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TLC1225AMJ

Texas Instruments

TLC1225AMJ by Texas Instruments

TLC1225AMJ by Texas Instruments is a 12-bit ADC with 0.0488% linearity error, MILITARY grade, and 10us conversion time. Ideal for military applications requiring precise analog-to-digital conversion in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,619 parts In-Stock

1+ parts

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7,619

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Digiode

USA . 2,745 parts In-Stock

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2,745

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 781 parts In-Stock

1+ parts

$11.648

100+ parts

-

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781

$11.648

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Parana Technologies

USA . 1,268 parts In-Stock

1+ parts

$15.770

100+ parts

-

1k+ parts

$16.131

10k+ parts

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1,268

$15.770

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$16.131

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ChromeModa Solutions

Germany . 5,591 parts In-Stock

1+ parts

$17.719

100+ parts

$14.530

1k+ parts

-

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5,591

$17.719

$14.530

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IDEA Electronic Components Group

UK . 1,356 parts In-Stock

1+ parts

$17.719

100+ parts

$16.833

1k+ parts

$15.947

10k+ parts

-

1,356

$17.719

$16.833

$15.947

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One Stop Electronics

USA . 874 parts In-Stock

1+ parts

$30.000

100+ parts

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874

$30.000

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Corphita

USA . 4,283 parts In-Stock

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4,283

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DigiPath Technology Company

USA . 1,058 parts In-Stock

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$15.975

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1,058

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$15.975

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Overview

Experience unparalleled precision and reliability with the TLC1225AMJ Analog-to-Digital Converter by Texas Instruments. Crafted with top-notch ceramic and glass-sealed materials, this 12-bit converter offers a maximum linearity error of just 0.0488%. Ideal for military-grade applications, this ADC ensures accurate data conversion with a fast 10us maximum conversion time. Trust in Texas Instruments' reputation for excellence and transform your analog signals into digital data with ease. Elevate your projects with the TLC1225AMJ and unlock endless possibilities for innovation.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic and glass-sealed package body material ensures durability and protection for the internal components of the analog-to-digital converter.

No. of Bits: 12

Having 12 bits allows for higher resolution and more accurate conversion of analog signals into digital data.

Maximum Linearity Error (EL): 0.0488 %

The low maximum linearity error ensures that the converted digital output closely matches the input analog signal, leading to accurate data acquisition.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this ADC is suitable for use in a wide range of environments and applications.

Technology: CMOS

The CMOS technology used in this ADC provides low power consumption and high speed operation, making it energy-efficient and reliable.

Technical Specifications

Analog-to-Digital Converters TLC1225AMJ attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

12

Sub-Category:

Analog to Digital Converters

Output Bit Code:

2's Complement Binary

Output Format:

Parallel, Word

Maximum Linearity Error (EL):

0.0488 %

Hold Mode:

Sample

Maximum Conversion Time:

10 µs

Electrical Specifications

Minimum Analog Input Voltage:

-5.55 V

Maximum Analog Input Voltage:

6.05 V

Nominal Supply Voltage:

5 V

Nominal Negative Supply Voltage:

-5 V

Operating Conditions

Minimum Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Form Factor

Terminal Position:

Dual

No. of Terminals:

28

Terminal Form:

Terminal Pitch:

0.1 in (2.54 mm)

Surface Mount:

No

Width:

0.6 in (15.24 mm)

Maximum Seated Height:

0.224 in (5.7 mm)

Packaging

Package Body Material:

Ceramic, Glass-Sealed

Package Style:

In-Line

Package Shape:

Package Equivalence Code:

DIP28,.6

Package Code:

DIP

Standards and Codes

JESD-30 Code:

R-GDIP-T28

Qualified:

No

Trade Compliance

TLC1225AMJ Converters trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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