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TLC34075-66AFNR

Texas Instruments

TLC34075-66AFNR by Texas Instruments

TLC34075-66AFNR by Texas Instruments is a display controller with 1024x768 pixels, 8-bit data bus, and 66 MHz clock frequency. It operates b/w 0 to 70°C and has a supply voltage range of 4.75V to 5.25V. Ideal for commercial applications requiring high-resolution graphics processing.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,214 parts In-Stock

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2,214

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Digiode

USA . 1,671 parts In-Stock

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1,671

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 534 parts In-Stock

1+ parts

$8.456

100+ parts

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534

$8.456

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One Stop Electronics

USA . 343 parts In-Stock

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$22.000

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343

$22.000

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Parana Technologies

USA . 633 parts In-Stock

1+ parts

$26.597

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$27.163

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633

$26.597

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$27.163

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IDEA Electronic Components Group

UK . 1,304 parts In-Stock

1+ parts

$29.884

100+ parts

$28.390

1k+ parts

$26.896

10k+ parts

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1,304

$29.884

$28.390

$26.896

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ChromeModa Solutions

Germany . 768 parts In-Stock

1+ parts

$29.884

100+ parts

$24.505

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768

$29.884

$24.505

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Corohmni

South Africa . 1,130 parts In-Stock

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$39.061

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1,130

$39.061

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DigiPath Technology Company

USA . 1,362 parts In-Stock

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$26.943

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1,362

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$26.943

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Corphita

USA . 873 parts In-Stock

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873

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Overview

Elevate your display experience with the TLC34075-66AFNR by Texas Instruments, a cutting-edge display controller designed to deliver top-notch performance and reliability. Crafted by the renowned manufacturer Texas Instruments, this chip carrier package offers unparalleled quality and precision for a wide range of applications. With a maximum clock frequency of 66 MHz and a display configuration of 1024 x 768 pixels, this innovative product ensures seamless operation and stunning visuals. Trust Texas Instruments to provide you with the best technology in display controllers, delivering value and benefits that will exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight and durable, ideal for portable devices.

Surface Mount: YES

Surface mount design allows for easy integration onto circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 5.25 V

Can operate at relatively high supply voltages, providing flexibility in power management.

Address Bus Width: 4

The 4-bit address bus width allows for efficient communication with other components in the system.

Package Shape: SQUARE

Square package shape helps in efficient placement and utilization of space on the circuit board.

No. of Terminals: 84

With a larger number of terminals, this display controller can support more connections and features.

Package Style (Meter): CHIP CARRIER

Chip carrier style offers good protection to the components and allows for compact design.

Minimum Supply Voltage: 4.75 V

Even at low supply voltage, this controller can operate efficiently, ensuring stable performance.

Maximum Operating Temperature: 70 °C

High maximum operating temperature range makes it suitable for various environmental conditions.

Minimum Operating Temperature: 0 °C

Can operate at low temperatures, ensuring functionality in colder environments.

Terminal Position: QUAD

Quad terminal position offers better stability and connectivity when soldered onto the board.

Display Config: 1024 X 768 PIXELS

Supports high-resolution displays, providing sharp and clear images on screens.

Maximum Seated Height: 4.57 mm

Low seated height allows for slim and compact designs, suitable for thin devices.

Width: 29.3116 mm

Compact width enables easy placement in tight spaces, suitable for smaller electronic devices.

External Data Bus Width: 8

The 8-bit data bus width allows for fast and efficient data transfer between components.

Maximum Clock Frequency: 66 MHz

High clock frequency enables fast processing and response time, crucial for smooth display performance.

Length: 29.3116 mm

Compact length ensures space-saving design and easy integration into electronic devices.

Temperature Grade: COMMERCIAL

Commercial-grade temperature range ensures reliable performance in standard operating conditions.

Peripheral IC Type: DISPLAY CONTROLLER, PALETTE DAC

Includes additional peripheral functionality for enhanced display control and color management.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ideal for efficient operation.

Terminal Form: J BEND

J bend terminal form provides secure mechanical connections and ease of soldering onto the board.

Nominal Supply Voltage: 5 V

Stable nominal supply voltage ensures consistent performance and compatibility with standard power sources.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch allows for precise and reliable connections between the controller and other components.

Technical Specifications

Display Controllers TLC34075-66AFNR attributes and parameters. Explore more Display Controllers devices from Texas Instruments

Specs

Address Bus Width:

4

Maximum Clock Frequency:

66 MHz

Display Config:

1024 X 768 PIXELS

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J84

Length:

29.3116 mm

No. of Terminals:

84

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

29.3116 mm

Peripheral IC Type:

Trade Compliance

TLC34075-66AFNR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.3

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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