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TLC1225AIN

Texas Instruments

TLC1225AIN by Texas Instruments

TLC1225AIN by Texas Instruments is a 12-bit ADC with 0.0488% EL, 10us conversion time, and 6.05V max analog input voltage. Ideal for industrial applications requiring precise analog-to-digital conversion in a compact IN-LINE package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,564 parts In-Stock

1+ parts

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5,564

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Digiode

USA . 3,359 parts In-Stock

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3,359

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 895 parts In-Stock

1+ parts

$8.145

100+ parts

-

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895

$8.145

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Parana Technologies

USA . 786 parts In-Stock

1+ parts

$8.239

100+ parts

-

1k+ parts

$8.853

10k+ parts

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786

$8.239

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$8.853

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DigiPath Technology Company

USA . 1,238 parts In-Stock

1+ parts

$9.072

100+ parts

-

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1,238

$9.072

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ChromeModa Solutions

Germany . 1,540 parts In-Stock

1+ parts

$9.257

100+ parts

$7.591

1k+ parts

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1,540

$9.257

$7.591

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IDEA Electronic Components Group

UK . 1,521 parts In-Stock

1+ parts

$9.257

100+ parts

$8.794

1k+ parts

$8.331

10k+ parts

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1,521

$9.257

$8.794

$8.331

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One Stop Electronics

USA . 763 parts In-Stock

1+ parts

$17.000

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763

$17.000

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Corphita

USA . 4,193 parts In-Stock

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4,193

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Overview

Elevate your analog-to-digital conversion game with the TLC1225AIN by Texas Instruments. Known for their superior quality and precision engineering, Texas Instruments delivers yet again with this innovative ADC. Perfect for a wide range of applications, this converter offers fast conversion times and low linearity error, ensuring accurate results every time. With a compact package design and industrial-grade temperature range, the TLC1225AIN is a reliable and versatile solution for your analog-to-digital conversion needs. Trust in Texas Instruments to provide top-notch performance and value with the TLC1225AIN.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Offers good protection for internal components and helps to reduce overall weight of the product.

No. of Bits: 12

Provides high resolution for accurate conversion of analog signals into digital data.

Maximum Linearity Error (EL): 0.0488%

Ensures precise and reliable conversion of analog signals with minimal errors.

Maximum Operating Temperature: 85 °C

Suitable for use in industrial applications where higher temperatures may be encountered.

Technology: CMOS

CMOS technology offers low power consumption, making the product energy efficient.

Technical Specifications

Analog-to-Digital Converters TLC1225AIN attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

12

Sub-Category:

Analog to Digital Converters

Output Bit Code:

2's Complement Binary

Output Format:

Parallel, Word

Maximum Linearity Error (EL):

0.0488 %

Hold Mode:

Sample

Maximum Conversion Time:

10 µs

Electrical Specifications

Minimum Analog Input Voltage:

-5.55 V

Maximum Analog Input Voltage:

6.05 V

Nominal Supply Voltage:

5 V

Nominal Negative Supply Voltage:

-5 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Dual

No. of Terminals:

28

Terminal Form:

Terminal Pitch:

0.1 in (2.54 mm)

Surface Mount:

No

Width:

0.6 in (15.24 mm)

Length:

1.43 in (36.32 mm)

Maximum Seated Height:

0.2 in (5.08 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

In-Line

Package Shape:

Package Equivalence Code:

DIP28,.6

Package Code:

DIP

Standards and Codes

JESD-30 Code:

R-PDIP-T28

Qualified:

No

Trade Compliance

TLC1225AIN Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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