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TLC1205AIN3

Texas Instruments

TLC1205AIN3 by Texas Instruments

TLC1205AIN3 by Texas Instruments is a 13-bit A/D converter with industrial temperature grade (-40 to 85°C). It features offset binary output code, CMOS technology, and comes in a rectangular plastic/epoxy package. Ideal for applications requiring precise analog-to-digital conversion in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,657 parts In-Stock

1+ parts

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5,657

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Digiode

USA . 1,029 parts In-Stock

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1,029

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 794 parts In-Stock

1+ parts

$2.000

100+ parts

-

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794

$2.000

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Parana Technologies

USA . 1,096 parts In-Stock

1+ parts

$13.976

100+ parts

-

1k+ parts

$14.448

10k+ parts

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1,096

$13.976

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$14.448

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DigiPath Technology Company

USA . 974 parts In-Stock

1+ parts

$15.389

100+ parts

$14.158

1k+ parts

-

10k+ parts

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974

$15.389

$14.158

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ChromeModa Solutions

Germany . 2,200 parts In-Stock

1+ parts

$15.703

100+ parts

$12.876

1k+ parts

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10k+ parts

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2,200

$15.703

$12.876

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IDEA Electronic Components Group

UK . 1,893 parts In-Stock

1+ parts

$15.703

100+ parts

$14.918

1k+ parts

$14.133

10k+ parts

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1,893

$15.703

$14.918

$14.133

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AZTECH Wire

Italy . 851 parts In-Stock

1+ parts

$19.695

100+ parts

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851

$19.695

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Corphita

USA . 2,697 parts In-Stock

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2,697

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Overview

Discover the ultimate solution for high-quality analog-to-digital conversion with the TLC1205AIN3 by Texas Instruments. As a leader in manufacturing excellence, Texas Instruments delivers top-notch performance and reliability. Ideal for a wide range of applications, this A/D converter offers unmatched precision and efficiency. Experience the value of seamless integration, improved accuracy, and superior results with the TLC1205AIN3. Unlock new possibilities and elevate your projects with this cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material, suitable for a variety of applications.

Package Shape: RECTANGULAR

Compact shape for efficient use of space in circuit board designs.

No. of Bits: 13

High resolution for accurate conversion of analog signals.

No. of Terminals: 24

Sufficient number of terminals for multiple connection options.

Package Style (Meter): IN-LINE

Easy to integrate into existing systems without taking up too much space.

Maximum Operating Temperature: 85 °C

Can operate at high temperatures without compromising performance.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold conditions without issues.

Terminal Position: DUAL

Allows for versatile mounting options in circuit board layouts.

Temperature Grade: INDUSTRIAL

Designed to withstand industrial environments and conditions.

Technology: CMOS

Low power consumption and high noise immunity for reliable operation.

Terminal Form: THROUGH-HOLE

Easy to solder and secure connections for stable performance.

Converter Type: A/D CONVERTER

Specifically designed for converting analog signals to digital with high accuracy.

Output Bit Code: OFFSET BINARY

Encoding method that provides accurate representation of analog signal levels.

Terminal Pitch: 2.54 mm

Standard spacing for easy integration with common electronic components.

Technical Specifications

Analog-to-Digital Converters TLC1205AIN3 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

Converter Type:

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

13

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Offset Binary

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Dual

No. of Terminals:

24

Terminal Form:

Terminal Pitch:

0.1 in (2.54 mm)

Surface Mount:

No

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

In-Line

Package Shape:

Package Equivalence Code:

DIP24,.6

Package Code:

DIP

Standards and Codes

JESD-30 Code:

R-PDIP-T24

Trade Compliance

TLC1205AIN3 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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