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TLC34076-135CGA

Texas Instruments

TLC34076-135CGA by Texas Instruments

TLC34076-135CGA by Texas Instruments is a display controller with 8-bit external data bus width, 135 MHz clock frequency, and CMOS technology. It operates b/w 0 to 70 °C and has a package style of grid array. Ideal for applications requiring high-speed display control in commercial-grade environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,001 parts In-Stock

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Digiode

USA . 1,171 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 637 parts In-Stock

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$9.504

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One Stop Electronics

USA . 1,575 parts In-Stock

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$13.000

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Parana Technologies

USA . 662 parts In-Stock

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$23.114

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$23.753

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662

$23.114

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ChromeModa Solutions

Germany . 5,766 parts In-Stock

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$25.971

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$21.296

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5,766

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IDEA Electronic Components Group

UK . 1,903 parts In-Stock

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$25.971

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$24.672

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$23.374

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1,903

$25.971

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$23.374

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Corohmni

South Africa . 553 parts In-Stock

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$66.963

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553

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Corphita

USA . 4,633 parts In-Stock

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DigiPath Technology Company

USA . 1,107 parts In-Stock

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$23.415

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Overview

Enhance your display control with the TLC34076-135CGA by Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments offers a wide range of innovative solutions for display controllers. The TLC34076-135CGA is perfect for applications requiring high performance and precision. With its advanced technology and commercial-grade temperature grade, this product ensures optimal functionality and long-lasting durability. Experience seamless operation and superior results with the TLC34076-135CGA from Texas Instruments.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material combination provides durability and resistance to high temperatures, making the product suitable for a variety of environments.

Maximum Supply Voltage: 5.25 V

The higher maximum supply voltage allows for flexibility in power supply options and can handle fluctuations without risk of damage.

Address Bus Width: 4

A wider address bus width allows for efficient communication between components, enhancing the performance of the display controller.

Package Shape: SQUARE

The square shape of the package provides a compact and space-saving design, making it easier to integrate into different systems.

No. of Terminals: 84

With a higher number of terminals, the product can support more connections and functions, increasing its versatility and compatibility.

Package Style (Meter): GRID ARRAY

The grid array package style offers better thermal dissipation and electrical performance, making it a reliable choice for demanding applications.

Minimum Supply Voltage: 4.75 V

The low minimum supply voltage ensures that the product can operate efficiently even with lower power sources, providing flexibility in design.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature range allows the display controller to function reliably in harsh conditions without overheating.

Minimum Operating Temperature: 0 °C

With a low minimum operating temperature, the product can operate in cold environments without performance issues, increasing its usability.

Terminal Position: PERPENDICULAR

The perpendicular terminal position allows for easier connections and maintenance, improving the overall user experience.

Maximum Seated Height: 5.21 mm

The compact maximum seated height ensures that the display controller can fit into slim devices or systems without added bulk.

Width: 32 mm

The moderate width of the product makes it versatile for integration into different products or systems, accommodating various design requirements.

External Data Bus Width: 8

A wider external data bus width allows for faster data transfer rates and improved performance in handling high-resolution displays or graphics.

Maximum Clock Frequency: 135 MHz

The high maximum clock frequency enables smooth and fast operation, supporting real-time display updates and smooth animations.

Length: 32 mm

The length of 32 mm provides a balanced aspect ratio, making the product suitable for compact design requirements without compromising functionality.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures reliable operation in standard operating conditions, making it suitable for most commercial applications.

Peripheral IC Type: DISPLAY CONTROLLER, PALETTE DAC

The inclusion of a display controller and palette DAC enhances the product's capabilities in rendering high-quality graphics and color reproduction.

Technology: CMOS

The CMOS technology used in the product offers low power consumption and high noise immunity, contributing to energy efficiency and stability.

Terminal Form: PIN/PEG

The PIN/PEG terminal form provides secure and reliable connections, ensuring stable performance and ease of installation.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V provides a standard power requirement, ensuring compatibility with a wide range of power sources.

Terminal Pitch: 2.54 mm

The terminal pitch of 2.54 mm offers sufficient spacing for connections, facilitating easy installation and maintenance of the display controller.

Technical Specifications

Display Controllers TLC34076-135CGA attributes and parameters. Explore more Display Controllers devices from Texas Instruments

Specs

Address Bus Width:

4

Maximum Clock Frequency:

135 MHz

External Data Bus Width:

8

JESD-30 Code:

S-CPGA-P84

Length:

32 mm

No. of Terminals:

84

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

PGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Qualification:

Not Qualified

Maximum Seated Height:

5.21 mm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

PERPENDICULAR

Width:

32 mm

Peripheral IC Type:

Trade Compliance

TLC34076-135CGA Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.3

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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