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TLC1543IFNG3

Texas Instruments

TLC1543IFNG3 by Texas Instruments

TLC1543IFNG3 by Texas Instruments is a 10-bit ADC with 11 analog in channels, 0.0977% EL, and 5V power supply. Ideal for industrial applications, it offers a sample rate of 0.038 MHz and operates b/w -40 to 85°C. With a compact chip carrier package style, it suits space-constrained designs requiring precise analog-to-digital conversion.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,081 parts In-Stock

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Digiode

USA . 808 parts In-Stock

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808

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Distributors (Availability)

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One Stop Electronics

USA . 1,412 parts In-Stock

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$8.000

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1,412

$8.000

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AZTECH Wire

Italy . 658 parts In-Stock

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$13.184

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658

$13.184

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Parana Technologies

USA . 1,302 parts In-Stock

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$13.468

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$13.982

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1,302

$13.468

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$13.982

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ChromeModa Solutions

Germany . 3,863 parts In-Stock

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$15.133

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$12.409

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3,863

$15.133

$12.409

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IDEA Electronic Components Group

UK . 59 parts In-Stock

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$15.133

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$14.376

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$13.620

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59

$15.133

$14.376

$13.620

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Advanced Electronics

New Zealand . 700 parts In-Stock

1+ parts

$27.063

100+ parts

$24.627

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$22.192

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700

$27.063

$24.627

$22.192

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Component Stockers USA

USA . 991 parts In-Stock

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$52.210

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991

$52.210

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Corphita

USA . 2,872 parts In-Stock

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Microchip USA

USA . 2,336 parts In-Stock

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DigiPath Technology Company

USA . 2,038 parts In-Stock

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$13.644

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2,038

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Overview

Unlock the power of precision with the TLC1543IFNG3 Analog-to-Digital Converter by Texas Instruments. Renowned for their superior quality and cutting-edge technology, Texas Instruments delivers excellence in every product. Ideal for a wide range of applications, this ADC boasts 10 bits of resolution and 11 analog input channels, providing accurate and reliable data conversion. With a low linearity error of 0.0977% and a fast conversion time of 21 us, this chip carrier package offers exceptional performance in industrial settings. Experience the value and benefits of Texas Instruments technology with the TLC1543IFNG3 - your solution for high-quality analog-to-digital conversion.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package durable and resistant to external factors, ensuring long-term reliability.

No. of Analog In Channels: 11

Having 11 analog input channels allows for increased flexibility and versatility in converting multiple analog signals simultaneously.

Surface Mount: YES

Being surface mountable makes installation and integration of the converter easier in various electronic projects and PCB designs.

No. of Bits: 10

10-bit resolution provides relatively high accuracy in converting analog signals to digital data, suitable for many precision applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this converter can withstand harsh environmental conditions without compromising performance.

Sample Rate: 0.038 MHz

The high sample rate of 0.038 MHz allows for fast and efficient analog-to-digital conversions, ideal for real-time data processing.

Technology: CMOS

CMOS technology ensures low power consumption and compatibility with a wide range of digital systems, making the product efficient and versatile.

Output Format: SERIAL

Serial output format enables easy data transmission and integration with various digital devices, enhancing the connectivity and usability of the converter.

Technical Specifications

Analog-to-Digital Converters TLC1543IFNG3 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

11

No. of Functions:

1

No. of Bits:

10

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0977 %

Sample Rate:

38 kHz

Hold Mode:

Sample

Maximum Conversion Time:

21 µs

Electrical Specifications

Power Supplies:

5 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

5.5 V

Nominal Supply Voltage:

5 V

Minimum Supply Voltage:

4.5 V

Maximum Supply Current:

2.5 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Form Factor

Terminal Position:

Quad

No. of Terminals:

20

Terminal Form:

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.353 in (8.965 mm)

Length:

0.353 in (8.965 mm)

Maximum Seated Height:

0.18 in (4.57 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier

Package Shape:

Package Equivalence Code:

LDCC20,.4SQ

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-J20

Qualified:

No

JESD-609 Code:

e3

Trade Compliance

TLC1543IFNG3 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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