applications requiring precise analog-to-digital conversion in commercial temperature environments. Package style: small outline, surface mountable with dual terminal position.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,201 parts In-Stock

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3,201

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Digiode

USA . 1,759 parts In-Stock

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1,759

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Martec Srl

Italy . 118 parts In-Stock

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118

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 263 parts In-Stock

1+ parts

$13.687

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-

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263

$13.687

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Parana Technologies

USA . 1,748 parts In-Stock

1+ parts

$20.260

100+ parts

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$20.249

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1,748

$20.260

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$20.249

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DigiPath Technology Company

USA . 67 parts In-Stock

1+ parts

$22.309

100+ parts

$20.524

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67

$22.309

$20.524

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ChromeModa Solutions

Germany . 6,819 parts In-Stock

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$22.764

100+ parts

$18.666

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6,819

$22.764

$18.666

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IDEA Electronic Components Group

UK . 5 parts In-Stock

1+ parts

$22.764

100+ parts

$21.626

1k+ parts

$20.488

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5

$22.764

$21.626

$20.488

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One Stop Electronics

USA . 1,027 parts In-Stock

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$37.000

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1,027

$37.000

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Microchip USA

USA . 1,283 parts In-Stock

1+ parts

$126.890

100+ parts

$124.690

1k+ parts

$123.580

10k+ parts

$122.480

1,283

$126.890

$124.690

$123.580

$122.480

Component Stockers USA

USA . 278 parts In-Stock

1+ parts

$216.380

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278

$216.380

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Corphita

USA . 1,341 parts In-Stock

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1,341

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Overview

Unlock the power of precise analog-to-digital conversion with the TLC3548CDWR by Texas Instruments. This top-notch converter boasts unparalleled quality and reliability, courtesy of its trusted manufacturer. Ideal for a wide range of applications, this product offers customers unmatched value and performance. Say goodbye to compromise and hello to superior results with the TLC3548CDWR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable.

No. of Analog In Channels: 8

Having 8 analog input channels allows for the conversion of multiple analog signals simultaneously, making the product versatile.

No. of Bits: 14

With 14 bits resolution, this product offers high accuracy in converting analog signals to digital data.

Technology: CMOS

The CMOS technology used in this product ensures low power consumption and high noise immunity, making it efficient and reliable.

Sample and Hold/Track and Hold: SAMPLE

The sample and hold feature ensures accurate sampling of analog signals at a specific instant, improving the overall precision of the data conversion.

Technical Specifications

Analog-to-Digital Converters TLC3548CDWR attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

8

No. of Functions:

1

No. of Bits:

14

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary, 2's Complement Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0061 %

Sample Rate:

200 kHz

Hold Mode:

Sample

Maximum Conversion Time:

2.785 µs

Electrical Specifications

Power Supplies:

3/5,5 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

5 V

Nominal Supply Voltage:

5 V

Minimum Supply Voltage:

2.7 V

Maximum Supply Current:

3.6 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

24

Terminal Form:

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.295 in (7.5 mm)

Length:

0.606 in (15.4 mm)

Maximum Seated Height:

0.104 in (2.65 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline

Package Shape:

Package Equivalence Code:

SOP24,.4

Package Code:

SOP

Standards and Codes

JESD-30 Code:

R-PDSO-G24

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

TLC3548CDWR Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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