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TLC1225AMN3

Texas Instruments

TLC1225AMN3 by Texas Instruments

TLC1225AMN3 by Texas Instruments is a 13-bit Analog-to-Digital Converter (A/D) with MILITARY temperature grade, operating from -55 to 125°C. It features a RECTANGULAR PLASTIC/EPOXY package style with 28 terminals in IN-LINE configuration. Ideal for applications requiring high-precision binary output conversion in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,859 parts In-Stock

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6,859

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Digiode

USA . 4,971 parts In-Stock

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4,971

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 482 parts In-Stock

1+ parts

$5.000

100+ parts

-

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482

$5.000

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AZTECH Wire

Italy . 796 parts In-Stock

1+ parts

$12.435

100+ parts

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796

$12.435

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Parana Technologies

USA . 1,781 parts In-Stock

1+ parts

$23.225

100+ parts

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1k+ parts

$23.856

10k+ parts

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1,781

$23.225

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$23.856

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DigiPath Technology Company

USA . 2,160 parts In-Stock

1+ parts

$25.574

100+ parts

$23.528

1k+ parts

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10k+ parts

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2,160

$25.574

$23.528

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ChromeModa Solutions

Germany . 453 parts In-Stock

1+ parts

$26.096

100+ parts

$21.399

1k+ parts

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10k+ parts

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453

$26.096

$21.399

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IDEA Electronic Components Group

UK . 387 parts In-Stock

1+ parts

$26.096

100+ parts

$24.791

1k+ parts

$23.486

10k+ parts

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387

$26.096

$24.791

$23.486

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Corphita

USA . 4,562 parts In-Stock

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4,562

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Overview

Upgrade your analog-to-digital conversion experience with the TLC1225AMN3 by Texas Instruments. Known for their top-quality components, Texas Instruments delivers unparalleled performance and reliability in their products. Ideal for military-grade applications, this 13-bit A/D converter offers precision and accuracy in a compact rectangular package. Experience the value and benefits of Texas Instrument's cutting-edge technology with the TLC1225AMN3, providing customers with a seamless and efficient solution for all their conversion needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the internal components of the converter, ensuring a longer lifespan.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into existing circuit designs and layouts.

No. of Bits: 13

High number of bits provides a higher resolution and accuracy for converting analog signals to digital, making it suitable for applications where precision is important.

No. of Terminals: 28

Larger number of terminals offer more connectivity options and flexibility in connecting the converter to other components in the circuit.

Package Style (Meter): IN-LINE

In-line package style allows for easy installation and placement in circuit boards, saving space and simplifying design layouts.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures the converter can withstand harsh environmental conditions and operate reliably in a wide range of temperature settings.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature allows the converter to function in cold environments without any performance issues.

Terminal Position: DUAL

Dual terminal position provides redundancy and improved signal integrity, reducing the risk of connectivity issues and signal interference.

Temperature Grade: MILITARY

Military-grade temperature rating ensures the converter meets stringent quality and reliability standards, making it suitable for demanding military applications.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and compatibility with a wide range of digital devices, making it an efficient choice for digital conversion applications.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide a secure and stable connection to the circuit board, ensuring reliable performance under various conditions.

Converter Type: A/D CONVERTER

Analog-to-digital converter type facilitates the conversion of analog signals to digital format, enabling the processing and manipulation of data in digital systems.

Output Bit Code: BINARY

Binary output bit code simplifies data processing and compatibility with digital systems, making it easy to integrate the converter into existing setups.

Terminal Pitch: 2.54 mm

Standard terminal pitch allows for easy connection to other components and circuit boards, ensuring compatibility and ease of integration in various electronic devices.

Technical Specifications

Analog-to-Digital Converters TLC1225AMN3 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

Converter Type:

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

13

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Operating Conditions

Minimum Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Form Factor

Terminal Position:

Dual

No. of Terminals:

28

Terminal Form:

Terminal Pitch:

0.1 in (2.54 mm)

Surface Mount:

No

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

In-Line

Package Shape:

Package Equivalence Code:

DIP28,.6

Package Code:

DIP

Standards and Codes

JESD-30 Code:

R-PDIP-T28

Trade Compliance

TLC1225AMN3 Converters trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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